• Journal of Nutrition and Health
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• 제19권5호
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• pp.323-332
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• 1986

This study was performed to see the effects of lead poisoning and dietary protein levels(6, 15 and 40 % casein diets) on growth, protein and lipid metabolisms in growing rats. It was also investigated whether the high protein intake would alleviate lead toxicity by decreasing Pb absorption and/or increasing Pb excretion. The results obtained were summarized as follows ; 1) Weight gain, F.E.R liver weight, weight and length of bone in Pb-administered groups were lower than in Pb-free groups. However, these values in the 40% casein diet group with Pb were increased to the level in 15% casein diet group without Pb. 2) Hematocrt and hemoglobin content in blood were lower in Pb -adminstered groups than in Pb free groups. Especially, these levels were lower in 6% casein diet group with Pb than in any other group. 3) Plasma protein level in th e 40% casein casein diet group was the highest of all groups and those of Pb-administered groups tended to be lower than those of Pb-free groups. Plasma lipid and cholesterol levels were increased with decreasing dietary protein level, and these levels were higher in the animals exposed to Pb than in free groups.4) Total liver protein, lipid and cholesterol contents were increased with increasing dietary protein level, and these contents were lower in Pb-administered groups than in Pb free groups. 5) Fecal Pb excretion was not different between 6 and 40% casein diet groups. However, urinary Pb excretion was higher in the 40% casein diet group than in the 6% casein diet group. Above results suggest that, in exposing to the Pb pollution, sufficient protien intake must be recommended. High protein intake seemed to alleviate lead toxicity by increasing urinary Pb excretion.

• 열처리공학회지
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• 제24권3호
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• pp.133-139
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• 2011

This study has been investigated for tensile properties with lead-free brass containing 1 wt.% of Bi. And also characteristic of corrosion resistance was analyzed by polarization test. An increase of tempering temperature was found to tend to decrease tensile strength, and percentage of elongation was shown to be the lowest value at $300^{\circ}C$. On the other hand, the elongation was increased with an increase of tempering temperature after $300^{\circ}C$. The change of mechanical properties was closely related with the content and shape of acicular Witmanst$\ddot{a}$tten ${\alpha}$ formed at the interface of ${\beta}$ phase as well as in ${\beta}$ phase. Tensile strength had a tendency to be decreased with an increase of test temperature. The elongation was shown to be the lowest value at around $300^{\circ}C$, while it began to increase as test temperature rose after $300^{\circ}C$. It might be speculated that the reason that elongation was decreased was found to form bismuth film at the interface of ${\alpha}/{\beta}$ phase leading to be easily brittle when loaded by tensile stress. The lead-free brass containing 1 wt.% of Bi had similar characteristic of corrosion resistance with a free-cutting brass with 3.4 wt. % of Pb in spite of higher fraction of ${\beta}$ phase.

• 한국정밀공학회지
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• 제26권7호
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 추계학술발표강연 및 논문개요집
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• pp.110-110
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• 1999

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
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• pp.123-123
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• 1999

• 마이크로전자및패키징학회지
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• 제14권2호
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• pp.35-40
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• 2007

Sn-8Zn-3Bi 무연 솔더 페이스트의 접합부신뢰성 및 적합성을 평가하기 위해 유(SnPb) 무연(Sn, SnBi)도금된 Cu 리드프레임 QFP(Quad Flat Packager)를 사용하여 열충격 조건 하에서의 인장 강도의 변화 및 파괴 기구에 대한 분석을 실시하였다. 리드 도금의 종류에 상관없이 모든 시험 시편에서 열충격 사이클 수의 증가에 비례하여 접합부의 취성 특성이 강화되어 인장 강도가 감소하는 것을 확인하였다. 하지만, 접합부에는 열팽창 계수의 차이에 의해 야기될 수 있는 미세 균열은 발견되지 않았다. 단면 관찰 및 변위 이력 곡선 분석을 통하여 열충격 사이클 수의 증가에 따른 인강 강도의 감소는 접합부의 파괴 기구의 변화에 기인되었음을 확인하였다. 본 실험을 통해 Sn-3Zn-3Bi 솔더의 유 무연 도금 Cu 리드프레임과의 우수한 작업 특성과 열충격 환경 하에서도 우수한 기계적 접합 특성을 유지하는 것을 확인할 수 있었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.221.2-221.2
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• 2005

• 한국재료학회:학술대회논문집
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• 한국재료학회 2007년도 추계학술발표대회 및
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• pp.97.2-97.2
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• 2007

• Applied Science and Convergence Technology
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• 제23권6호
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• 한국응용과학기술학회지
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• 제27권2호
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• pp.196-201
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• 2010

The influence of red lead($Pb_3O_4$) to curing and formation reaction properties when it was added in positive material of lead acid battery for vehicle use has been investigated. At the results, it was confirmed that the addition of red lead led 4BS crystal size to be smaller and increased the rates of 4BS formation and Pb consumption. Consequently the curing time was shortened to half compared with that of red lead-free one. In addition to this, the lead acid battery prepared by adding red lead showed 14% higher efficiency at the life cycle test than that without red lead.