• Title/Summary/Keyword: laser marking

Search Result 64, Processing Time 0.03 seconds

On the Tunneling technique in Japan (일본의 Tunnel기술)

  • Huh, Ginn
    • Explosives and Blasting
    • /
    • v.12 no.4
    • /
    • pp.10-21
    • /
    • 1994
  • The Tunneling Technique has been developing highly in Japan. Induced NATM pattern is ap-plied as it-self but is an apportunity to upgrade technologes of Concernning. As a result, Nonnel system as Laser marking system is significant developed result. Japan-Korea Tunnel leasing by international High way project is regarded hope-full for the world peace. It has described Euro-Tunnel too.

  • PDF

Development of a controller for a laser marking system (레이저 마킹 장비 제어기 개발)

  • 방승현;강태삼;홍선기
    • Proceedings of the KAIS Fall Conference
    • /
    • 2001.05a
    • /
    • pp.144-147
    • /
    • 2001
  • 본 연구에서는 레이저 마킹 장비의 핵심 부분인 갈바노미터 제어 시스템을 구현하고, 기초적인 PID제어기를 설계하였다. 주파수 응답 분석 및 시뮬레이션을 통하여 플랜트 및 제어기의 특성을 분석하였으며, 실험 결과 잡음이 있기는 하지만 기능적으로 잘 동작함을 확인하였다.

Laser Marking for Light Guide Panel using Design of Experiment and Construction of Web-based Prototyping System (실험계획법을 이용한 도광판 레이저 마킹 및 웹기반 시스템 구축)

  • Kang H.J.;Kim H.J.;Ahn S.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.06a
    • /
    • pp.728-731
    • /
    • 2005
  • A light guide panel (LGP) is an element of the LCD back light unit, which is used for display devices. In this study, a laser marking process is applied to the fabrication of light guide panels as the new fabrication process. In order to obtain a light guide panel which has high luminance and uniformity, four principal parameters such as power, scanning speed, ratio of line gap, and number of line were selected as important factors. A Web-based design tool was developed to generate patterns of light guide panel, and the tool may assist the designer to develop optimized patterns. Topcon-BM7 was used for luminance measurement of each specimen 100mm$\times$100mm area. By Taguchi method optimized levels of each parameters such as 40W of power, 30mm/s of scanning speed, 100:50 ratio of pattern gap, and 90 line of pattern were found by Taguchi method.

  • PDF

Axiomatic Design of a Beam Adjuster for Laser Marker (레이저 마커용 빔 정렬장치의 공리적 설계)

  • Sin, Gwang-Seop;Lee, Jeong-Uk;Park, Gyeong-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.26 no.9
    • /
    • pp.1727-1735
    • /
    • 2002
  • The usage of beam scanning type laser marker is rapidly increasing in the field of semiconductor equipment. A device called ″beam adjuster″ is employed to adjust the visible diode laser, which points the marking position for various setting. The device is very sensitive to manufacturing tolerance and assembly condition. Axiomatic approach has been applied to the design of the device. An existing design is analyzed based on the Independence Axiom. The existing design is found to violate the axiom. Two new designs are proposed to satisfy the Independence Axiom. The Information Axiom is utilized to evaluate the designs. A design is selected to have the minimum information content. The significance of this research is that a full cycle of axiomatic design is applied to a real engineering product.

Laser Scanning Technology for Ultrasonic Horn Location Compensation to Modify Nano-size Grain (나노계면 형성을 위한 초음파 진동자 위치보정을 위한 레이저 스캐닝 기술)

  • Kim, Kyugnhan;Lee, Jaehoon;Kim, Hyunse;Park, Jongkweon;Yoon, Kwangho
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.31 no.12
    • /
    • pp.1121-1126
    • /
    • 2014
  • To compensate location error of ultrasonic horn, the laser scanning system based on the galvanometer scanner is developed. It consists of the 3-Axis linear stage and the 2-Axis galvanometer scanner. To measure surface shape of three-dimensional free form surface, the dynamic focusing unit is adopted, which can maintain consistent focal plane. With combining the linear stage and the galvanometer scanner, the scanning area is enlarged. The scanning CAD system is developed by stage motion teaching and NURBS method. The laser scanning system is tested by marking experiment with the semi-cylindrical sample. Scanning accuracy is investigated by measured laser marked line width with various scanning speed.

Effects of Acceleration and Deceleration Parameters on the Machining Error for Large Area Laser Processing (대면적 레이저 가공을 위한 가감속 파라미터가 가공오차에 미치는 영향)

  • Lee, Jae Hoon;Yoon, Kwang Ho;Kim, Kyung Han
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.31 no.8
    • /
    • pp.721-728
    • /
    • 2014
  • In this paper, it is proposed a method of optimizing path parameters for large-area laser processing. On-the-fly system is necessary for large-area laser processing of uniform quality. It is developed a MOTF(Marking On-The-Fly) board for synchronizing the stage and scanner. And it is introduced the change of the error due to the change of parameters and algorithm for large-area laser processing. This algorithm automatically generates stage path and a velocity profile using acceleration and deceleration parameters. Since this method doesn't use a G-code, even if without expert knowledge, it has an advantage that can be accessed easily. Angle of one of the square of $350{\times}350mm$ was changed from $50^{\circ}$ to $80^{\circ}$ and analyzed the error corresponding to the value of Ta. It is calculated the value of Ta of the best with a precision of 20um through measurement of accuracy according to the Ta of each angle near the edge.

