• Journal of Welding and Joining
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• 제27권5호
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• pp.74-80
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• 2009

The membrane of the LNG carriers consists of thin strips of INVAR(Fe-36%Ni) steel plates, and the junction between INVAR strips is fabricated by welding. Thousands of the raised edge joints, regularly spaced, are located around all the side of the tank corner near the transverse bulkhead, and TIG welding is manually made on the top of the raised edges. Since the thickness of all the laminated edge plies is extremely thin and the weld position is under a bad accessibility, highly skilled workers are required to perform welding relatively for a long welding time. An alternative scheme for the corner membrane fabrication is proposed in the study to improve the installation workability and thus productivity. The scheme replaces the welded edges with the preformed corrugation ones. A panel strip with regularly-spaced corrugations is installed at the corner instead of the individual flat strip of which edge is vertically raised to be welded with the adjacent strip. In the study, a series of the evaluation on the corrugated edge members was performed to assess the applicability to the real LNG carrier fabrication. Opening displacement at the raised edge was experimentally examined. Elastic stiffness regressed from the displacement was nearly same in both edge types. Edge displacement and local stresses were calculated under hydrostatic pressure and temperature change due to liquefied cargo. Fatigue test was performed on both corrugated and welded edge specimens consisting of two or five plies of invar strips. Fatigue strength of the corrugated specimens was not less than that of the welded specimens.

• 대한전자공학회논문지
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• 제18권4호
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• pp.49-61
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• 1981

N+P, N+PP+ 형 태양전지를 제조하여 얻은 실험자료들을 근거로 실리콘 접합형 태양전지에 일반적으로 적용할 수 있는 컴퓨터 모의 실험 프로그램을 개발하고, 이의 유용성을 확인하였다. 이 모의 실험 프로그램은 N+P, P+N, N+PP+, P+NN+형의 실리콘 태양전지에 적용할 수 있는 것으로, 입사광은 AMI, 등강도 광원, 인공조명으로 많이 사용되는 GE -ELH 광원이고, AR코팅은 Si3N4형과 투과도가 파장에 관계없는 일정형 2종류가 있으며, 프로그램에서 이들 전지의 구조, 광원, AR 코팅 종류에 대한 파장 특성분포도 쉽게 변화시킬 수 있도록 되어 있다. 이 모의실험의 결과들을 토대로 N+와 P 영역에서의 평균도오핑농도와 전지의 두께, AMI 스펙트럼에 대한 집광도, 앞면 접합깊이에 대하여 효율이 최대가 되는 최적치들을 구하였으며, 앞면의 표면 재결합 속도, 접합부에서의 캐리어의 유효 수명, 누설저항에 대하여는 허용 한계치로, 기타 효율변화인자로서 동작온도 직렬저항과 전기장의 세기에 대하여는 효율의 변화율로서 파라미터들이 효율에 미치는 영향들을 분석하였다.

• Asian-Australasian Journal of Animal Sciences
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• 제29권8호
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• pp.1075-1082
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• 2016

Modern livestock production became highly intensive and large scaled to increase production efficiency. This production environment could add stressors affecting the health and growth of animals. Major stressors can include environment (air quality and temperature), nutrition, and infection. These stressors can reduce growth performance and alter immune systems at systemic and local levels including the gastrointestinal tract. Heat stress increases the permeability, oxidative stress, and inflammatory responses in the gut. Nutritional stress from fasting, antinutritional compounds, and toxins induces the leakage and destruction of the tight junction proteins in the gut. Fasting is shown to suppress pro-inflammatory cytokines, whereas deoxynivalenol increases the recruitment of intestinal pro-inflammatory cytokines and the level of lymphocytes in the gut. Pathogenic and viral infections such as Enterotoxigenic E. coli (ETEC) and porcine epidemic diarrhea virus can lead to loosening the intestinal epithelial barrier. On the other hand, supplementation of Lactobacillus or Saccharaomyces reduced infectious stress by ETEC. It was noted that major stressors altered the permeability of intestinal barriers and profiles of genes and proteins of pro-inflammatory cytokines and chemokines in mucosal system in pigs. However, it is not sufficient to fully explain the mechanism of the gut immune system in pigs under stress conditions. Correlation and interaction of gut and systemic immune system under major stressors should be better defined to overcome aforementioned obstacles.

