• 제목/요약/키워드: laser beam width

검색결과 184건 처리시간 0.025초

고밀도 기록을 위한 레이저 타이핑 공정 개발 (Development of Laser Typing Process for the High Density Recording)

  • 주영철;송오성;정영순
    • 한국산학기술학회논문지
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    • 제4권3호
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    • pp.317-321
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    • 2003
  • 우리가 타자기로 글을 쓸 때는 먹지리본을 햄머가 가격하여 종이 위에 글씨 형태의 먹이 묻는 원리로 진행된다. 이러한 원리를 미세 패터닝에 응용하여, 해머 역할을 하는 Nd-YAG 레이저로 유리기판/ 100 ㎚ Cr(먹지)// 실리콘기판(종이)구조의 적층물에 조사시켜 Cr이 실리콘기판 위에 전사됨으로써 미세 패터닝이 가능한지 확인하였다. 제안된 미세 패터닝은 TeraBit/in²급 고밀도 정보저장 또는 반도체 공정의 생산성 향상을 위해 응용이 가능하다. 선폭 50 ㎛급 레이저를 주사속도 200과 1500 ㎜/s Q-스위치 조건을 10,000-50,000 Hz로 변화시키며 마킹을 실시한 결과 Cr의 전사는 진행되지 않았으나, 최종적으로 입사 선폭의 33% 이하로 마킹이 가능하여 비싼 광학계를 가진 레이저를 대치하여 보다 정밀한 마킹이 가능함을 확인하였다.

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고출력 $CO_2$레이저 용접에서 키홀의 불안정으로 발생한 기공의 절감방법 (Reduction Method of Porosity Formed by Instability of Keyhole in High Power $CO_2$ Laser Welding)

  • 김정일;조민현
    • Journal of Advanced Marine Engineering and Technology
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    • 제26권4호
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    • pp.464-471
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    • 2002
  • Porosity formation in partial penetration welds by high power lasers is a serious problem in industry. There are two main causes that induce porosity formation. One form of porosity is due to gases (e.g. hydrogen, oxygen) dissolving into the weld pool because of the high temperature and then the rapid solidification traps gases as a bubble in the weld metal. The second problem is voids formed by the keyhole collapsing due to unstable keyhole fluid dynamics. The voids that form at the bottom of the keyhole are relatively large and irregular in shape compared to the gas bubbles; this void formation is the primary concern in this paper. The reduction of voids formed by keyhole collapse is achieved by improving the stability of keyhole. Two methods to improve keyhole stability are discussed in this paper: pulse modulation and beam incident angle. Pulse modulation of the laser beam was performed between 100 Hz and 500 Hz to find out the optimum frequency for the keyhole dynamics. The incident beam angle changed the impact angle of the laser beam to the work surface in a range of 0 to 25 degrees. Glycerin in a semi-solidified state is used as a medium for performing the welding because its transparency allows of visualization of the keyhole.

He-Cd 레이저와 근접장현미경을 이용한 폴리머박막 나노리소그라피 공정의 특성분석 (Characteristics of nanolithograpy process on polymer thin-film using near-field scanning optical microscope with a He-Cd laser)

  • 권상진;김필규;천채민;김동유;장원석;정성호
    • 한국레이저가공학회지
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    • 제7권3호
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    • pp.37-46
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    • 2004
  • The shape and size variations of the nanopatterns produced on a polymer film using a near-field scanning optical microscope(NSOM) are investigated with respect to the process variables. A cantilever type nanoprobe having a 100nm aperture at the apex of the pyramidal tip is used with the NSOM and a He-Cd laser at a wavelength of 442nm as the illumination source. Patterning characteristics are examined for different laser beam power at the entrance side of the aperture($P_{in}$), scan speed of the piezo stage(V), repeated scanning over the same pattern, and operation modes of the NSOM(DC and AC modes). The pattern size remained almost the same for equal linear energy density. Pattern size decreased for lower laser beam power and greater scan speed, leading to a minimum pattern width of around 50nm at $P_{in}=1.2{\mu}W\;and\;V=12{\mu}m/s$. Direct writing of an arbitrary pattern with a line width of about 150nm was demonstrated to verify the feasibility of this technique for nanomask fabrication. Application on high-density data storage is discussed.

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INVAR 마스크 응용 반도체 기판 소재의 고체 UV 레이저 프로젝션 어블레이션 (DPSS UV Laser Projection Ablation of IC Substrates using an INVAR Mask)

  • 손현기;최한섭;박종식
    • 한국레이저가공학회지
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    • 제15권4호
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    • pp.16-19
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    • 2012
  • Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

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Cutting Technique for Biodegradable Rope using a CW CO2 Laser with TEM00 mode

  • Lee, Dong-Gil;Kim, Seong-Hun;Park, Seong-Wook;Yang, Yong-Su;Xu, Guo-Cheng
    • Journal of Electrical Engineering and Technology
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    • 제7권4호
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    • pp.576-581
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    • 2012
  • A 23 W continuous wavelength $CO_2$ laser system exited by a high-frequency LCC resonant converter is adapted to cut a biodegradable rope fabricated with polybutylene succinate. As the biodegradable rope consists of three twisted strands, the thickness changes relative to the position of the laser beam and we thus propose a method to determine exact cutting depth. In order to obtain the parameters related to the rope cutting, the experimental and theoretical cutting depths are compared and analyzed for a range of laser heat sources. The melted thickness and groove width of the cut biodegradable rope are also examined. The proposed theoretical cutting depth depends on the incident power and target velocity ratio. From these experimental results, the biodegradable rope with a diameter of 22 mm can be cut with a heat source of 50 J/cm resulting in a melted thickness of 1.96 mm and a groove width of 0.65 mm. The laser system is shown to be perfect tool for the processing of biodegradable rope without the occurrence of raveling.

