• Korean Journal of Materials Research
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• v.16 no.9
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• pp.592-597
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• 2006

A deoxidized low-phosphorous (DLP) copper was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two copper sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles (${\varepsilon}{\sim}6.3$). TEM observation revealed that ultrafine grains were developed after the 4th cycle, and their size decreased at higher cycles. Tensile strength of the copper increased with the equivalent strain, and it reached 547 MPa which was 3 times higher than that of the initial material. It is concluded that the ARB process is an effective method for high strengthening of the DLP copper.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.217-223
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• 2005

Thermal, electrical and mechanical properties of high purity niobium and tantalum refractory rare metals were investigated tn evaluate the physical purity. Higher purity niobium and tantalum metals showed lower hardness due to smaller solution hardening effect. Temperature dependence of electrical resistivity showed a typical metallic behavior. Remarkable decrease in electrical resistivity was observed for a high purity specimen at low temperature. However, thermal conductivity increased for a high purity specimen, and abrupt increase in thermal conductivity was observed at very low temperature, indicating typical temperature dependence of thermal conductivity for high purity metals. It can be known that reduction of electron-phonon scattering leads to increase in thermal conductivity of high purity niobium and tantalum metals at low temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2002.02a
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• pp.204-204
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.39.2-39
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.43.1-43
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• 1998

• Progress in Superconductivity and Cryogenics
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• v.26 no.1
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• pp.20-24
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• 2024

Over the past four years, as the COVID-19 pandemic has struck the world, cold chain of COVID-19 vaccination has become a hot topic. In order to overcome the pandemic situation, it is necessary to establish a cold chain that maintains a low-temperature environment below approximately 203K (-70℃), which is the appropriate storage temperature for vaccines, from vaccine suppliers to local hospitals. Usually, cryocoolers are used to maintain low temperatures, but it is difficult for small-scale local distribution to have cryocooler due to budget and power supply issues. Accordingly, in this paper, a cryogenic TSU (Thermal storage unit) system for vaccination cold chain is designed that can maintain low temperatures below -70℃C for a long time without using a cryocooler. The performance of the TSU system according to the energy storage material for using as TSU is experimentally evaluated. In the experiments, four types of cold storage materials were used: 20% DMSO aqueous solution, 30% DMSO aqueous solution, paraffin wax, and tofu. Prior to the experiment, the specific heat of the cold storage materials at low temperature were measured. Through this, the thermal diffusivity of the materials was calculated, and paraffin wax had the lowest value. As a result of the TSU system's low-temperature maintenance test, paraffin wax showed the best low-temperature maintenance performance. And it recorded a low-temperature maintenance time that was about 24% longer than other materials. As a result of analyzing the temperature trend by location within the TSU system, it was observed that heat intrusion from the outside was not well transmitted to the low temperature area due to the low thermal conductivity of paraffin wax. Therefore, in the TSU system for vaccine storage, it was experimentally verified that the lower the thermal diffusivity of the cold storage material, the better low temperature maintenance performance.

• Corrosion Science and Technology
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• v.4 no.2
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• pp.39-44
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• 2005

The purpose of this work is to understand the effect of Mo addition on SSC susceptibility of high strength low alloy steels in terms of microstructure and corrosion property. Materials used in this study are high strength low alloy (HSLA) steels with carbon content of 0.04wt% and Mo content varying from 0.1 to 0.3wt%. The corrosion property of steels was evaluated by immersion test in NACE-TM01-77 solution A and by analyzing the growth behavior of surface corrosion products. SSC resistance of steels was evaluated using constant load test. Electrochemical test was performed to investigate initial corrosion rate. Addition of Mo increased corrosion rate of steels by enhancing the porosity of surface corrosion products. However, corrosion rate was not directly related to SSC susceptibility of steels.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.31-34
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• 2015

Microstructure and tensile property in the weld heat-affected zone (HAZ) of austenitic Fe-Mn-Al-C low density steels were investigated through transmission electron microscopy analysis and tensile tests. The HAZ samples were prepared using Gleeble simulation with high heat input welding condition of 300 kJ/cm, and the HAZ peak temperature of $1200^{\circ}C$ was determined from differential scanning calorimetry (DSC) test. The strain- stress responses of base steels showed that the addition of V improved the tensile and yield strength by grain refinement and precipitation strengthening. Tensile strength and elongation decreased in the weld HAZ as compared to the base steel, due to grain growth, while V-added steel had a higher HAZ strength as compared than V-free steel.

• Journal of the Korea Furniture Society
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• v.22 no.1
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• pp.54-62
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• 2011

The metalized wood composites with natural grain of imported Juglans nigra, which was impregnated with low melting alloy were manufactured and evaluated in this study. And the proper manufacturing conditions was also investigated in this study. The low melting alloy with bismuth (Bi) and tin (Sn) which are harmless to humans, was applied to this new composites. The composites showed not only no defects of discoloration, delamination, swelling, and cracking, because of high dimensional stability and low thickness swelling, but also much improved performance such as high bending strength, high hardness, abrasion resistance, high thermal conductivity as floor materials. This study also suggested the proper impregnating condition, such as 10 minutes of the preliminary vacuum time, $186^{\circ}C$ of the heating temperature and 10 minutes of the maintaining pressure time at the pressure of $30kgf/cm^2$. This metalized wood composites showed 7 times higher density than control, great increase in bending strength from $131.8N/mm^2$ to $192.3N/mm^2$, and great increase in hardness from $18.2N/mm^2$ to $90.4N/mm^2$. The composites demonstrated not only high emissivity of 91%, high shilding effectiveness of 92.59∼99.99%, high fire resistance but also great decrease in abrasion depth, water absorption and thickness swelling.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.