• 제목/요약/키워드: lead plate

검색결과 317건 처리시간 0.026초

Expression of Antibacterial Cationic Peptides from Methylotrophic Yeast, Pichia pastoris

  • 이강우;최윤재
    • 한국생물공학회:학술대회논문집
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    • 한국생물공학회 2000년도 추계학술발표대회 및 bio-venture fair
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    • pp.669-671
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    • 2000
  • Antimicrobial cationic peptides have attracted increasing research and clinical interest as a natural antibiotics due to their broad spectrum of antimicrobial activites and the rapid development of multidrug-resistant pathogenic microorganisms. In this study, first, we synthesized artificial fusion partner and cationic peptide genes (lactoferricin, magainin, protegrin-1, and indolicidin). Second, we constructed recombinant expression vectors and then transformed Pichia pastoris. Finally, expressed cationic peptides were purified and tested for their antimicrobial activites. Antimicrobial activity has been tested upon the appearance of clearing zone on the plate with the lawn of gram negative E.coli XL- I blue and garm positive Staphylococcus aureus. Protegrin-1 and Indolicidin have apparant activity of cationic peotides. This fusion technique may lead to a general and suitable tool for production of pure antimicrobial cationic peptides in Pichia pastoris.

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반도체 공정용 수직로 설계를 위한 열유동 제어. (The Third National Congress on Fluids Engineering: Thermal design for the vertical type oven of soldering process.)

  • 정원중;권현구;조형희
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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    • pp.561-564
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    • 2006
  • Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

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홀확장법과 억지끼워맞춤의 잔류응력 비교를 위한 유한요소해석 (The Finite Element Analysis for Comparision of Residual Stress at Cold Expansion Method and Interfernce Fit)

  • 장재순;양원호;김철;고명훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 추계학술대회논문집A
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    • pp.419-424
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    • 2001
  • The purpose of this study is comparing cold expansion method with interference fit. Cold expansion method and interference fit of fastener hole is using in the aerospace industry. These treatment lead to an improvement of fatigue life to the compressive residual stresses developed on the hole surface. But Research is nothing to about difference effect of between cold expansion method and interference fit. So In this paper, It is shown that Comparing cold expansion method with interference fit. and It is further shown that residual stress distribution according to plate thickness.

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유압전동장치의 유량 압력맥동 특성 (Flow and Pressure Ripple Characteristics of Hydrostatic Transmissions)

  • 김도태;윤인균
    • 한국공작기계학회논문집
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    • 제10권1호
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    • pp.120-126
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    • 2001
  • This study deals with a flow and pressure ripple characteristics for a hydrostatic transmission(HST) consisting of a vari-able axial piston pump connected in an open loop to a fixed displacement axial piston motor. These flow ripples produced by pump and motor in HST interacts with the source impedances of the pump or motor and dynamic characteristics of the connected pipeline, and results in a pressure ripples, Pressure ripples. Pressure ripples in HSP is major source of vibration, which can lead to fatigue failure of components and cause noise. In this paper, the flow ripples generated by a swash plate type axial piston pump or motor in HST are measured by making use of hydraulic pipeline dynamics and the measured pressure data at two points along the pipeline. By using the self-checking functions, the validity of the method us investigated by comparison with the measured and estimated pressure ripples at the halfway section of the pipeline, and good agreement is achieved.

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Simultaneous active strain and ultrasonic measurement using fiber acoustic wave piezoelectric transducers

  • Lee, J.R.;Park, C.Y.;Kong, C.W.
    • Smart Structures and Systems
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    • 제11권2호
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    • pp.185-197
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    • 2013
  • We developed a simultaneous strain measurement and damage detection technique using a pair of surface-mounted piezoelectric transducers and a fiber connecting them. This is a novel sensor configuration of the fiber acoustic wave (FAW) piezoelectric transducer. In this study, lead-zirconate-titanate (PZT) transducers are installed conventionally on a plate's surface, which is a technique used in many structural health monitoring studies. However, our PZTs are also connected with an optical fiber. A FAW and Lamb wave are simultaneously guided in the optical fiber and the structure, respectively. The dependency of the time-of-flight of the FAW on the applied strain is quantified for strain sensing. In our experimental results, the FAW exhibited excellent linear behavior and no hysteresis with respect to the change in strain. On the other hand, the well-known damage detection function of the surface-mounted PZT transducers was still available by monitoring the waveform change in the conventional Lamb wave ultrasonic path.

