• Title/Summary/Keyword: laser-induced etching

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Diagnostics of Magnetron Sputtering Plasmas: Distributions of Density and Velocity of Sputtered Metal Atoms

  • Sasaki, Koichi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.98-99
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    • 2012
  • Deposition of thin films using magnetron sputtering plasmas is a well-developed, classical technology. However, detailed investigations using advanced diagnostics are insufficient in magnetron sputtering, in comparison with plasma-aided dry etching and plasma-enhanced chemical vapor deposition. In this talk, we will show examples of diagnostic works on magnetron sputtering employing metal targets. Diagnostic methods which have fine spatial resolutions are suitable for magnetron sputtering plasmas since they have significant spatial distributions. We are using two-dimensional laser-induced fluorescence spectroscopy, in which the plasma space is illuminated by a tunable laser beam with a planer shape. A charge-coupled device camera with a gated image intensifier is used for taking the picture of the image of laser-induced fluorescence formed on the planer laser beam. The picture of laser-induced fluorescence directly represents the two-dimensional distribution of the atom density probed by the tunable laser beam, when an intense laser with a relatively wide line-width is used. When a weak laser beam with a relatively narrow linewidth is used, the laser-induced fluorescence represents the density distribution of atoms which feel the laser wavelength to be resonant via the Doppler shift corresponding to their velocities. In this case, we can obtain the velocity distribution function of atoms by scanning the wavelength of the laser beam around the line center.

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THE EFFECT OF $CO_2$ LASER IRRADIATION ON ENAMEL SURFACE AND THE BOND STRENGTH OF SEALANT MATERIAL (탄산가스 레이저 조사가 법랑질 표면구조와 치면열구 전색재의 결합강도에 미치는 효과)

  • Yun, Dong-Sik;Kim, Yong-Kee;Kim, Jong-Soo
    • Journal of the korean academy of Pediatric Dentistry
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    • v.25 no.4
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    • pp.761-771
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    • 1998
  • In this study, attempt has been made to evaluate the effect of $CO_2$ laser irradiation on enamel surface structure and the bond strength of sealant material. Conventional acid etching was used as a control technic for comparison. The results obtained from this experiment were as follows; 1. The highest mean shear bond strength value was observed in samples of Group I (acid-etching) with the statistical significance(p<.05) between all the other groups. 2. The shear bond strength in Group IV was the lowest among laser etching groups. but there were no significant difference between them(p>.05). 3. Scanning electron microscopic observation showed that the rough and irregular surface was created by $CO_2$ laser treatment with the formation of numerous pores, micro-cracks, and small bubble-like inclusion. Increasing the energy density induced localized surface melt with a thin smooth glaze-like appearance. 4. In acid-etched control specimen cohesive failure predominated, whereas adhesive failure was the main mode in laser-treated group. Based upon the above-mentioned results, it can be assumed that the $CO_2$ laser is not an adequate substitute for the acid-etch technique in enamel preconditioning. More studies are required to explore the effective condition of laser irradiation which could attain the better bond strength of restorative materials.

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Laser induced dry etching of GaAs (레이저유기에 의한 GaAs의 건식에칭)

  • Park, Se-Ki;Lee, Choen;Choi, Won-Chel;Kim, Moo-Sung;Min, Suk-Ki;Ahn, Byung-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.05a
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    • pp.58-61
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    • 1995
  • Instead of using CCl$_4$CCl$_2$F$_2$ gases, we used a alternative reaction gas of CFCs which we have developed, for the experiment of laser induced dry etching of laser induced dry etching of GaAs, and compared with the etch profile of a usual reation gas. Laser powers(power density) on the sample surface were varied from 100 mW(12.7 MW/$\textrm{cm}^2$) to 210mW(27 MW/$\textrm{cm}^2$) The laser beam was scanned over the sample by moving the cell with a speed raging from 8.3$\mu\textrm{m}$/sec and the gas pressure also was varied form 260 Torr to 760 Torr, High etching rates up to 136 $\mu\textrm{m}$/sec and an aspect ratio of 2.6 have been achieved by single scan of laser beam. The chemical compositions of the reaction products deposited on the etched groove were measured by Auger electron spectroscopy(AES) Etch profiles, including depth and width were observed by scanning electron microscopy(SEM)

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Fabrication of Glass Microstructure Using Laser-Induced Backside Wet Etching (레이저 습식 후면 식각공정을 이용한 미세 유리 구조물 제작)

  • Kim, Bo Sung;Park, Min Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.967-972
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    • 2014
  • The good light permeability and hardness of glass allow it to be used in various fields. Non-conventional machining methods have been used for glass machining because of its brittle properties. As one non-contact machining method, a laser has advantages that include a high machining speed and the fact that no tool making is required. However, glass has light permeability. Thus, the use of a laser to machine glass has limitations. A nanosecond pulse laser can be used at low power for laser-induced backside wet etching, which is an indirect method. In previous studies, a short-wave laser that had good light absorption but a high price was used. In this study, a near-infrared laser was used to test the possibility of glass micro-machining. In particular, when deeper machining was conducted on a glass structure, more problems could result. To solve these problems, microstructure manufacturing was conducted using ultrasonic vibration.

UV-LASER INDUCED SURFACE REACTION - DESORppTION AND ETCHING

  • Murata, Yoshitada
    • Proceedings of the Korean Vacuum Society Conference
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    • 1992.02a
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    • pp.3-10
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    • 1992
  • pphotostimulated desorpption of NO chemisorbed on ppt(001) at 80K has been studied by the (1+1)-resonance-enhanced multipphoton ionization((1+1)-REMppI) technique. A linearly ppolarized ArF excimer laser ( =193 nm, 6.41eV) is used as the ppumpp laser. A high adsorpption rate selectivity was found in the expposure deppendence of the NO desorpption yield. The NO desorpption yield increases drastically when the amount of NO expposure exceeds ~1.8 L. This result shows that the amount of NO sppecies with a large cross section for pphotostimulated desorpption increases drastically at higher NO coverages. Using scanning tunneling microscoppy, we have observed structural modifications of the chlorinated Si(111)-7$\times$7 surface induced by 266nm laser irradiation. At very low laser fluence of 0.7mJ/$\textrm{cm}^2$, at which thermal desorpption can be ignored, a pperiodic stripped ppattern of a single domain is imaged. This ppattern consists of flat terraces and narrow grooves of ~60 and ~10A in width, resppectively.

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A Study on the Radius of Curvature of Concave Optical Fiber Tips fabricated by Laser-Induced Photothermal Effect (레이저 유도 광열 효과를 이용하여 제작된 오목한 광섬유 팁의 곡률 반경에 관한 연구)

  • Choi, Ji-Won;Son, Gyeong-Ho;Yu, Kyoung-Sik
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.5
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    • pp.871-876
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    • 2019
  • We fabricated concave optical fiber tips using hydrofluoric acid solution and photothermal effect induced by $1.55{\mu}m$ wavelength laser applied to an optical fiber. The radius of curvature of the concave optical fiber tips fabricated with different applied laser power, etching time, and concentration of hydrofluoric acid was measured with an optical microscope. Then, we analyzed how the radius of curvature changes for those three variables. In addition, the reliability of the measurement method using a microscope was verified through a free spectral range(FSR) and a scanning electron microscope(SEM). Through this paper, the radius of curvature can be adjusted by the variables of the fabrication process of concave optical fiber tips; thus, it is overcoming the limitations of conventional optical fiber etching methods using hydrofluoric acid solutions.