• Journal of Welding and Joining
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• v.27 no.5
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• pp.74-80
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• 2009

The membrane of the LNG carriers consists of thin strips of INVAR(Fe-36%Ni) steel plates, and the junction between INVAR strips is fabricated by welding. Thousands of the raised edge joints, regularly spaced, are located around all the side of the tank corner near the transverse bulkhead, and TIG welding is manually made on the top of the raised edges. Since the thickness of all the laminated edge plies is extremely thin and the weld position is under a bad accessibility, highly skilled workers are required to perform welding relatively for a long welding time. An alternative scheme for the corner membrane fabrication is proposed in the study to improve the installation workability and thus productivity. The scheme replaces the welded edges with the preformed corrugation ones. A panel strip with regularly-spaced corrugations is installed at the corner instead of the individual flat strip of which edge is vertically raised to be welded with the adjacent strip. In the study, a series of the evaluation on the corrugated edge members was performed to assess the applicability to the real LNG carrier fabrication. Opening displacement at the raised edge was experimentally examined. Elastic stiffness regressed from the displacement was nearly same in both edge types. Edge displacement and local stresses were calculated under hydrostatic pressure and temperature change due to liquefied cargo. Fatigue test was performed on both corrugated and welded edge specimens consisting of two or five plies of invar strips. Fatigue strength of the corrugated specimens was not less than that of the welded specimens.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.4
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• pp.49-61
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• 1981

A generally applicable computer simulation program for diffused silicon solar cells has been developed on the basis of the experimental results. The program can be easily used to obtain the spectral response and I-V characteristics for N+P, P+N N+PP+, P+NN+cells by changing various input parameters. The insolated spectra can be taken from AMI and constant intensity and GE - ELH lamp light sources. The options for AR coating are Si3N4 film and materials with constant reflectance including zero reflectance for ideal case. The computer simulation demonstrates successful results compared with the measured values for the short circuit current, open circuit voltage, efficiency, spectral response, quantum efficiency, I-V characteristics, etc. This program was used to optimize doping concentration, cell thickness, light concentration, junction depth, and to obtain the limit values for front surface recornbination velocity, effective carrier life time in the depletion regions and shunt resistance, and also to drive the changing rate in conversion efficiency depending on operation temperature, series resistance and electric field strength in N+P+ bulk regions.

• Asian-Australasian Journal of Animal Sciences
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• v.29 no.8
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• pp.1075-1082
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• 2016

Modern livestock production became highly intensive and large scaled to increase production efficiency. This production environment could add stressors affecting the health and growth of animals. Major stressors can include environment (air quality and temperature), nutrition, and infection. These stressors can reduce growth performance and alter immune systems at systemic and local levels including the gastrointestinal tract. Heat stress increases the permeability, oxidative stress, and inflammatory responses in the gut. Nutritional stress from fasting, antinutritional compounds, and toxins induces the leakage and destruction of the tight junction proteins in the gut. Fasting is shown to suppress pro-inflammatory cytokines, whereas deoxynivalenol increases the recruitment of intestinal pro-inflammatory cytokines and the level of lymphocytes in the gut. Pathogenic and viral infections such as Enterotoxigenic E. coli (ETEC) and porcine epidemic diarrhea virus can lead to loosening the intestinal epithelial barrier. On the other hand, supplementation of Lactobacillus or Saccharaomyces reduced infectious stress by ETEC. It was noted that major stressors altered the permeability of intestinal barriers and profiles of genes and proteins of pro-inflammatory cytokines and chemokines in mucosal system in pigs. However, it is not sufficient to fully explain the mechanism of the gut immune system in pigs under stress conditions. Correlation and interaction of gut and systemic immune system under major stressors should be better defined to overcome aforementioned obstacles.

• Molecular & Cellular Toxicology
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• v.4 no.3
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• pp.183-191
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• 2008

Volatile organic compounds (VOCs) are common constituents of cleaning and degreasing agents, paints, pesticides, personal care products, gasoline and solvents. And VOCs are evaporated at room temperature and most of them exhibit acute and chronic toxicity to human. Benzene is the most widely used prototypical VOC and the toxic mechanisms of them are still unclear. The multi-step process of toxic mechanism can be more fully understood by characterizing gene expression changes induced in cells by toxicants. In this study, DNA microarray was used to monitor the expression levels of genes in HepG2 cells and HL-60 cells exposed to the benzene on IC20 and IC50 dose respectively. In the clustering analysis of gene expression profiles, although clusters of HepG2 and HL-60 cells by benzene were divided differently, expression pattern of many genes observed similarly. We identified 916 up-regulated genes and 1,144 down-regulated genes in HepG2 cells and also 1,002 up-regulated genes and 919 down-regulated genes in HL-60 cells. The gene ontology analysis on genes expressed by benzene in HepG2 and HL-60 cells, respectively, was performed. Thus, we found some principal pathways, such as, focal adhesion, gap junction and signaling pathway in HepG2 cells and toll-like receptor signaling pathway, MAPK signaling pathway, p53 signaling pathway and neuroactive ligand-receptor interaction in HL-60 cells. And we also found 16 up-regulated and 14 down-regulated commonly expressed total 30 genes that belong in the same biological process like inflammatory response, cell cycle arrest, cell migration, transmission of nerve impulse and cell motility in two cell lines. In conclusion, we suggest that this study is meaningful because these genes regarded as strong potential biomarkers of benzene independent of cell type.

