• Journal of the Korean Society of Propulsion Engineers
• /
• v.26 no.2
• /
• pp.1-11
• /
• 2022

The heat transfer coefficient on the wall, which is used as a boundary condition in the thermal analysis of general contract-divergent supersonic nozzles, affects the thermal analysis accuracy of the entire nozzle. Accordingly, many methods of deriving a heat transfer coefficient have been proposed. In this study, the accuracy of each method was compared. For this purpose, the heat transfer coefficients were calculated through theoretical-based analogy methods, semi-empirical equations, and CFD simulations for the previously performed heat transfer experiment with an isothermal wall and compared with the experimental results. The results show that the Prandtl-Taylor analogy methods and the CFD results with the k-ω SST turbulence model were in good agreement with the experimental results. Furthermore, the Modified Bartz empirical formula showed an overall over-prediction tendency.

• Journal of the Korean Society for Marine Environment & Energy
• /
• v.19 no.3
• /
• pp.173-184
• /
• 2016

This study was carried out to understand the characteristic distributions of water temperature and salinity in accordance with seasons atound the Tongyeong and Geoje, based on a cluster analysis. Water temperatures in coastal areas were $1-2^{\circ}C$ higher than those in open seas when in the spring, autumn and winter. In particular, a south-northward isothermal line was established at the bottom layer in the winter of 2014, unlikely to the surface layer. In addition, a south-northward isohaline was also established at the bottom layer in the winter of 2013. Therefore, we recognized that a moving pattern of water masses has also a difference since forming directions of those lines were not equivalent with each other between the surface and bottom layers. In contrast, stratification appeared in the summer with a roughly difference of water temperature of $10^{\circ}C$ and a salinity of 2-10 psu between the layers. A cluster analysis indicated that the southeastern coastal waters have three distinct water masses, even though some complicated situations exist due to the seawater inflow from the outside. However, the result of a cluster analysis turned out quite reasonable because the result of a regression analysis proved that it is appropriate, just except for the timing of a south-northward front formation.

• BMB Reports
• /
• v.40 no.5
• /
• pp.649-655
• /
• 2007

The nsp14 protein is an exoribonuclease that is encoded by severe acute respiratory syndrome coronavirus (SARS-CoV). We have cloned and expressed the nsp14 protein in Escherichia coli, and characterized the nature and the role(s) of the metal ions in the reaction chemistry. The purified recombinant nsp14 protein digested a 5'-labeled RNA molecule, but failed to digest the RNA substrate that is modified with fluorescein group at the 3'-hydroxyl group, suggesting a 3'-to-5' exoribonuclease activity. The exoribonuclease activity requires $Mg^{2+}$ as a cofactor. Isothermal titration calorimetry (ITC) analysis indicated a two-metal binding mode for divalent cations by nsp14. Endogenous tryptophan fluorescence and circular dichroism (CD) spectra measurements showed that there was a structural change of nsp14 when binding with metal ions. We propose that the conformational change induced by metal ions may be a prerequisite for catalytic activity by correctly positioning the side chains of the residues located in the active site of the enzyme.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.8 no.1
• /
• pp.81-87
• /
• 2020

Crack control is essential to increase the durability of concrete significantly. Healing of crack can be controlled by rehydration of unreacted clinkers at the crack surface. In this paper, by comparing the results of isothermal calorimetry test and regression analysis, the Parrot & Killoh's cement hydration model was verified and clink er hydration model was proposed. The composition and quantification of hydration products were simulated by combining kinematic hydration model and thermodynamic model. Hydration simulation was conducted using the verified and proposed hydration model, and the simulation was performed by the substitution rate of clink er. The type and quantity of the final hydration product and healing product were predicted and, in addition, the optimal cementitious material of self-healing concrete was selected using the proposed hydration model.

• Journal of Powder Materials
• /
• v.25 no.3
• /
• pp.246-250
• /
• 2018

In this study, we investigate the deformation behavior of $Hf_{44.5}Cu_{27}Ni_{13.5}Nb_5Al_{10}$ metallic glass powder under repeated compressive strain during mechanical milling. High-density (11.0 g/cc) Hf-based metallic glass powders are prepared using a gas atomization process. The relationship between the mechanical alloying time and microstructural change under phase transformation is evaluated for crystallization of the amorphous phase. Planetary mechanical milling is performed for 0, 40, or 90 h at 100 rpm. The amorphous structure of the Hf-based metallic glass powders during mechanical milling is analyzed using differential scanning calorimetry (DSC) and X-ray diffraction (XRD). Microstructural analysis of the Hf-based metallic glass powder deformed using mechanical milling reveals a layered structure with vein patterns at the fracture surface, which is observed in the fracture of bulk metallic glasses. We also study the crystallization behavior and the phase and microstructure transformations under isothermal heat treatment of the Hf-based metallic glass.

• Composites Research
• /
• v.15 no.2
• /
• pp.32-39
• /
• 2002

This study focused on the introduction of processing procedure for microcapsules loaded with the healing agent and then microcapsules with the healing agent were manufactured by experiments. The DCPD (dicyclopentadiene) was used for the healing agent and the shell of microcapsules was consisted of urea-formaldehyde resin. The magnitude and the site distribution of microcapsules were measured by a particle size analyzer using laser diffraction technique. Thermal analysis was conducted by using a DSC fur the healing agent, microcapsules without the healing agent, and microcapsules with the healing agent. Also thermal stability was investigated by using a TGA under continuous and isothermal heating conditions far the healing agent, microcapsules without the healing agent, microcapsules with the healing agent. According to the results. microcapsules with the healing agent were verified to be so thermally stable that the healing agent could not evaporate until the shell of microcapsules were burned.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.37 no.12
• /
• pp.1113-1120
• /
• 2013

A numerical analysis of the effect of the position of a circular cylinder in a $45^{\circ}$ tilted enclosure on natural convection in the enclosure is presented. The location of the cylinder is changed between -0.4 and 0.4. The Rayleigh number is varied between $10^3$ and $10^5$. The effect of the location of the cylinder on natural convection in the enclosure is analyzed by the isothermal line, stream line, and surface-averaged Nusselt number. The flow and heat transfer characteristics are independent of time in the range of the Rayleigh number and cylinder location that is considered in this study. The surface-averaged Nusselt number of the cylinder and enclosure increases as the cylinder gets closer to the wall of the enclosure.

• Applied Chemistry for Engineering
• /
• v.26 no.5
• /
• pp.575-580
• /
• 2015

Pd/C catalysts were prepared by various preparation methods such as ion exchange, impregnation and polyol method and also characterized by nitrogen adsorption-desorption isothermal, XRD, FE-TEM and CO-chemisorption. The activities of these catalysts were tested in the hydrogenation of cyclohexene to cyclohexane. Catalytic activities of Pd/C catalysts were found to be effected by the chosen preparation methods. Pd dispersions of each Pd/C catalysts prepared by ion exchange, impregnation and polyol method were 17.55, 13.82% and 1.35%, respectively, confirmed by CO-chemisorption analysis. These were also in good agreement with the FE-TEM results. The Pd/C catalyst prepared by ion exchange method exhibits good performance with the cyclohexene conversion rate of 71% for 15 min. These results indicate that Pd/C catalyst having higher dispersion and lower particle size is in favor of hydrogenation cyclohexene and also Pd dispersion increases with the increment of catalytic activity.