• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.48-51
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• 2002

This paper predicted the thermal conductivity of spun carbon/phenolic composites by the thermal resistance method. This method uses the analogy between the diffusion of heat and electrical charge. To verify the theoretical predictions, the thermal conductivity of spun carbon/phenolic composites was examined experimentally. The reported thermal conductivities of graphite/epoxy composite of a eight harness satin laminate was used of the comparison with the prediction values of the model and it was noticed that a good agreement has been found.

• Composites Research
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• v.30 no.5
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• pp.297-302
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• 2017

Finite element analysis of T-beam laminate structure under bending-torsional loading was conducted to prevent the delamination which is the major failure behavior on laminated composites. Three-dimensional preform, which is that fabric is braided through thickness direction, is suggested from the laminate analysis. The analysis aimed to optimize the fiber ratio in laminated composites. After it is suggested that guideline for design of T-beam structure using commercial software ANSYS Composites PrePost. The results show that strength of T-beam structure is increased 21.6% when the fiber density along with beam length direction is two times bigger than transverse direction. It is expected that development of high strength T-beam structure using designed three-dimensional preform.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1388-1393
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• 2003

In this study, analytic stress-displacement solutions are obtained by using a shear lag modeling constructed for the spliced joint area with a splicing gap filled with adhesive material of elastic modulus $E_{a}$ in the fiber metal laminate (FML) which is known to have excellent fatigue, corrosion and fire-flame resistant characteristics while with relatively low densities compared to the conventional aluminum alloys for lightweight structures.

• Journal of the Korean Ceramic Society
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• v.38 no.4
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• pp.351-359
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• 2001

배향 입자층과 비배향 입자층이 상호적층된 알루미나 적층복합체를 연속 테입캐스팅 및 상압소결에 의해 제조하였다. 알루미나의 미세구조 배향을 위하여 알루미나 판상입자를 배향물질(template)로 사용하였으며, 알루미나의 입자배향 거동에 미치는 액상의 영향을 알아보기 위해 anorthite(CaAl$_2$Si$_4$O$_{8}$)를 첨가하였다. 적층체 내의 알루미나 입자배향을 X-선 회절법으로 분석한 결과 (006)면과 (1010)면으로 배향되어 있었다. 액상조성이 첨가되지 않은 경우와 비교시 anorthite를 첨가한 경우 입자배향층 내에는 액상으로 인한 큰 기공이 생성되었으며 배향도는 감소되었다. 그러나, 액상조성으로 anorthite가 첨가되어 입자배향이 이루어진 적층체 계면에서는 입자배향으로 인한 효과적인 균열전파 제어 거동이 관찰되었다.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.24-28
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• 2002

Composite reinforced fiber materials are used in lots of fields such as a part of aeronautic space, ship, machinery and so on because can make structure wished for necessary condition by control fiber direction and laminated sequence. As the use of advanced composites increase, specific techniques have been developed to repair changed composite structures. In order to repair the damaged part production high quality composite reinforced fiber are completed by control the surrounding temperature and press in autoclave. The quality is influenced heat exposure degree by chemical reaction for precessing. This study considerated influence limit of using by repair structure part and change of properties according to heat exposure degree for repairing.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.195.2-195
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• 2003

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.207.1-207
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• 2003

• Journal of the Korean Ceramic Society
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• v.51 no.1
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• pp.32-36
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• 2014

The effects of an amphiphilic agent and the orientation of BN on the microwave dielectric properties of BN / polyvinyl butyral (PVB) composites were investigated as a function of the BN content in volume fractions from 0.1 to 0.5 ($V_f$). The plate-shaped BN samples were oriented in the PVB matrix by physical processes, in this case tape casting and laminate methods. With an increase in the BN content, the dielectric constant (K) increased because the K of BN was higher than that of the PVB. At the same BN content, composites with an in-plane orientation of the BN showed a higher dielectric constant than that of composites with a transverse orientation of the BN because the ceramics were oriented parallel to the electric field. All of the composites showed nearly constant K values ranging from 1 to 9.4 GHz, indicating good frequency stability over a wide frequency range. At the same frequency, the K values of the composites increased with an increase in the BN content.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.52-55
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• 2002

This paper examines the effective thermal conductivity of 3-D braided glass/epoxy composites. 3-D braided composites have a number of advantage over conventional laminate composites, including through-thickness reinforcement, and high damage tolerance and processability. The thermal properties of composites depend primarily on the microstructure of the braided preform and properties of constituent materials. A thermal resistance network model based on structure of the braided preform is proposed by using thermal-electrical analogy. In order to affirm the applicability theses solutions, thermal conductivities of 3-D braided glass/epoxy composites are measured

• Journal of the Korean Ceramic Society
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• v.39 no.9
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• pp.813-817
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• 2002

Magnetoelectric(ME) laminate composites of $Pb(Mg_{1/3}Nb_{2/3})O_3-PbTiO_3 (PMN-PT)$ and Terfenol-D were prepared by sandwiching single crystals of PMN-PT between Terfenol-D disks. The magnetoelectric voltage coefficient (dE/dH) of the composite was determined to be 10.30 V/cm${\cdot}$Oe, at 1 kHz and under a dc magnetic bias of 0.4 T. The value of dE/dH is ∼80 times higher than either that of naturally occurring magnetoelectrics or artificially-grown magnetoelectric composites. This superior magnetoelectric voltage coefficient is attributed to the high piezoelectric voltage constant as well as the high elastic compliance of PMN-PT single crystal and the large magnetostrictive response of Terfenol-D.