• Molecular & Cellular Toxicology
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• 제4권3호
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• pp.183-191
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• 2008

Volatile organic compounds (VOCs) are common constituents of cleaning and degreasing agents, paints, pesticides, personal care products, gasoline and solvents. And VOCs are evaporated at room temperature and most of them exhibit acute and chronic toxicity to human. Benzene is the most widely used prototypical VOC and the toxic mechanisms of them are still unclear. The multi-step process of toxic mechanism can be more fully understood by characterizing gene expression changes induced in cells by toxicants. In this study, DNA microarray was used to monitor the expression levels of genes in HepG2 cells and HL-60 cells exposed to the benzene on IC20 and IC50 dose respectively. In the clustering analysis of gene expression profiles, although clusters of HepG2 and HL-60 cells by benzene were divided differently, expression pattern of many genes observed similarly. We identified 916 up-regulated genes and 1,144 down-regulated genes in HepG2 cells and also 1,002 up-regulated genes and 919 down-regulated genes in HL-60 cells. The gene ontology analysis on genes expressed by benzene in HepG2 and HL-60 cells, respectively, was performed. Thus, we found some principal pathways, such as, focal adhesion, gap junction and signaling pathway in HepG2 cells and toll-like receptor signaling pathway, MAPK signaling pathway, p53 signaling pathway and neuroactive ligand-receptor interaction in HL-60 cells. And we also found 16 up-regulated and 14 down-regulated commonly expressed total 30 genes that belong in the same biological process like inflammatory response, cell cycle arrest, cell migration, transmission of nerve impulse and cell motility in two cell lines. In conclusion, we suggest that this study is meaningful because these genes regarded as strong potential biomarkers of benzene independent of cell type.

• 한국안전학회지
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• 제32권6호
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• pp.22-28
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• 2017

According to the National Fire Data System (NFDS), more than 5,000 vehicle fires have occurred every year for the last 10 years. Vehicle fires are primarily caused by mechanical (breaking system and engine), electrical (wiring and battery), and chemical (oil and fuel gas leakage) problems. The electrical factor has increased with the installation of driver convenience equipment. For example, today, the black box is widely used to provide video data recording of motor vehicle accidents. The black box consists of a front camera, rear camera, and wires. The black box wires are directly connected to the junction box or fuse box from the start battery that operates to provide normal on power supplying for engine stop. It is extremely dangerous when the wires short circuit due to insulation aging, mechanical and electrical stress, etc. In this study, the black box wiring fire risk have been analyzed and investigated when the steady state and abnormal operations, and under the following conditions: wiring arrangements with a high temperature condition, insulation aging, poor contact, and short circuits. The results showed that black box wiring short circuits had a higher fire risk than the other fire hazard elements. To prevent fire hazards caused by black box wiring, the black boxes must be installed by qualified service personnel. Do not modify the wiring, remove the fuse and secure the wiring using cable ties or insulation tape.

• Journal of Microbiology and Biotechnology
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• 제11권6호
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• pp.1018-1023
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• 2001

Oleamide (cis-9-octadecenamide) is endogenous primary amide of fatty acid that is produced in small amounts in animal brains. It is known to induce sleep and to lower temperature by destroying the lipid plasma membrane structure of cells, thereby disclosing gap junction channels. To develop a new biological production method for oleamide, a screening program was conducted to isolate a microorganism producing oleamide. Among 1,500 soil microorganisms tested, KK90378 exhibited a potent positive reaction with Dragendoff`s reagent, used to detect the primary amide of oleamide. KK90378 was identified as a Streptomyces species based on cultural and morpohological characteristics, the presence of diaminopimelic acid in the cell wall, and the sugar patterns for the whole-cell extrat. Streptomyces sp. KK90378 produced oleamide 3 days after culture at $28^{\circ}C$, pH 7.2 A series of purification steps, including hexane extraction, silica gel column, and preparative thin layer chromatographies, were performed for the purification of oleamide. A spectrophotometric analysis using $^1H$, $^13C$-NMR, and GC-MS confirmed that the chemical structure of the purified oleamide was identical to that of authentic oleamide.

