• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.110-110
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.123-123
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• 1999

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.35-40
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• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.221.2-221.2
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.97.2-97.2
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• 2007

• Applied Science and Convergence Technology
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• v.23 no.6
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• Journal of the Korean Applied Science and Technology
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• v.27 no.2
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• pp.196-201
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• 2010

The influence of red lead($Pb_3O_4$) to curing and formation reaction properties when it was added in positive material of lead acid battery for vehicle use has been investigated. At the results, it was confirmed that the addition of red lead led 4BS crystal size to be smaller and increased the rates of 4BS formation and Pb consumption. Consequently the curing time was shortened to half compared with that of red lead-free one. In addition to this, the lead acid battery prepared by adding red lead showed 14% higher efficiency at the life cycle test than that without red lead.

• Current Photovoltaic Research
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• v.11 no.1
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• pp.18-26
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• 2023

Tin perovskite solar cells have attracted a lot of attention due to their potential to address the toxicity of lead, which is the biggest barrier to commercialization of perovskite solar cells. Unlike other lead-free perovskite, tin perovskite have a direct bandgap, which is suitable for use as light harvesting, and relatively good stability, which has led to a lot of attention. Since the first tin perovskite solar cell was reported in 2014, it has achieved an impressive power conversion efficiency of 14.81%. However, this efficiency is still low compared to that of lead perovskite solar cells, and the stability of tin perovskite solar cells is also an issue that needs to be addressed. In this review, we will discuss the basic properties of the tin atom in comparison to the lead atom, and then discuss the crystal structure, phase transition, and basic properties of tin perovskite. We will then discuss the advantages, applications, challenges, and strategies of tin perovskite, In particular, we will focus on how to prevent the oxidation of tin, which is arguably the biggest challenge for using tin perovskite solar cells. At the end, we summarize the key factors that need to be addressed for higher efficiency and stability, emphasizing what is needed to commercialize tin perovskite solar cells.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.