• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1237-1241
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• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• Journal of Korean Association for Spatial Structures
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• v.19 no.1
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• pp.101-108
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• 2019

Recently, measuring instruments for SHM of structures has been developed. In general, the wireless transmission of sensor signals, compared to its wired counterpart, is preferable due to the absence of triboelectric noise and elimination of the requirement of a cumbersome cable. However, the low-cost wireless MEMS sensor has high noise density and transmits the signal wirelessly, so data transmission delay occurs during measurement. Therefore, the footbridges that was previously measured by a mobile phone in 2014 was remeasured using G-Link-200, iPad and iPhone to compare their performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.176-181
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• 2012

Due to the high etch rate and low fabrication cost, the wet etching of silicon using KOH etchant is widely used in MEMS fabrication area. However, anisotropic etch characteristic obstruct intuitional mask design and compensation structures are required for mask design level. Therefore, the accurate modeling for various types of silicon surface is essential for fabrication of three-dimensional MEMS structure. In this paper, we modeled KOH etch profile for MEMS based energy harvester using fuzzy logic. Modeling results are compared with experimental results and it is applied to design of compensation structure for MEMS based energy harvester. Through Fuzzy inference approaches, developed model showed good agreement with the experimental results with limited etch rate information.

• Journal of Korean Association for Spatial Structures
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• v.17 no.4
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• pp.93-102
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• 2017

Wireless MEMS sensors have common features such as wireless communication, data measurement, embedded processing, battery-based self-power, and low cost, and increased measurement effectiveness. Wireless MEMS sensors enable efficient SHM without interfering with location because there is no requirement for triboelectric noise and cumbersome cables. However, there is little research on the communication distance with sensors and data. For instance, existing researches have limited communication distance experiments in civil engineering bridges. It is also necessary to investigate the characteristics of dynamic behavior and the communication distance of architectural structures with different wireless transmission/reception environments. Therefore, in a building structure with walls and slabs instead of open spaces, MEMS sensors and data loggers were used as distance experiments where communication disturbance between the vertical slab and the horizontal wall could actually be communicated.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.10
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• pp.1822-1829
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• 2008

Calibration of an MEMS inertial measurement unit is very important process for obtaining precise navigation performance. In this paper, one method is proposed to overcome a limitations on cost and efficiency using a relatively higher grade sensor and a rate table. The same dynamic input is applied to both the reference and the target sensors during and after calibration process, then the results are analyzed. The experimental results show that the proposed method is very effective and useful in practice.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• Journal of Digital Contents Society
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• v.13 no.1
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• pp.129-139
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• 2012

Recently, the smart sensor technologies are rapidly developing in accordance with the technology of implementation in small-size, low-cost, and low power consumption. With these sensor technologies, especially with MEMS and NEMS, the researches on the WSN are actively performing. For the WSN, a network security function is essential even it requires high physical resource level. But the WSN with the smart sensor technologies could not be provided with enough resources for the function because of limited size, computing-power, low-power, and etc. In this paper, we introduce security and key-management protocols of WSN.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.27 no.2
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• pp.249-260
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• 2009

The georeferencing accuracy of the sensory data acquired by an aerial monitoring system heavily depends on the performance of the GPS/IMU mounted on the system. The employment of a high performance but expensive GPS/IMU unit causes to increase the developmental cost of the overall system. In this study, we simulate the images and GPS/IMU data acquired by an UAV-based aerial monitoring system using an inexpensive integrated GPS/IMU of a MEMS type, and perform the image georeferencing by applying the aerial triangulation to the simulated sensory data without any GCP. The image georeferencing results are then analyzed to assess the accuracy of the estimated exterior orientation parameters of the images and ground points coordinates. The analysis indicates that the RMSEs of the exterior orientation parameters and ground point coordinates is significantly decreased by about 90% in comparison with those resulted from the direct georeferencing without the aerial triangulation. From this study, we confirmed the high possibility to develop a low-cost real-time aerial monitoring system.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.172-176
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• 2002

This paper describes a MEMS-based micro-fluxgate magnetic sensing element using Ni$\_$0.8/Fe$\_$0.2/ film formed by electroplating. The micro-fluxgate magnetic sensor composed of a thin film magnetic core and micro-structured solenoids for the pick-up and the excitation coils, is developed by using MEMS technologies in order to take advantage of low-cost, small size and lower power consumption in the fabrication. A copper with 20um width and 3um thickness is electroplated on Cr(300${\AA}$)/Au(1500${\AA}$) films for the pick-up(42turn) and the excitation(24turn) coils. In order to improve the sensitivity of the sensing element, we designed the magnetic core into a rectangular-ring shape to reduce the magnetic flux leakage. An electroplated permalloy film with the thickness of 3 $\mu\textrm{m}$ is obtained under 2000Gauss to induce magnetic anisotropy. The magnetic core has the high DC effective permeability of ∼1,100 and coercive field of -0.1Oe. The fabricated sensing element using rectangular-ring shaped magnetic film has the sensitivity of about 150V/T at the excitation frequency of 2MHz and the excitation voltage of 4.4Vp-p. The power consumption is estimated to be 50mW.