• 한국생산제조학회지
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• 제7권2호
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• pp.54-61
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• 1998

This paper examines the crack growth behavior of 7075-T651 aluminum alloy for small tensile overload under high-low block loading condition. The cantilever beam type specimen with a chevron notch is used in this study. The crack growth and closure are investigated by compliance method. The applied initial stress ratios are R=-0.5 R=0.0 and R=0.25 Crack length, effective stress intensity factor range, ratio of effective stress intensity factor range and crack growth rate etc, are inspected with fracture mechanics estimate.

• 한국압력기기공학회 논문집
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• 제13권2호
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• pp.67-74
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• 2017

Recently there have been many concerns on structural integrity of nuclear piping under seismic loadings. In terms of failure of nuclear piping due to seismic loadings, an important failure mechanism is low cycle fatigue with large cyclic displacements. To investigate the effects of seismic loading on low cycle fatigue behavior of nuclear piping, the cyclic behavior of materials and nuclear piping needs to be accurately estimated. In this paper, the non-linear finite element (FE) analyses have been carried out to evaluate the effects of three different cyclic hardening models on cyclic behavior of materials and nuclear piping, such as isotropic hardening, kinematic hardening and combined hardening.

• 전산구조공학
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• 제7권2호
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• pp.61-67
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• 1994

본 수치해석의 목적은 앵글 강부재의 극저사이클과 파괴실험으로부터 얻어진 거동의 재현 및 특히, 부재중에서 사장 심한 응력을 받는 부분에 대한 국소 응력-변형률의 이력과 누적상황을 추적하는 것이다. 이를 위해, 범용 구조해석 프로그램인 MSC/NASTRAN을 이용하여, 재료 및 기하학적 비선형을 고려한 대변형 3차원 유한요소 해석을 행하였다. 해석은 2단계 즉, 해석 I과 II로 나누어 실시하였으며, 본 해석의 전반적인 거동은 실험결과와 매우 잘 일치하였다.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 추계학술대회논문집
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• pp.942-945
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• 2005

The purpose of this study is to suggest a fundamental data for change of dynamic properties according to the loading time of resilient materials. 18 kinds of resilient materials included 4 representative types were measured at the load time of 24hours and 2hours by the method of Korea standard (KS F 2868) measuring the dynamic stiffness and the loss factor of materials under floating floors. As a result, the dynamic stiffness was increased rapidly in case of expandable polystyrene and rubber materials according to the load time, especially before 2 hours. The loss factor was represented that rubber materials with high elasticity are high, and expandable polystyrene, polyester, poly ethylene materials with low elasticity are low.

• International Journal of Naval Architecture and Ocean Engineering
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• 제6권2호
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• pp.442-458
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• 2014

Wave induced vibrations increase the fatigue and extreme loading, but this is normally neglected in design. The industry view on this is changing. Wave induced vibrations are often divided into springing and whipping, and their relative contribution to fatigue and extreme loading varies depending on ship design. When it comes to displacement vessels, the contribution from whipping on fatigue and extreme loading is particularly high for certain container vessels. A large modern design container vessel with high bow flare angle and high service speed has been considered. The container vessel was equipped with a hull monitoring system from a recognized supplier of HMON systems. The vessel has been operating between Asia and Europe for a few years and valuable data has been collected. Also model tests have been carried out of this vessel to investigate fatigue and extreme loading, but model tests are often limited to head seas. For the full scale measurements, the correlation between stress data and wind data has been investigated. The wave and vibration damage are shown versus heading and Beaufort strength to indicate general trends. The wind data has also been compared to North Atlantic design environment. Even though it has been shown that the encountered wind data has been much less severe than in North Atlantic, the extreme loading defined by IACS URS11 is significantly exceeded when whipping is included. If whipping may contribute to collapse, then proper seamanship may be useful in order to limit the extreme loading. The vibration damage is also observed to be high from head to beam seas, and even present in stern seas, but fatigue damage in general is low on this East Asia to Europe trade.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
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• pp.128.2-128
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• 2003

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• International Journal of Safety
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• 제3권1호
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• pp.27-31
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• 2004

Some of the petroleum products contain benzene which is well known as a confirmed human carcinogen. For example, gasoline products contain benzene ranging up to several percents by weight. High exposures to the benzene and other organic solvents would be likely to occur during intermittent tasks and or processes rather than continuous jobs such as sampling, repair, inspection, and loading/unloading jobs. The work time for these jobs is various. However, most of work time is very short and the representative time interval is 15 minutes. Thus, it is preferable to do exposure assessment for 15 minute time weighted average which is known as a short time exposure level(STEL) by ACGIH rather than for 8-hours TWA. It is particularly significant to the exposure monitoring for benzene since it has been known that the exposure rate plays an important role to provoke the leukemia. Due to the large variations, a number of processes/tasks, the traditional sampling technique for organic solvents with the use of the charcoal and sampling pumps is not appropriate. Limited number of samples can be obtained due to the shortage of sampling pumps. Passive samplers can eliminate these limitations. However, low sampling rates resulted in collection of small amount of the target analysts in the passive samplers. This is originated the nature of passive samplers. Field applications were made with use of passive samplers to compare with the charcoal tube methods for 15 minutes. Gasoline loading processes to the tank lorry trucks at the loading stations in the petroleum products storage area. Good agreements between the results of passive samplers and those of the charcoal tubes were achieved. However, it was found that special cautions were necessary during the analysis at very low concentration levels.