• Title/Summary/Keyword: joint probabilities

Search Result 63, Processing Time 0.018 seconds

An Intra Prediction Method and Fast Intra Prediction Method in Inter Frames using Block Content and Dependency Probabilities on neighboring Block Modes in H.264|AVC (영상 내용 특성과 주위 블록 모드 상관성을 이용한 H.264|AVC 화면 간 프레임에서의 화면 내 예측 부호화 결정 방법과 화면 내 예측 고속화 방법)

  • Na, Tae-Young;Lee, Bum-Shik;Hahm, Sang-Jin;Park, Chang-Seob;Park, Keun-Soo;Kim, Mun-Churl
    • Journal of Broadcast Engineering
    • /
    • v.12 no.6
    • /
    • pp.611-623
    • /
    • 2007
  • The H.264|AVC standard incorporates an intra prediction tool into inter frame coding. However, this leads to excessive amount of increase in encoding time, thus resulting in the difficulty in real-time implementation of software encoders. In this paper, we first propose an early decision on intra prediction coding and a fast intra prediction method using the characteristics of block contents and the context of neighboring block modes for the intra prediction in the inter frame coding of H.264/AVC. Basically, the proposed methods determine a skip condition on whether the $4{\times}4$ intra prediction is to be used in the inter frame coding by considering the content characteristics of each block to be encoded and the context of its neighboring blocks. The performance of our proposed methods is compared with the Joint Model reference software version 11.0 of H.264|AVC. The experimental results show that our proposed methods allow for 41.63% reduction in the total encoding time with negligible amounts of PSNR drops and bitrate increases, compared to the original Joint Model reference software version 11.0.

Process Fault Probability Generation via ARIMA Time Series Modeling of Etch Tool Data

  • Arshad, Muhammad Zeeshan;Nawaz, Javeria;Park, Jin-Su;Shin, Sung-Won;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.241-241
    • /
    • 2012
  • Semiconductor industry has been taking the advantage of improvements in process technology in order to maintain reduced device geometries and stringent performance specifications. This results in semiconductor manufacturing processes became hundreds in sequence, it is continuously expected to be increased. This may in turn reduce the yield. With a large amount of investment at stake, this motivates tighter process control and fault diagnosis. The continuous improvement in semiconductor industry demands advancements in process control and monitoring to the same degree. Any fault in the process must be detected and classified with a high degree of precision, and it is desired to be diagnosed if possible. The detected abnormality in the system is then classified to locate the source of the variation. The performance of a fault detection system is directly reflected in the yield. Therefore a highly capable fault detection system is always desirable. In this research, time series modeling of the data from an etch equipment has been investigated for the ultimate purpose of fault diagnosis. The tool data consisted of number of different parameters each being recorded at fixed time points. As the data had been collected for a number of runs, it was not synchronized due to variable delays and offsets in data acquisition system and networks. The data was then synchronized using a variant of Dynamic Time Warping (DTW) algorithm. The AutoRegressive Integrated Moving Average (ARIMA) model was then applied on the synchronized data. The ARIMA model combines both the Autoregressive model and the Moving Average model to relate the present value of the time series to its past values. As the new values of parameters are received from the equipment, the model uses them and the previous ones to provide predictions of one step ahead for each parameter. The statistical comparison of these predictions with the actual values, gives us the each parameter's probability of fault, at each time point and (once a run gets finished) for each run. This work will be extended by applying a suitable probability generating function and combining the probabilities of different parameters using Dempster-Shafer Theory (DST). DST provides a way to combine evidence that is available from different sources and gives a joint degree of belief in a hypothesis. This will give us a combined belief of fault in the process with a high precision.

  • PDF

Reliability Prediction of Failure Modes due to Pressure in Solid Rocket Case (고체로켓 케이스 내압파열 고장모드의 신뢰도예측)

  • Kim, Dong-Seong;Yoo, Min-Young;Kim, Hee-Seong;Choi, Joo-Ho
    • Journal of the Computational Structural Engineering Institute of Korea
    • /
    • v.27 no.6
    • /
    • pp.635-642
    • /
    • 2014
  • In this paper, an efficient technique is developed to predict failure probability of three failure modes(case rupture, fracture and bolt breakage) related to solid rocket motor case due to the inner pressure during the mission flight. The overall procedure consists of the steps: 1) design parameters affecting the case failure are identified and their uncertainties are modelled by probability distribution, 2) combustion analysis in the interior of the case is carried out to obtain maximum expected operating pressure(MEOP), 3) stress and other structural performances are evaluated by finite element analysis(FEA), and 4) failure probabilities are calculated for the above mentioned failure modes. Axi-symmetric assumption for FEA is employed for simplification while contact between bolted joint is accounted for. Efficient procedure is developed to evaluate failure probability which consists of finding first an Most Probable Failure Point(MPP) using First-Order Reliability Method(FORM), next making a response surface model around the MPP using Latin Hypercube Sampling(LHS), and finally calculating failure probability by employing Importance Sampling.