Development of Laser Typing Process for the High Density Recording (고밀도 기록을 위한 레이저 타이핑 공정 개발)

  • 주영철;송오성;정영순
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.4 no.3
    • /
    • pp.317-321
    • /
    • 2003
  • A conventional typewriter types letters by hammering a carbon ribbon which is attached at a paper. The laser typing process which write a micro pattern of Chrome on a silicon wafer has been developed. A glass that is coated with 100 nm Chrome (Carbon ribbon) is attached on a silicon wafer (paper). An Nd-Yag laser (hammer) is irradiated on the glass, and the Chrome is transferred on the silicon wafer. Micro patterns are made by controlling laser beam trajectory. The suggested micro pattering can be used at the high density data storage of TeraBit/in$^2$ or at the improvement of productivity of semiconductor manufacturing procedure.

  • PDF

A Study on Rapid Fabrication of Micro Lens Array using 355nm UV Laser Irradiation (355nm UV 레이저를 이용한 마이크로 렌즈 어레이 쾌속 제작에 관한 연구)

  • Je, S.K.;Park, S.H.;Choi, C.K.;Shin, B.S.
    • Transactions of Materials Processing
    • /
    • v.18 no.4
    • /
    • pp.310-316
    • /
    • 2009
  • Micro lens array(MLA) is widely used in information technology(IT) industry fields for various applications such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method having the processes of micro etching, electroplating, micro machining and laser local heating. Laser thermal relaxation method is introduced in marking of microdots on the surface of densified glass. In this paper, we have proposed a new direct fabrication process using UV laser local thermal-expansion(UV-LLTE) and investigated the optimal processing conditions of MLA on the surface of negative photo-resist material. We have also studied the 3D shape of the micro lens obtained by UV laser irradiation and the optimal process conditions. And then, we made chrome mold by electroplating. After that, we made MLA using chrome mold by hot embossing processing. Finally, we have measured the opto-physical properties of micro lens and then have also tested the possibility of MLA applications.

Modern Laser Technology and Metallurgical Study on Laser Materials Processing

  • Kutsuna, Muneharu
    • Proceedings of the KWS Conference
    • /
    • 2002.10a
    • /
    • pp.561-569
    • /
    • 2002
  • Laser has been called a "Quantum Machine" because of its mechanism of generation since the development on July 7,1960.by T.H.Maiman. We can now use this machine as a tool for manufacturing in industries. At present, 45kW CO2 laser, 10kW Nd:YAG laser, 6kW LD pumped YAG laser and 4kW direct diode laser facilities are available for welding a heavy steel plate of 40mm in thickness and for cutting metals at high speed of 140m/min. Laser Materials Processing is no longer a scientific curiosity but a modern tool in industries. Lasers in manufacturing sector are currently used in welding, cutting, drilling, cladding, marking, cleaning, micro-machining and forming. Recently, high power laser diode, 10kW LD pumped YAG laser, 700W fiber laser and excimer laser have been developed in the industrialized countries. As a result of large numbers of research and developments, the modem laser materials processing has been realized and used in all kinds of industries now. In the present paper, metallurgical studies on laser materials processing such as porosity formation, hot cracking and the joint performances of steels and aluminum alloys and dissimilar joint are discussed after the introduction of laser facilities and laser applications in industries such as automotive industry, electronics industry, and steel making industry. The wave towards the use of laser materials processing and its penetration into many industries has started in many countries now. Especially, development of high power/quality diode laser will be accelerate the introduction of this magnificent tool, because of the high efficiency of about 50%, long life time and compact.

  • PDF

Built-in CPVS(Concurrent Processing Vision System) of the marking and quality inspection (마킹과 품질검사의 동시 처리 비젼 시스템의 개발)

  • 박화규;채규열;구한서;이윤석;정창성
    • Proceedings of the Korean Information Science Society Conference
    • /
    • 2001.10b
    • /
    • pp.397-399
    • /
    • 2001
  • 레이저를 이용한 마킹(marking) 시스템은 미러(mirror)를 움직이는 XY Scanner안 모터의 Thermal drift로 인한 오차와 laser 오류에 의해 마킹의 불량을 초래하게 된다. 따라서, 이 마킹 불량을 검사하기 위해 마킹 시스템에는 비젼(Vision)을 이용한 검사 장비가 탑재된다. 현재 웨이퍼 마킹기나 다른 마킹기의 비젼시스템은 후검사(post vision) 시스템을 도입하고 있다. 하지만, 후검사 시스템의 경우 마킹이 잘못되었을 때, 바로 마킹을 중지하지 못하고 적어도 한 단위 마킹(tray, 웨이퍼, Strip, PCB 등등)을 망치게 되고, 만일 마킹 대상물이 고가인 경우 상당한 금액의 손실을 가져오는 단점을 가지고 있다. 이러한 단절을 보완하기 위해 본 논문에서는 CPVS(Concurrent Processing Vision System)라는 시스템을 구현하였다. 이 시스템은 마킹과 마킹 품질검사를 동시에 병행함으로써 마킹이 잘못되었을 때 마킹을 중단하게 되어 더 이상의 손실이 나지 않게 하고 후처리 검사 시스템으로의 이송과정을 생략함으로써 processing time을 줄이고, 생산성을 높인다는 장점을 가지게 된다. 이 시스템의 구현은 Visual C++의 MFC 라이브러리를 사용한 MDI구조로 구현하였다.

  • PDF