• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Structural Engineering and Mechanics
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• 제18권3호
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• pp.315-330
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• 2004

A four-point bending RC beam strengthened with FRP plate is investigated based on the theory of elasticity. Taking the adhesive layer into account but ignoring some secondary parameters, the analytical solutions of the normal stress and shear stress on concrete-adhesive interface are obtained and discussed. Besides, the pure bending region of the beam is analyzed and the ultimate load of the beam is predicted. The results obtained in the present paper agree very well with both the results of FEM and the experimental findings.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• Restorative Dentistry and Endodontics
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• 제46권2호
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• pp.30.1-30.13
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• 2021

Objectives: This study was conducted to compare the microleakage and characteristics of the resin-tooth tissue interface between self-etch and etch-and-rinse adhesive systems after 48 hours and 3 months. Materials and Methods: 40 extracted premolar teeth were randomly divided into 2 groups: 1-step self-etch adhesive system - Optibond^TM All-In-One, and 2-step etch-and-rinse adhesive system - Adper^TM Single Bond 2. Both groups were subjected to 500 thermocycles (5℃-55℃) before scanning electron microscope (SEM) analysis or microleakage trial at 48-hour and 3-month time periods. Results: SEM images showed the hybrid layer thickness, diameter, and length of resin tags of the self-etch adhesive (0.42 ± 0.14 ㎛; 1.49 ± 0.45 ㎛; 16.35 ± 14.26 ㎛) were smaller than those of the etch-and-rinse adhesive (4.39 ± 1.52 ㎛; 3.49 ± 1 ㎛; 52.81 ± 35.81 ㎛). In dentin, the microleakage scores of the 2 adhesives were not different in both time periods (48 hours/3 months). However, the microleakage score of etch-and-rinse adhesive increased significantly after 3 months (0.8 ± 0.63 and 1.9 ± 0.88, p < 0.05). Conclusions: The self-etch adhesive exhibited better long-term sealing ability in dentin when compared to that of the etch-and-rinse adhesive. The greater hybrid layer thickness and dimensions of resin tags did not guarantee reliable, long-lasting sealing in the bonding area.

• 접착 및 계면
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• 제4권2호
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• 한국표면공학회지
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• 제22권4호
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• pp.185-196
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• 1989

The surface modification of a mild and stainless steel by alumina sprayed coating were studied. The effects of surface roughness and bond coating layer on the adhesive strengthy and durability of sprayed specimens were also investiated. The adhesive strength of ceramic coating was affected by surface roughness and bond coating layer thinkness. That showed excellent undergrit blast time and bond coating layer; 60 sec and 0.15-0.33mm, respectively. The adhesive strength and densification of sprayed coating with air pressure were superior to those of without and fracture was mainly occured at alumina-bond coating interface. Under ambient atmosphere at $800^{\circ}C$, the oxides existed within bond coating layer promote diffusion of oxygen to lower durability of sprayed specimens. In this case, fracure was occured at sudstrate-bond coating interface.

• Structural Engineering and Mechanics
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• 제57권2호
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• pp.295-313
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• 2016

In this study, the three-dimensional finite element method is used to determine the stress intensity factor in Mode I and Mixed mode of a centered crack in an aluminum specimen repaired by a composite patch using contour integral. Various mesh densities were used to achieve convergence of the results. The effect of adhesive joint thickness, patch thickness, patch-specimen interface and layer sequence on the SIF was highlighted. The results obtained show that the patch-specimen contact surface is the best indicator of the deceleration of crack propagation, and hence of SIF reduction. Thus, the reduction in rigidity of the patch especially at adhesive layer-patch interface, allows the lowering of shear and normal stresses in the adhesive joint. The choice of the orientation of the adhesive layer-patch contact is important in the evolution of the shear and peel stresses. The patch will be more beneficial and effective while using the cross-layer on the contact surface.

• 한국전산구조공학회논문집
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• 제13권1호
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• pp.97-103
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• 2000

이 논문에서는, 반도체 칩과 리드프레임을 결합하는 과정에서 점탄성 접착제층에 발생하는 잔류응력 문제를 다루고 있다. 접착제층은 “열유동단순”거동을 한다고 가정하였다. 접착제층에서의 응력들은 경계요소법을 사용하여 조사하였다. 매우 큰 응력 구배가 계면 모서리에서 발생하는데, 그러한 응력들은 국부 항복을 일으키거나, 칩과 리드프레임의 박리를 야기시킬 수 있음을 보여주고 있다.

• 전산구조공학
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• 제10권2호
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• pp.131-138
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• 1997

이 논문에서는, 균일한 횡방향 인장변형률이 작용하는 조건에서 강체모재들을 결합하고 있는 점탄성 접착재층의 계면모서리에 발생하는 응력 특이성을 조사하고있다. Williams방법을 응용하여 라플라스 변형공간에서 특성방정식을 구하였고, 주어진 점탄성 모델에 대해서 변형공간에서의 특성방정식을 시간공간으로 해석적으로 전환하였다. 시간 공간에서의 특이차수는 수치적으로 계산하였다. 계면을 따라 발생하는 응력의 특성을 조사하는데 시간영역 경계요소법을 적용하였다. 수치해석 결과에 의하면, 특이차수는 시간이 경과함에 따라 커지는 반면에, 자유모서리 응력확대계수는 시간에 따라 이완되는 특성을 보여주고 있다.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2012년도 제38회 춘계학술대회논문집
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• pp.230-237
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• 2012

확대부 내열재의 스틸과 FRP 사이에 존재하는 미접착 결함과 미충전 결함을 검출하기 위해 초음파 공진법을 적용하였다. 초음파 공진법은 초음파 신호가 증폭되기 때문에 펄스에코법으로 검출하기 어려운 미접착 결함 및 에폭시 미충전 결함을 쉽게 검출할 수 있다. 공진 주파수는 삼중 매질의 음압 반사계수를 이용하여 예측하였고, 시험편의 초음파 신호에 대해 고속푸리에변환을 실시하여 측정하였다. 예측한 공진 주파수는 측정한 공진 주파수와 일치하므로 초음파 공진을 입증하였다.