• 제목/요약/키워드: low temperature plasma process

검색결과 252건 처리시간 0.027초

Preparation of Novel Magnesium Precursors and MgO Thin Films Growth by Atomic Layer Deposition (ALD)

  • Kim, Hyo-Suk;park, Bo Keun;Kim, Chang Gyoun;Son, Seung Uk;Chung, Taek-Mo
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
    • /
    • pp.364.2-364.2
    • /
    • 2014
  • Magnesium oxide (MgO) thin films have attracted great scientific and technological interest in recent decades. Because of its distinguished properties such as a wide band gap (7.2 eV), a low dielectric constant (9.8), a low refractive index, an excellent chemical, and thermal stability (melting point=$2900^{\circ}C$), it is widely used as inorganic material in diverse areas such as fire resistant construction materials, optical materials, protective layers in plasma display panels, buffer layers of multilayer electronic/photonic devices, and perovskite ferroelectric thin films. Precursor used in the ALD requires volatility, stability, and low deposition temperature. Precursors using a heteroleptic ligands with different reactivity have advantage of selective reaction of the heteroleptic ligands on substrate during ALD process. In this study, we have synethesized new heteroleptic magnesium precursors ${\beta}$-diketonate and aminoalkoxide which have been widely used for the development of precursor because of the excellent volatility, chelating effects by increasing the coordination number of the metal, and advantages to synthesize a single precursor. A newly-synthesized Mg(II) precursor was adopted for growing MgO thin films using ALD.

  • PDF

플라즈마 후처리 시간에 따른 저유전율 SiOF 박막의 특성 (Characteristics of Low Dielectric Constant SiOF Thin Films with Post Plasma Treatment Time)

  • 이석형;박종완
    • 한국진공학회지
    • /
    • 제7권3호
    • /
    • pp.267-267
    • /
    • 1998
  • ECR plasma CVD를 이용한 SiOF박막은 낮은 유전상수를 가지고 있으며, 기존의 공정과의 정합성이 우수해 다층배선 공정에 채용이 유망한 재료이지만 수분의 흡수로 인한 유전율의 상승과 후속공정의 안정성이 문제점으로 부각되고 있다. 따라서 본 연구에서는 SiOF박막의 내흡습성과 후속공정에서의 안정성을 향상시키기 위하여 SiOF박막을 증착한 후 후속 산소 플라즈마 처리를 행하였다. SiOF박막은 산소 플라즈마 처리를 수행함으로써 SiOF박막의 밀도가 증가하고, 수분과의 친화력이 강한 Si-F 결합이 감소하는 것이 주요한 원인으로 사료된다. 하지만 플라즈마 처리 시간이 5분 이상으로 증가하면 유전율의 증가가 일어난다. 따라서 본 실험에서는 산소 플라즈마 처리조건이 마이크로파 전력이 700W, 공정 압력이 3mTorr, 기판온도가 300℃일 경우 플라즈마 처리시간은 3분이 적당한 것으로 생각 된다.봉?향상시키기 위하여 SiOF박막을 증착한 후 후속 산소 플라즈마 처리를 행하였다. SiOF박막은 산소 플라즈마 처리를 수행함으로써 SiOF박막의 밀도가 증가하고, 수분과의 친화력이 강한 Si-F 결합이 감소하는 것이 주요한 원인으로 사료된다. 하지만 플라즈마 처리 시간이 5분 이상으로 증가하면 유전율의 증가가 일어난다. 따라서 본 실험에서는 산소 플라즈마 처리조건이 마이크로파 전력이 700W, 공정 압력이 3mTorr, 기판온도가 300℃일 경우 플라즈마 처리시간은 3분이 적당한 것으로 생각된다.

저온 산화공정에 의해 낮은 Dit를 갖는 실리콘 산화막의 제조 (Preparation of the SiO2 Films with Low-Dit by Low Temperature Oxidation Process)