• Journal of the Korean Society of Safety
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• v.32 no.6
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• pp.22-28
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• 2017

According to the National Fire Data System (NFDS), more than 5,000 vehicle fires have occurred every year for the last 10 years. Vehicle fires are primarily caused by mechanical (breaking system and engine), electrical (wiring and battery), and chemical (oil and fuel gas leakage) problems. The electrical factor has increased with the installation of driver convenience equipment. For example, today, the black box is widely used to provide video data recording of motor vehicle accidents. The black box consists of a front camera, rear camera, and wires. The black box wires are directly connected to the junction box or fuse box from the start battery that operates to provide normal on power supplying for engine stop. It is extremely dangerous when the wires short circuit due to insulation aging, mechanical and electrical stress, etc. In this study, the black box wiring fire risk have been analyzed and investigated when the steady state and abnormal operations, and under the following conditions: wiring arrangements with a high temperature condition, insulation aging, poor contact, and short circuits. The results showed that black box wiring short circuits had a higher fire risk than the other fire hazard elements. To prevent fire hazards caused by black box wiring, the black boxes must be installed by qualified service personnel. Do not modify the wiring, remove the fuse and secure the wiring using cable ties or insulation tape.

• Journal of Microbiology and Biotechnology
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• v.11 no.6
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• pp.1018-1023
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• 2001

Oleamide (cis-9-octadecenamide) is endogenous primary amide of fatty acid that is produced in small amounts in animal brains. It is known to induce sleep and to lower temperature by destroying the lipid plasma membrane structure of cells, thereby disclosing gap junction channels. To develop a new biological production method for oleamide, a screening program was conducted to isolate a microorganism producing oleamide. Among 1,500 soil microorganisms tested, KK90378 exhibited a potent positive reaction with Dragendoff`s reagent, used to detect the primary amide of oleamide. KK90378 was identified as a Streptomyces species based on cultural and morpohological characteristics, the presence of diaminopimelic acid in the cell wall, and the sugar patterns for the whole-cell extrat. Streptomyces sp. KK90378 produced oleamide 3 days after culture at $28^{\circ}C$, pH 7.2 A series of purification steps, including hexane extraction, silica gel column, and preparative thin layer chromatographies, were performed for the purification of oleamide. A spectrophotometric analysis using $^1H$, $^13C$-NMR, and GC-MS confirmed that the chemical structure of the purified oleamide was identical to that of authentic oleamide.

• Korean Journal of Materials Research
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• v.18 no.7
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• pp.379-383
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• 2008

We report on the light-emitting diode (LED) characteristics of core-shell CdSe/ZnS nanocrystal quantum dots (QDs) embedded in $TiO_2$thin films on a Si substrate. A simple p-n junction could be formed when nanocrystal QDs on a p-type Si substrate were embedded in ${\sim}5\;nm$ thick $TiO_2$ thin film, which is inherently an n-type semiconductor. The $TiO_2$ thin film was deposited over QDs at $200^{\circ}C$ using plasma-enhanced metallorganic chemical vapor deposition. The LED structure of $TiO_2$/QDs/Si showed typical p-n diode currentvoltage and electroluminescence characteristics. The colloidal core-shell CdSe/ZnS QDs were synthesized via pyrolysis in the range of $220-280^{\circ}C$. Pyrolysis conditions were optimized through systematic studies as functions of synthesis temperature, reaction time, and surfactant amount.

• Journal of Welding and Joining
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• v.34 no.5
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• pp.70-76
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• 2016

In this study, Microstructure and tensile properties in arc brazed joints of 1000MPa grade DP steel using Cu-Si insert metal were investigated. The fusion zone was composed of Cu phase which solidified a little Fe and Si. The former phase formed due to dilute the edge of base material by arc, although Fe was not solid solution in Cu at the room temperature. Cu3Si particles formed by crystallization at $1100^{\circ}C$ during faster cooling. After the tensile shear test, there are no differences between the brazed joint efficiencies. The maximum joint efficient was about 37% compared to strength of base metal. It is better than that of arc brazed joint of DP steel using Cu-Sn filler metal. Fracture position of all brazing conditions was in the fusion zone. Crack initiation occurred at three junction point which was a stress singularity point of upper sheet, lower sheet and the fusion zone. And then crack propagated across the fusion zone. The reason why the fracture occurred at fusion zone was that the hardness of fusion zone was lower than that of base material and heat affected zone. The correlation among maximum load and hardness of fusion zone and EST at fractured position was $R^2=0.9338$. Therefore, this means that hardness and EST can have great impact on maximum load.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.4
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• pp.65-71
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• 2007

Doherty amplifier has more efficiency and distortion than general amplifier. These distortion classified amplitude distortion and phase distortion, memory effect distortion. This paper reports on an attempt to investigate, model and quantity the contribution of the electrical nonlinearity effects and the thermal memory effects to a doherty amplifier's distortion generation and suggests thermal memory effect compensator for pre-distorter. Also this paper reports on the development of an accurate dynamic expression of the instantaneous junction temperature as a function of the instantaneous dissipated power. The parameters of suggested model suppress thermal memory effects doherty amplifier with pre-distorter. Pre-distorter with electrothermal memory effect compensator for doherty amplifier enhanced ACLR performance about 22 dB than general doherty amplifier. Experiment results were mesured by 50W LDMOS Doherty amplifier and pre-distorter with electrothermal memory effect compensator was simulated by ADS.