• Journal of the Korean Society for Precision Engineering
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• v.29 no.6
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• pp.640-647
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• 2012

Current electronic products are dominated by the laser processing and the application will be extended this time. Especially, demands for high precision laser processing with a large area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. In this paper we designed an on-the-fly system for ultrafast/high precision/large area laser processing. In addition, we have developed the path algorithm for large area. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. We proposed a path of the user concept using NURBS(Non-Uniform Rational B-Spline)method. Through our experiment with the chopper, was to prove the continuity of edge parts. Through basic shape experiments, we proved that large area can be processed using laser. We developed a simulation tool using Visual C++.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• Laser Solutions
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• v.8 no.2
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• pp.7-12
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• 2005

The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2003.05a
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• pp.56-59
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• 2003

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1475-1480
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• 2007

In the last few years, lasers have found new applications in production engineering as tools for surface treatment, cutting, welding, drilling and marking. So far, the laser has mainly been used in special laser processing machines ('laser-only') directly integrated into a production line or serving as stand-alone stations in the workshop. By combining conventional metal cutting technologies with laser processes in one machine, complete processing of a workpiece with different technologies in one setting can be realized. The main advantages are a reduction of the material flow between the production machines, which leads to a reduction in processing time and logistics, and an enhancement of manufacturing quality due to the processing in one setting. In addition to this approach new processing technologies such as laser-assisted machining are possible.

• Journal of Welding and Joining
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• v.19 no.2
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• pp.228-234
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• 2001

A methodology is developed and used to evaluate the response sensitivity of the thermal systems to variations in their design parameters. Technique for computing the sensitivity of temperature distributions to changes in processing parameters needed to decide the more effective laser input parameters for laser surface hardening treatment is considered. In this study, a state equation governing the heat flow in laser surface treatment is analyzed using a three-dimensional finite element method and sensitivity data of the processing parameter obtained using a direct differentiation method is applied to the sensitivity analysis. The interesting processing parameters are taken as the laser scan velocity and laser beam radius ( $r_{ b}$), and the sensitivities of the temperature T versus v and $r_{b}$ are analyzed. These sensitivity results are obtained with another parameters fixed. To verify the numerical analysis results, hardened layer dimensions (width and depth) of the numerical analysis are compared with the experimental ones.nes.

• Laser Solutions
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• v.4 no.2
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• pp.29-38
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• 2001

A development of in-process and reliable monitoring system in laser materials processing is essential for successful applications toward the real industrial fields. It was known that optical signals induced by laser-matter interactions provide a good indication not only to monitor various defects but also to characterize and identify the process However there are still difficulties to implement the optical monitoring system in real fields since the system is susceptible to the spurious change of the signal affected by the variation of experimental conditions and environmental noises. In this article. a new type of optical monitoring technique named 'chromatic modulation technique' is described as a reliable, robust and sensitive monitor for the applications in laser materials processing in order to tackle the conventional problems in optical system.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.11a
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• pp.73-79
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• 2002

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.51-59
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• 2000

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.114-118
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• 2001