• Title/Summary/Keyword: irregular arrays

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PATTERNS IN IRREGULAR MULTI-DIMENSIONAL ARRAYS

  • BENTIBA AHMED
    • Journal of applied mathematics & informatics
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    • v.17 no.1_2_3
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    • pp.297-305
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    • 2005
  • In this paper, we study irregular 3D-Arrays with pyramid shapes. Some computation using Maple software and C++ language have been carried out to illustrate some novel and interesting patterns of numbers in these arrays.

Analysis on the Reliability and Influence Factors of Refraction Traveltime Tomography Depending on Source-receiver Configuration (송수신기 배열에 따른 굴절 주시 역산의 영향 인자 및 신뢰성 분석)

  • Lee, Donguk;Park, Yunhui;Pyun, Sukjoon
    • Geophysics and Geophysical Exploration
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    • v.20 no.3
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    • pp.163-175
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    • 2017
  • In land seismic exploration, irregular surface topography and weathering layer in near surface distorts the reflected signals of data. Therefore, typical land seismic data should be compensated for this distortion by static correction. To perform the static correction, near-surface velocity is required, which can be obtained by seismic refraction survey. However, land seismic data is often acquired in a limited form of geometry depending on the equipment availability, accessibility condition, and permission for the survey site. In this situation, refraction analysis should be performed using reflection data because it is impossible to acquire refraction-oriented data due to limited source and receiver geometry. In this study, we aimed to analyze the reliability of the results obtained by refraction traveltime tomography when using reflection data with a limited number of sources and receivers from irregular surface topography. By comparing the inversion result from irregular topography with that from flat surface, we found that the surface topography affects the reliability of the inversion results to some degree. We also found that the number of sources has little effect on the inversion results unless the number of sources are very small. On the other hand, we observed that velocity distortion occurred in the overlapped part of receiver arrays when using a limited number of receivers, and therefore suggested the size of the least overlapping ratio to avoid the velocity distortion. Finally, we performed numerical tests for the model which simulates the surface topography and acquisition geometry of the survey region and verified the reliability analysis of inversion results. We identified reliable areas and suspicious area of the inverted velocity model by applying the analysis results to field data.

Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch (미세 피치를 갖는 MEMS 프로브 팁의 설계 및 기계적 특성 평가)

  • Ha, Seok-Jae;Kim, Dong-Woo;Shin, Bong-Cheol;Cho, Myeong-Woo;Han, Chung-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.4
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    • pp.1210-1215
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    • 2010
  • The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.