• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.322-322
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• 2008

Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.192-197
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• 2004

The anisotropy in coefficient of thermal expansion (CTE) between the in-plane and out-of-plane of 3-dimensional thick composite structures induces residual stresses and the large void content due to insufficient compaction of fabric composites, which results in low interlaminar strengths. In order to reduce the through thickness CTE and the void content, in this work, carbon fabric phenolic laminates were compacted by pressure generated by autoclave and a compressive jig, from which the through-thickness CTEs and the void contents were measured. From the measurement, it was found that the through-thickness CTE and the void content had different characteristics from ordinary composites due to gas produced during the cure reaction of phenolic resin.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.394-401
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• 2004

In this study the mechanical behaviors of fiber metal laminates(FMLs) such as ARALL, GLARE and CARE which are recently developed as new structural materials and known to have excellent fatigue resistant characteristics while with relatively low densities compared to the conventional aluminum materials, are considered through the classical lamination theory. The mechanical properties such as elastic moduli, thermal expansion coefficients and hygro-thermally induced residual stresses in the fiber metal laminates are obtained and compared each other. Also, carpet plots of effective elastic moduli, Poisson's ratio and the thermal expansion coefficient for GLARE FML are plotted.

• Proceedings of the Korean Ceranic Society Conference
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• 2000.04a
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• pp.47.2-47.2
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• 2000

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.3
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• pp.145-152
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• 2001

Low Rayleigh number thermal convection in a fluid layer confined between two-infinite horizontal walls kept at spatially sinusoidal temperature distributions, T_L=T_m+\Delta T\sin \kappax,\;T_U=T_m+\Delta T\sin(\kappax-\beta)$, is theoretically investigated by a regular perturbation expansion method. For small wave numbers, an upright cell is formed between the two walls at $\beta$=0. The cell is tilted, as the phase difference increases, and a flow with tow counter-rotating eddies occurs at $\beta=\pi$. when the wave number is large, isolated eddies are formed near the lower and upper walls, for all the phase differences. There exists a wave number at which maximum heat transfer rate at the walls occurs, at each of the phase differences. And the wave number increases with increase of the phase difference. for a fixed wave number, the heat transfer rate decrease with increase of the phase difference.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.83-87
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• 1999

The fabrication process and thermal properties of 50~71vol% SiCp/Al metal matrix composites (MMCs) were investigated. The 50~71vol% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 118~170W/mK and coefficient of thermal expansion (CTE) were 9.5~$6.5{\times}10^{-6}/K$. Specially, the thermal conductivity and CTE of 71vol%SiCp/Al MMCs were 115~156W/mK and 6~$7{\times}10^{-6}/K$. respectively, which showed a improved themal properties than the conventional electronic packaging materials such as ceramics and metals.

• Journal of Ocean Engineering and Technology
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• v.10 no.2
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• pp.106-119
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• 1996

The ceramic has various high mechanical properties such as heat, abrasion, corrosion resistance and high temperature strength compared with metal. It also has low speciffic weight, low thermal expansibillity, low thermal conductivity. However, it could not be used as structural material since it is brittle and difficult for the machining. Therefore, there have been many researches to attempt to join ceramic with metal which is full of ductillity in order to compensate the weakness of ceramic.The problem is that residual stress develops around the joint area while the ceramic/metal joint material is cooled from high joining temperature to room temperature due to remarkable difference of thermal expansion coefficients between ceramic and metal. Especially, the residual stress at both edges of the specimen reduces the strngth of joint to a large amount by forming a singular stress field. In this study, two dimensional finite element method is attempted for the thermal elastic analysis. The joint residual stress of ceramic/metal developed in the cooling process is investigated and the change of joint residual stress resulted from the repetitive heat cycle is also examined. In addition, it is attempted to clarify the joint stress distribution of the case of tensile load and of the case of superposition of residual stress and actual loading stress.

• Journal of the Korean Ceramic Society
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• v.18 no.1
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• pp.27-34
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• 1981

The phase separation of low-alkali borosilicate glass with the composition of $6.25Na_2O$.$18.75B_2O_3$.$75.00SiO_2$(mole%) substituting $Li_2O$ for $Na_2O$ was studied. The phase separation in the temperature range of transformation was examined with various heating temperatures and soaking times. Durability to water, thermal expansion and specific density of the specimen were investigated and the microstructure of the separated phase was also observed by transmission electron micrograph techniques. The maximum alkali extraction result with the best phase separation effect was obtained when $Na_2O$ of the base glass was replaced with $1.88Li_2O$ (mole %) and electron micrograph of carbon film replica of $1.88Li_2O$$4.37Na_2O$.$18.75B_2O_3$.$75.00SiO_2$ (mole %) glass showed that the glass consisted of homogeneous two phases. The minimum specific density was shown with the specimen treated at 57$0^{\circ}C$ and it was also shown that the longer the treating time the lower the specific density. The apparent activation energies of approximately 45 kcal/mole by the alkali extraction and 43kcal/mole by the thermal expansion method were derived from the Arrhenius plots, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.151-157
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• 2023

Integrating dielectric materials into LTCC is a convenient method to increase the integration density in electronic circuits. To enable co-firing of the high-k and low-k dielectric LTCC materials in a multi-material hetero-laminate, the shrinkage characteristics of both materials should be similar. Moreover, thermal expansion mismatch between materials during co-firing should be minimized. The alternating stacking of an LTCC with silica filler and that with calcium-zirconate filler was observed to examine the use of the same glass in different LTCCs to minimize the difference in shrinkage and thermal expansion coefficient. For the LTCC of silica filler with a low dielectric constant and that of calcium zirconate filler with a high dielectric constant, the amount of shrinkage was examined through a thermomechanical analysis, and the predicted appropriate fraction of each filler was applied to green sheets by tape casting. The green sheets of different fillers were alternatingly laminated to the thickness of 500 ㎛. As a result of examining the junction, it was observed through SEM that a complete bonding was achieved by constrained sintering in the structure of 'calcium zirconate 50 vol%-silica 30 vol%-calcium zirconate 50 vol%'.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.89-90
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• 2000

A new technology realizing interconnection between Plastic Film LCDs panel and a driving circuit was developed under the processing condition of low temperature and pressure with ACFs developed for Plastic Film LCDs. The conduction failure of interconnection of the two resulted from elasticity, low thermal resistance and high thermal expansion of plastic substrates. Conductive particles with elasticity similar to the plastic substrate did not damaged a ITO electrode on plastic substrates, and low temperature and pressure process also did not deform the surface of plastic substrates. As a result highly reliable interconnection with minimum contact resistance was accomplished.