• The Journal of the Acoustical Society of Korea
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• v.35 no.5
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• pp.349-357
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• 2016

In this work, we proposed various structural methods to reduce the crosstalk between elements in a planar array of underwater acoustic transducers and investigated the efficacy of each method through finite element analysis. It is shown that the effects of crosstalk reduction increase as the depth of the kerf among elements and the width of the kerf increase, and the elastic stiffness of the kerf filler decreases. Results of this study are expected to be useful in designing the structure of underwater acoustic planar array transducers to maximize their performance.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.4
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• pp.10-15
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• 2007

Taguchi methods have been used for a long time to improve the product quality and process performance of a manufacturing system, Few researchers have applied this methodology in laser beam cutting (LBC) of sheet metals and found the considerable improvement in cut qualities. In all experimental investigations of LBC so far, the objective was to optimize the single quality characteristic at a time. In this paper the simultaneous optimization of multiple quality characteristics such as Kerf width and material removal rate (MRR) during pulsed Nd:YAG LBC of thin sheet of magnetic material (high Silicon-steel) has been presented using Taguchi's quality loss function. The results show the considerable improvement in multiple S/N ratio as compared to initial cutting condition. Also, the comparison of results from single and multi-objective optimization have been presented and it was found that the loss in quality is always possible shifting from single quality to multiple quality optimization.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.3
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• pp.15-22
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• 1995

This paper presents the effects of assistant gas pressure on laser cutting. To investigate the effects of assistant gas pressure, pressure measuring system was constructed with good handling and precision at low price. The measured results discussed compare with that of laser cutting of STS304. The assistant gas pressure varied with the variation of distance between nozzle and workpiece. The peak pressure existed at some distance and could be known by using the deviced pressure measuring system. The higher assistant gas pressure helps to remove the dross and the exothermic energy out of the material. The quantity of dross beneath the workpiece decreases and the kerf width narrows at measured peak pressure.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.10-13
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• 2000

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.128-132
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• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.3
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• pp.215-222
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• 2014

This paper presents an experimental study of a vibration-assisted dry micro-wire electrical discharge machining (${\mu}$-WEDM) utilized in high precision and micro-manufacturing area. The assisted vibration was applied to the workpiece using a piezoelectric actuator, and high pressure air was injected directly into the machining gap through a nozzle. Investigation experiments were performed to estimate the importance of input parameters and it was observed from experiment results that the width (kerf) of the cutting slot and the machining time were significantly affected by the air injection pressure and input energy. Moreover, it was also observed that there exists an optimal relationship between the machining time and input parameters including the air pressure and vibration frequency and amplitude. Central composite design based experiments were also carried out, and empirical models of the machining time and cutting slot kerf have been developed using the response surface methodology to analyze and optimize the process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.439-440
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• 2008

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.643-648
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• 2002

In the cutting of plate steel, the quality of the cut surfaces is strongly dependent on the cutting conditions such as cutting speed, kerf width, plate thickness, length of tip-specimen and oxygen pressure etc. the cutting tests of plate steel were carried out using CNC gas cutting machine. this paper deals with cutting characteristics of plate steel using CNC cutting machine. the width of cutting entrance and exit, the surface roughness of cutting surfaces and the cutting surface are examined at various cutting conditions.