• 한국재료학회지
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• 제18권7호
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• pp.379-383
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• 2008

We report on the light-emitting diode (LED) characteristics of core-shell CdSe/ZnS nanocrystal quantum dots (QDs) embedded in $TiO_2$thin films on a Si substrate. A simple p-n junction could be formed when nanocrystal QDs on a p-type Si substrate were embedded in ${\sim}5\;nm$ thick $TiO_2$ thin film, which is inherently an n-type semiconductor. The $TiO_2$ thin film was deposited over QDs at $200^{\circ}C$ using plasma-enhanced metallorganic chemical vapor deposition. The LED structure of $TiO_2$/QDs/Si showed typical p-n diode currentvoltage and electroluminescence characteristics. The colloidal core-shell CdSe/ZnS QDs were synthesized via pyrolysis in the range of $220-280^{\circ}C$. Pyrolysis conditions were optimized through systematic studies as functions of synthesis temperature, reaction time, and surfactant amount.

• Journal of Welding and Joining
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• 제34권5호
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• pp.70-76
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• 2016

In this study, Microstructure and tensile properties in arc brazed joints of 1000MPa grade DP steel using Cu-Si insert metal were investigated. The fusion zone was composed of Cu phase which solidified a little Fe and Si. The former phase formed due to dilute the edge of base material by arc, although Fe was not solid solution in Cu at the room temperature. Cu3Si particles formed by crystallization at $1100^{\circ}C$ during faster cooling. After the tensile shear test, there are no differences between the brazed joint efficiencies. The maximum joint efficient was about 37% compared to strength of base metal. It is better than that of arc brazed joint of DP steel using Cu-Sn filler metal. Fracture position of all brazing conditions was in the fusion zone. Crack initiation occurred at three junction point which was a stress singularity point of upper sheet, lower sheet and the fusion zone. And then crack propagated across the fusion zone. The reason why the fracture occurred at fusion zone was that the hardness of fusion zone was lower than that of base material and heat affected zone. The correlation among maximum load and hardness of fusion zone and EST at fractured position was $R^2=0.9338$. Therefore, this means that hardness and EST can have great impact on maximum load.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 대한전자공학회논문지TC
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• 제44권4호
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• pp.65-71
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• 2007

Doherty 전력증폭기는 일반전력증폭기보다 효율은 뛰어나지만 많은 왜곡성분이 발생한다. 이러한 왜곡성분은 일반적인 진폭왜곡과 위상왜곡, 그리고 메모리 효과에 의한 왜곡성분으로 구분할 수 있다. 본 논문에서는 전기적인 비선형성을 정확히 모델링하고 열 메모리 효과가 Doherty 증폭기에 미치는 영향을 연구함으로써, 전치왜곡기에 적용할 수 있는 열 메모리 효과 보상기를 제안하였다. Doherty 증폭기의 열 메모리 특성을 모델링하기 위하여 순시적으로 소모되는 전력과 순시 접합온도의 정확한 관계식을 정립하여 제안하였다. 제안된 모델의 파라미터는 전치왜곡기를 사용한 Doherty 증폭기의 열 메모리효과를 효율적으로 억제한다. 이러한 열 메모리 보상기를 가진 전치왜곡기는 선형화된 전력증폭기의 출력스펙트럼에서 약 22 dB정도의 ACLR 개선효과를 보인다. 측정결과는 50W급 LDMOS Doherty 전력증폭기로 측정하였으며, 열 메모리 보상기를 가진 전치왜곡기는 ADS로 검증하였다.