• 자원리싸이클링
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• 제26권6호
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• pp.97-101
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• 2017

메탈폼은 매우 많은 기공을 포함하는 세포상 구조를 갖는 고체금속을 일컫는다. 특히 관통 기공 같은 개기공들은 고온용 필터 및 촉매 지지체 등으로 산업적으로 많이 사용되고 있다. 본 연구에서는 슬러리 코팅공정으로 90% 이상의 기공율과 2 mm 이상의 기공크기를 갖는 Fe 폼을 제조하였다. 이때 Fe 분말과 $Fe_2O_3$ 분말의 혼합비를 달리하여 기공율과 기공크기를 제어하였다. 이를 위해 우선 분말, 증류수 및 폴리비닐알콜(PVA)를 균일하게 혼합하여 슬러리를 제조하였다. $Fe_2O_3$ 분말의 혼합 비율이 증가할수록 PU 폼에 코팅된 슬러리의 양이 증가한 반면 Fe 폼의 수축 및 기공율은 각각 감소하였다.

• 한국건축시공학회지
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• 제18권3호
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• pp.305-312
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• 2018

This study is about the development of a non-sintered binder (NSB) which does not require a sintering process by using the industrial by-products Phosphogypsum (PG), Waste Lime (WL) and Granulated Blast Furnace Slag (GBFS). In this report, through SEM analysis of the NSB paste hardening body, micropore analysis of paste using the mercury press-in method and microstructure observation were executed to consider the influence of the formation of the pore structure and the distribution of pore volume on strength, and the following conclusions were reached. 1) Pore structure of NSB paste of early age is influenced by hydrate generation amount by GBFS and activator. 2) Through observing the internal microstructure of NSB binder paste, it was found that the strength expression at early age due to hydration reaction was achieved with a large amount of ettringite serving as the frame with C-S-H gel generated at the same time. It was confirmed that C-S-H gel wrapped around ettringite, and as time passed, the amount generated continually increased, and C-S-H gel tightly filled the pores of hardened paste, forming a dense network-type web structure. 3) For NSB-type cement, the degree of formation of gel pores below $10{\mu}m$ had a greater influence on strength improvement than simple pore reduction by charging capillary pores, and the pore size that had the greatest effect on strength was micropores with diameter below $10{\mu}m$.

• 한국산업융합학회 논문집
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• 제23권6_2호
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• pp.1051-1058
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• 2020

The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

• Journal of Welding and Joining
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• 제32권6호
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• pp.41-46
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• 2014

In this study, cracking susceptibility of laser cladding was investigated according to the processing parameters such as laser power, scan speed and feeding rate with blended powders of stellite#6 and technolase40s (WC+NiCr). The solidification microstructure of clad was composed of Co-based dendrite structures with ${\gamma}+Cr7C3$ eutectic phases at the dendritic boundaries. The crack propagation showed transgranular fracture along dendritic boundaries due to brittle chrome carbide at the eutectic phases. From results of fractography experiments, the fracture surface was typical cleavage brittle fracture in the clad and substrate. The number of clad cracks, caused by a tensile stress after the solidification, increased with increase of laser power, scan speed and feeding rate. Increase of the laser power caused large pores by facilitating WC decarburizing reaction. And the pores affected increase of crack susceptibility. High scan speed caused increment of clad cracks due to thermal stress and WC particle fractures. Also, increase of the feeding rate accompanied an amount of WC particles causing crack initiation and decarburizing reaction.

• 한국자동차공학회논문집
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• 제15권2호
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• pp.151-158
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• 2007

Filtration studies, using simulated test nanoparticles or diesel nanoparticles, have been performed about Inconel foam filters for DPF combined with electrostatic precipitation. The simulated test particles were synthesized by laser ablation in the nitrogen atmosphere at the standard condition. The diesel particles were exhausted from the diesel engine driven on the condition of idle or load mode. Filtration efficiency of the metal foam filter is very low because most of particles are penetrated through the large pores of filter. However, the efficiency was considerably improved by applying the electric field to the filter and/or charging the nanoparticles. Nevertheless, the pressure drop of filter hardly increased because the filter-pores were not clogged by deposited particles and kept open.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.86-89
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• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.

• 한국재료학회지
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• 제13권12호
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• pp.831-838
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• 2003

Anisotropic mesophase carbon fiber(AMCFs) was exposed to isothermal oxidation in air and $CO_2$atmosphere, and burn-off rates have measured by TGA. The microstructure changes of oxidized carbon fibers, were observed by SEM. It was observed that oxidation rate in the air is over 100 times faster than that in $CO_2$atmosphere. The activation energy obtained in air was about 43.4 Kcal/mole in the temperature range of $600∼800^{\circ}C$, and in $CO_2$was about 55.2 Kcal/mole in the temperature range of $950∼1200^{\circ}C$. Therefore, the oxidation reaction in both atmospheres was under chemical reaction regime in the above temperature ranges. It was shown that the oxidation of the AMCFs is initiated at the end of fibers at high temperature($1100^{\circ}C$) with developing the large pores, and the small pores are developed on the fiber surface at low temperature($900^{\circ}C$). In conclusion, the oxidation of the AMCFs is progressed through the imperfection.

• 한국재료학회지
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• 제30권2호
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• 한국막학회:학술대회논문집
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• 한국막학회 1995년도 춘계 총회 및 학술발표회
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• pp.11-15
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• 1995

Polysulfone (PS) membranes were prepared by the phase inversion process using water or isopropanol as nonsolvent. The Flory-Huggins theory for a ternary system nonsolvent/solvent/polymer is applied to describe the thermodynamic equilibria of the components. The calculated ternary phase equilibria show that demixing of a PS binary solution with n-methylpyrrolidone (NMP) will be fast in a water coagulation bath and will be delayed in an isopropanol bath. The prepared membranes were characterized by SEM, gas adsorption-desorption measurement, and permeability test. The membrane, which is precipitated by fast demixing in a water bath, has nodular structures in the skin region and includes finger-like cavities in the sublayer. The membrane coagulated by isopropanol has a very dense and thick skin structure, which is formed by delayed demixing. The membrane coagulated by isopropanol showed considerably lower pore volume and surface area compared to that observed with water coagulation method. With dimethylformamide (DMF) as solvent and 2-3 wt% of water, the solution can show the liquid-liquid phase separation due to agglomation of the polymer-lean phase from the homogeneous solution. The membranes, which were coagulated near an equilibrium state, show the large (micron size) round pores in the whole membranes. The pores do not contribute the permeation characteristics.

• 한국세라믹학회지
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• 제56권5호
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• pp.453-460
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• 2019

To reduce residual pores of composites and obtain a dense matrix, SiC_f/SiC composites were fabricated by chemical vapor deposition (CVI) using SiC nanorods. SiC nanorods were uniformly grown in the thickness direction of the composite preform when the reaction pressure was maintained at 50 torr or 100 torr at 1,100℃. When SiC nanorods were grown, the densities of the composites were 2.57 ~ 2.65 g/㎤, higher than that of the composite density of 2.47 g/㎤ for non-growing of SiC nanorods under the same conditions; grown nanorods had uniform microstructure with reduced large pores between bundles. The flexural strength, fracture toughness and thermal conductivity (room temperature) of the SiC nanorod grown composites were 412 ~ 432 MPa, 13.79 ~ 14.94 MPa·m^1/2 and 11.51 ~11.89 W/m·K, which were increases of 30%, 25%, and 25% compared to the untreated composite, respectively.