CW 및 Pulsed 레이져를 이용한 세라믹 절단

  • 방세윤
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1994년도 추계학술대회 논문집
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    • pp.156-160
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    • 1994
  • Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

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Cavity-dumping형 Nd:glass laser의 제작 및 특성 조사 (Investigation on the characteristics of a cavity-dumped Nd:glass laser)

  • 차용호;강응철;남창희
    • 한국광학회지
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    • 제6권2호
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    • pp.130-134
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    • 1995
  • 이득 선폭이 넓고 가공이 쉬원 고출력 제이저의 증폭 이득 매질로 유리한 Nd:glass 이득 매질의 소신호 이득 계수를 측정하고 이 Nd:glass를 이용하여 제작한 cavity-dumping형 레이저의 출력 특성을 조사하였다. 소신호 이득 계수를 측정하기 위해 Nd:glass, Pockels cell, 편광분할기 등을 포함하는 공진기를 구성하였으며, 측정된 소신호 이극 계수는 전기 입력 에너지가 100J일 때 $0.088 cm_{-1}$ 공진기의 왕복 내부 손실은 56%였다. Cavity-dumping형 레이저 공진기는 곡률반경이 2m인 두개의 전반사경과 Nd:glass, Pickels cell, 편광분할기, $\lambda/4$ plate 등으로 구성되었으며 제작된 레이저의 출력 에너지는 전기 입력 에너지가 140J일 때, 최대 0.85J이었고 출력 레이저 펄스폭은 8ns였다.

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집속된 아르곤 이온 레이저에 의한 실리콘의 미세가공 및 평가 (Microprocess of silicon using focused Ar$^+$ llaser and estimates)

  • 정재훈;이천;황경현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1997년도 추계학술대회 논문집
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    • pp.473-476
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    • 1997
  • Focused Ar ion laser beam can be utilized to fabricate microstructures on silicon substrate as well as other materials(e.g. such as ceramic). The laser using in this study is an argon ion laser with maximum power of 6 W, wavelength of 514 nm. This laser beam is focused by objectives with a high numerical aperture, a long working distance. We have achieved line width about 1 ${\mu}{\textrm}{m}$ with high scan speed. The resolution for Si machining is determined by the selectivity of the chemical reaction rather than the laser spot size. In this study, we have obtained the maximum etch rate of 434.7 ${\mu}{\textrm}{m}$/sec with high aspect ratio. The characteristics of etched groove was investigated by scanning electron microscope(SEM) and auger electron spectroscopy(AES). It is assumed that the technique using arson ion laser is applicab1e to fabricate microstructures.

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유한요소법을 이용한 레이저 표면경화처리 공정변수의 민감도 해석 (Sensitivity Analysis of Processing Parameters for the Laser Surface Hardening Treatment by Using the Finite Element Method)

  • 이세환;양영수
    • Journal of Welding and Joining
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    • 제19권2호
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    • pp.228-234
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    • 2001
  • A methodology is developed and used to evaluate the response sensitivity of the thermal systems to variations in their design parameters. Technique for computing the sensitivity of temperature distributions to changes in processing parameters needed to decide the more effective laser input parameters for laser surface hardening treatment is considered. In this study, a state equation governing the heat flow in laser surface treatment is analyzed using a three-dimensional finite element method and sensitivity data of the processing parameter obtained using a direct differentiation method is applied to the sensitivity analysis. The interesting processing parameters are taken as the laser scan velocity and laser beam radius ( $r_{ b}$), and the sensitivities of the temperature T versus v and $r_{b}$ are analyzed. These sensitivity results are obtained with another parameters fixed. To verify the numerical analysis results, hardened layer dimensions (width and depth) of the numerical analysis are compared with the experimental ones.nes.

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A Design and Implement of the Medical Nd:YAG Laser Firmware under in ZCC method

  • Kim, Whi-Young
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.40.3-40
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    • 2001
  • The pulsed Nd:YAG laser is the most commonly used type of solid-state laser in many fields. In material processing and medical treatment, the power density control of a laser beam Considered to be significant, which depends on the flashlamp current pulse width and pulse repetition rate. For general laser power supply to control the laser power density, the secondary of the power transformer is connected to the rectifier and filter capacitor. The output of a rectifier is applied to a switching element in the secondary of the transformer. So power supply is complicated and the loss of switching is considerably. In addition, according to increasing pulse repetition rate, charged energy of energy-storage capacitor bank is not transferred sufficiently to flashlamp, and laser output efficiency decreases. In this study, we have ...

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