적층판 결합공정의 불확정성을 고려한 강건최적설계 (A Study on Robust Design Optimization of Layered Plates Bonding Process Considering Uncertainties)

  • 최주호;이우혁;윤병동
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 2006년도 정기 학술대회 논문집
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    • pp.836-840
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    • 2006
  • Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.

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Mahalanobis Taguchi System을 이용한 사출 공정의 최적설계 (Optimal Design of Injection Molding Process using the Mahalanobis Taguchi System)

  • 김경모;박종천
    • 한국기계가공학회지
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    • 제16권1호
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    • pp.1-8
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    • 2017
  • Warpage is a major defect frequently found in the injection molding process, and the reduction of warpage is a very challenging problem because of the uncontrollable factors, such as variations in the process parameters. Without any countermeasure against these noises, attempts to reduce the defects often lead to failure. In this research, a new robust design methodology, based on the Mahalanobis Taguchi System (MTS) to reduce warpage, is presented. The MTS performs the orthogonal array experiments and uses the signal-to-noise (SN) ratio of the Mahalanobis distance as a performance metric. The validity of the proposed method is illustrated through an optimal design of the injection molding process of a CPU base plate.

즉발감마선 계측시스템의 반사체를 이용한 열중성자 효율증대 연구 (Study on Thermal Neutron Efficiency for Neutron Induced Prompt Gamma-ray Spectrometer Using Various Reflectors)

  • 박용준;송병철;지광용
    • 분석과학
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    • 제16권5호
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    • pp.426-429
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    • 2003
  • Neutron induced prompt gamma-ray spectroscopy (NIPS) system equipped with a $^{252}Cf$ neutron source and a n-type coaxial HPGe detector was installed for the quantitative analysis of aqueous samples in KAERI, Korea. Since the thermal neutron flux for the $^{252}Cf$ neutron source is relatively low compared to that for the reactor, the use of a thermal neutron reflector in the NIPS system may lead to improved results. The enhancement by using various reflectors was carried out by comparing the Cl peak with or without a cadmium plate between sample and the $^{252}Cf$ source. The use of pyrolitic graphite as a reflector provided a good result.

자세동요에 있어 선행적 자세적응이 균형수행력에 미치는 영향 (The effect of Anticipatory Postural Adjustment on Balance Performance in Postural Disturbance)

  • 채윤원;김명훈;조병모
    • The Journal of Korean Physical Therapy
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    • 제12권1호
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    • pp.65-71
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    • 2000
  • This study investigated the effect of anticipatory postural adjustment on balance performance in postural disturbance. Any action performed by standing subject is generally accompanied by compensatory postural activities, which reduce or abolish the postural disturbance generated by the movement and keep the subjects' center of gravity within the supporting base. These Postural activities arc triggered by either anticipatory and feedback postural control. We studied the difference of anticipatory and feedback postural control in postural disturbance. The subjects were standing on a foot plate with eyes closed, holding a lead of $5\%$ of their own body weight in their hands. The condition of anticipatory postural adjustment was applied voluntarily releases the a load. The condition of feedback postural control was applied that the load was unpredictably removed. We concluded that anticipatory postural adjustment becomes more efficient to postural performance in postural disturbance.

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UBM이 단면 증착된 Si-Wafer에 대한 Pb-free 솔더의 무플럭스 젖음 특성 (The Fluxless Wetting Properties of UBM-Coated Si-Wafer to the Pb-Free Solders)

  • 홍순민;박재용;김문일;정재필;강춘식
    • Journal of Welding and Joining
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    • 제18권6호
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    • pp.74-82
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    • 2000
  • The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

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