  • 전법주;정일현
    • 공업화학
    • /
    • 제9권7호
    • /
    • pp.990-997
    • /
    • 1998
  • ECR 산소플라즈마를 이용하여 저온 확산법에 의해 서로 다른 종류의 기판에 마이크로파 출력, 기판의 위치 등을 실험변수로 실리콘 산화막을 제조하고, 열처리 전 후 물리 화학적 특성을 분석하여 Si/O 의 조성비, 산화막 표면의 morphology와 전기적 특성과의 관계를 살펴보았다. 마이크로파 출력이 높은 영역에서, 산화속도는 증가하지만 식각으로 인하여 표면조도가 증가하였다. 따라서 막내에 결함이 증가하고 기판자체에 걸리는 DC bias의 증가로 기상에 존재하는 산소 양이온이 다량 함유되어 산화막의 질이 저하되었다. 기판의 종류에 따라 기상에 존재하는 산소 양이온의 함량은 Si(100) $Si/SiO_2$계면에 존재하는 결함들은 줄일 수 있으나, 고정전하와 계면포획전하 밀도는 열처리와 무관하고 단지 기상에 존재하는 반응성 산소이온의 양과 기판자체 DS bias에 의존하였다. 마이크로파 출력이 300, 400 W인 실험조건에서 표면조도가 낮고, 계면결함밀도가 ${\sim}9{\times}10^{10}cm^{-2}eV^{-1}$$Si/SiO_2$계면에서 결함이 적은 양질의 산화막이 얻어졌다.

  • PDF

포토 리소그래피 공정을 위한 Ti(10 nm)-Buffered층 위에 직접 성장된 고품질 무전사 단층 그래핀 공정 (High Quality Non-Transfer Single-Layer Graphene Process Grown Directly on Ti(10 nm)-Buffered Layer for Photo Lithography Process)

  • 오거룡;한이레;엄지호;윤순길
    • 한국전기전자재료학회논문지
    • /
    • 제34권1호
    • /
    • pp.21-26
    • /
    • 2021
  • Single-layer graphene is grown directly on Ti-buffered SiO2 at 100℃. As a result of the AFM measurement of the Ti buffer layer, the roughness of approximately 0.2 nm has been improved. Moreover, the Raman measurement of graphene grown on it shows that the D/G intensity ratio is extremely small, approximately 0.01, and there are no defects. In addition, the 2D/G intensity ratio had a value of approximately 2.1 for single-layer graphene. The sheet resistance is also 89 Ω/□, demonstrating excellent characteristics. The problem was solved by using graphene and a lift-off patterning method. Low-temperature direct-grown graphene does not deteriorate after the patterning process and can be used for device and micro-patterning research.

롤투롤 인쇄공정 적용을 위한 차세대 나노입자 소결 기술 (Alternative Sintering Technology of Printed Nanoparticles for Roll-to-Roll Process)

  • 이은경;은경태;안영석;김용택;천민우;좌성훈
    • 마이크로전자및패키징학회지
    • /
    • 제21권4호
    • /
    • pp.15-24
    • /
    • 2014
  • Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, has generated intensive interest in the application of flexible and wearable electronic devices. However, the actual use of printing technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practical drawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivity of the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage of polymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma, ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymer substrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. The advantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.

습식-펄스방전 복합시스템의 황산화물 및 질소산화물 제거성능 특성 (SOx and NOx removal performance by a wet-pulse discharge complex system)

  • 박현진;이환영;박문례;노학재;유정구;한방우;홍기정
    • 한국입자에어로졸학회지
    • /
    • 제15권1호
    • /
    • pp.1-13
    • /
    • 2019
  • Current desulfurization and denitrification technologies have reached a considerable level in terms of reduction efficiency. However, when compared with the simultaneous reduction technology, the individual reduction technologies have issues such as economic disadvantages due to the difficulty to scale-up apparatus, secondary pollution from wastewater/waste during the treatment process, requirement of large facilities for post-treatment, and increased installation costs. Therefore, it is necessary to enable practical application of simultaneous SOx and NOx treatment technologies to remove two or more contaminants in one process. The present study analyzes a technology capable of maintaining simultaneous treatment of SOx and NOx even at low temperatures due to the electrochemically generated strong oxidation of the wet-pulse complex system. This system also reduces unreacted residual gas and secondary products through the wet scrubbing process. It addresses common problems of the existing fuel gas treatment methods such as SDR, SCR, and activated carbon adsorption (i.e., low treatment efficiency, expensive maintenance cost, large installation area, and energy loss). Experiments were performed with varying variables such as pulse voltage, reaction temperature, chemicals and additives ratios, liquid/gas ratio, structure of the aeration cleaning nozzle, and gas inlet concentration. The performance of individual and complex processes using the wet-pulse discharge reaction were analyzed and compared.

