• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.105.1-105
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• 2002

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.427-435
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• 1994

Cu-metallized low firing temperature substrates were synthesized by cofiring green sheet of cordierite-based glass with Cu. By Sol-Gel method, Cu powder was coated with borosilicate gel which should act as a glass frit in Cu paste during cofiring. Theoretical weight ratios of Glass/Cu were controlled to be 2.5, 5, 10 and 15% by varying alkoxide concentrations. Average particle size of coated Cu was 0.629~0.674 ${\mu}{\textrm}{m}$ in comparison to that of as-received Cu(0.596 ${\mu}{\textrm}{m}$), which increased with alkoxide concentration but did not increase above certain concentration. The weight ratios of coated layer were 2.11~5.37%. The properties of Cu-metallized low firing temperature substrate, cofired at 90$0^{\circ}C$ for 1h under H2/N2 atmosphere, were as follows; sheet resistance was 13~43 m{{{{ OMEGA }}/$\square$, adhesion strength was 1.0~2.1 kgf/$\textrm{mm}^2$. From the observations of SEM photographs, the gel coated on Cu performed excellently as a glass frit.

• Journal of the Korean Ceramic Society
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• v.30 no.10
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• pp.845-851
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• 1993

Low firing temperature substrate were synthesized through tape casting and sintering of glass with cordierite composition and then their properties were investigated. Even though the dielectric properties and XRD patterns of substrates, obtained by tape casting and sintering at 900~100$0^{\circ}C$ for various periods, were similar to those of substrates obtained by dry pressing, the sinterability was enhanced. The substrates were thin and the size was 0.6$\times$50$\times$50mm. From the results of dielectric properties, the sinterability and X-ray diffraction pattern, the proper condition for cofiring process with conductor, Cu, was 90$0^{\circ}C$ for 1h. The properties of the substrate are as follows; the dielectric constant was 5.31(at 1MHz), the dissipation factor was 0.0028, the apparent porosity was 0.28% and the main crystalline phase was $\alpha$-cordierite.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.19-25
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• 2002

Glass composed of $Li_2$O.MgO. $MgF_2$.$SiO_2$.$B_2O_3$ for the fabrication of green sheet was prepared by melting process, and glass ceramics was prepared by the process of nucleation and grystal growth for the glass of $Li_2$O.MgO. $MgF_2$.$SiO_2$.$B_2O_3$ system with Lithium fluorhectorite and Lithium boron fluorphlogopite crystal phase. Powderization of the glass ceramics was carried out by water swelling. The average particle size at this point was 2.574 $\mu\textrm{m}$. Slurry was prepared for green sheet using high viscous sol fabricated by water swelling, which shows cleavage phenomenon in prepared glass ceramics. The optimum ratio of powder to water for the tape casting was 18:100, and its viscosity was 11,000~14,000 cps.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.7-12
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• 2002

In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.