Ti (10 nm)-buffered 기판들 위에 저온에서 직접 성장된 무 전사, 대 면적, 고 품질 단층 그래핀 특성 (Transfer-Free, Large-Scale, High-Quality Monolayer Graphene Grown Directly onto the Ti (10 nm)-buffered Substrates at Low Temperatures)

  • 한이레;박병주;엄지호;윤순길
    • 한국재료학회지
    • /
    • 제30권3호
    • /
    • pp.142-148
    • /
    • 2020
  • Graphene has attracted the interest of many researchers due to various its advantages such as high mobility, high transparency, and strong mechanical strength. However, large-area graphene is grown at high temperatures of about 1,000 ℃ and must be transferred to various substrates for various applications. As a result, transferred graphene shows many defects such as wrinkles/ripples and cracks that happen during the transfer process. In this study, we address transfer-free, large-scale, and high-quality monolayer graphene. Monolayer graphene was grown at low temperatures on Ti (10nm)-buffered Si (001) and PET substrates via plasma-assisted thermal chemical vapor deposition (PATCVD). The graphene area is small at low mTorr range of operating pressure, while 4 × 4 ㎠ scale graphene is grown at high working pressures from 1.5 to 1.8 Torr. Four-inch wafer scale graphene growth is achieved at growth conditions of 1.8 Torr working pressure and 150 ℃ growth temperature. The monolayer graphene that is grown directly on the Ti-buffer layer reveals a transparency of 97.4 % at a wavelength of 550 nm, a carrier mobility of about 7,000 ㎠/V×s, and a sheet resistance of 98 W/□. Transfer-free, large-scale, high-quality monolayer graphene can be applied to flexible and stretchable electronic devices.

Precursor Process Designing to Synthesize Nano-sized Phosphors

  • Kim, Soo-Jong
    • Transactions on Electrical and Electronic Materials
    • /
    • 제7권1호
    • /
    • pp.26-29
    • /
    • 2006
  • We present the structural, magnetic, and electrical properties in the (Al,Mn)N films with various Mn concentrations grown by plasma-enhanced molecular beam epitaxy. X-ray diffraction analyses reveal that the (Al,Mn)N films have the wurtzite structure without secondary phases. All (Al,Mn)N films showed the ferromagnetic ordering. Particularly, ($Al_{1-x}Mn_{x}$)N film with x = 0.028 exhibited the highest magnetic moment per Mn atom at room temperature. Since all the films exhibit the insulating characteristics, the origin of ferromagnetism in (Al,Mn)N might be attributed to either indirect exchange interaction caused by virtual electron excitations from Mn acceptor level to the valence band within the samples or a percolation of bound magnetic polarons arisen from exchange interaction of localized carriers with magnetic impurities in a low carrier density regime.

Low temperature plasma deposition of microcrystalline silicon films for bottom gate thin film transistors

  • Cabarrocas, P.Roca i;Djeridane, Y.;Abramov, A.;Bui, V.D.;Bonnassieux, Y.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
    • /
    • pp.56-60
    • /
    • 2006
  • We review our studies on the growth of microcrystalline silicon films by the standard PECVD technique. In situ spectroscopic ellipsometry studies allow the optimization of the complex film structure with respect to competing aspects of the growth process. Fine tuning the hydrogen flux, the ion energy, and the nature of the species contributing to deposition produces unique films with a fully crystallized interface with silicon nitride. These materials have been successfully incorporated in bottom gate TFTs which present mobility values in the range of 1 to 3 $cm^2/V.s$, and stable characteristics when submitted to a bias stress. The stability of these TFTs makes them suitable for driver applications in AMLCDs as well as pixel elements in OLED displays.

  • PDF

마이크로웨이브를 이용한 탄소나노튜브의 성장시 플라즈마 압력의 효과 (Effect of process pressure on properties of carbon nanotubes prepared by MPECVD)

  • 최성현;이재형;양종석;박대희
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
    • /
    • pp.73-74
    • /
    • 2006
  • Carbon nanotubes (CNTs) have recently attracted great attention because of their excellent physical properties, such as high mechanical strength, thermal stability, and electronic properties. These useful properties of carbon nanotubes make themselves good candidates for various application field, such as a transistor, battery, field emission display, nanoscale inter-connects, and so on. Gas-phase techniques offer the unique ability to synthesize well-oriented arrays of CNTs. However, it is seldom reported that the pressure influences on the growth of CNTs under low substrate temperature. In this work, the effect of the working pressure and the influence of the catalyst preparation on the properties of CNTs grown by microwave plasma chemical vapor deposition (MPCVD) were investigated.

  • PDF