• 접착 및 계면
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• 제19권4호
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• pp.173-176
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• 2018

• 접착 및 계면
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• 제12권2호
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• pp.67-72
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• 2011

Acrylic pressure-sensitive adhesives are used in many different parts in the world. But acrylic acid in PSAs may occur unexpected results such as corroding adherends or producing by-products when applied within electronic devices. This study employed acrylic PSAs based on 2-ethylhexyl acrylate (2-EHA), 2-hydroxyethyl acrylate (2-HEA) and butyl acrylate (BA) with different coating thickness. There are two types of curing agents. One is methylaziridine derivative (MAZ) and the other is aluminum acetylacetonate (AlACA). This study examined the adhesion performance and curing behaviors using peel strength, probe tack and gel fraction. Also, the viscoelastic properties of acrylic PSAs were investigated from Advanced rheometric expansion system (ARES).

• 한국재료학회지
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• 제30권3호
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• pp.105-110
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• 2020

Cu/PET composite films are widely used in a variety of wearable electronics. Lifetime of the electronics is determined by adhesion between the Cu film and the PET substrate. The formation of an anisotropic nanostructure on the PET surface by surface modification can enhance Cu/PET interfacial adhesion. The shape and size of the anisotropic nanostructures of the PET surface can be controlled by varying the surface modification conditions. In this work, the effect of Cu/PET interface nanostructures on the failure mechanism of a Cu/PET flexible composite film is studied. From observation of the morphologies of the anisotropic nanostructures on plasma-treated PET surfaces, and cross-sections and surfaces of the fractured specimens, the Cu/PET interface area and nanostructure width are analyzed and the failure mechanism of the Cu/PET film is investigated. It is found that the failure mechanism of the Cu/PET flexible composite film depends on the shape and size of the plasmatreated PET surface nanostructures. Cu/PET interface nanostructures with maximal peel strength exhibit multiple craze-crack propagation behavior, while smaller or larger interface nanostructures exhibit single-path craze-crack propagation behavior.

• 한국표면공학회지
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• 제32권6호
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• 접착 및 계면
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• 제4권2호
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• pp.10-20
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• 2003

This paper is relative to the electroless deposition of nickel or copper films on polyimide and polytetrafluoroethylene substrates. First, it is presented an original approach of the electroless process which consists in grafting nitrogenated functionalities on the polymer surfaces via plasma or VUV-assisted treatments operating in a nitrogen-based atmosphere ($NH_3$, $N_2$), and then in catalysing the grafted surfaces in an aqueous tin-free, Pd(+2)-based solution. Adhesion of the Pd(+2) catalytic species on polymer surfaces is explained by the formation of strong covalent bonds between these species and the grafted nitrogenated groups. Second, it is show how a fragmentation test performed in conjunction with electrical measurements can be used to characterize the practical adhesion of the electroless coatings deposited on flexible polymer substrates, and to evidence the influence of some experimental parameters (plasma treatment time and nature of the gas phase).

• 접착 및 계면
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• 제5권4호
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• pp.1-8
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• 2004

다이싱 테이프에 사용되는 UV경화형 점착제를 아크릴 공중합체를 butyl acrylate, acrylic acid, methyl methacrylate를 용액 중합을 통해 중합한 뒤, trimethylolpropane triacrylate를 블렌딩하여 제조하였다. 제조된 점착제는 UV 조사량에 따라 접착력, 유리전이온도 ($T_g$)를 측정하였는데 UV 조사량이 증가할수록 접착력은 급격하게 감소하였고 $T_g$도 증가하였다. 웨이퍼 표면에 점착 샘플을 부착하여 UV 조사 후 박리하여 표면을 관찰한 결과 점착잔류물을 남기지 않았다.

• 접착 및 계면
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• 제3권1호
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• pp.13-19
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• 2002

We have studied on the surface and adhesion properties for acrylic terpolymers, having both hydrophobic and hydrophilic side chains, synthesized via solution polymerization. In order to develop a waterborne material. we tried to synthesize these terpolymers via emulsion polymerization. The polymeric emulsion synthesized was mainly composed of methyl methacrylate (MMA), methoxy-polyethyleneglycol methacrylate (MPEGMA) having hydrophilic side chains and methoxypolypropyleneglycol methacrylate (MPEGMA) having hydrophobic side chains. The viscosities of this series increased with an increase in the content of the co-monomer such as MPEGMA and (MPEGMA). This behavior resulted in the increase in the diameter and heterogeneity of the emulsion particle via AFM observation. Furthermore. the tensile adhesion strength and 90-degree peel strength of the adhesive of these polymeric emulsions were measured. In the case of polymeric emulsion composed of the same content of both hydrophilic and hydrophobic component, the adhesion property showed the highest value. However, since the adhesion properties as a practical applicable adhesive were poor, some improvements were required. When the composition above was modified with butyl acrylate (BA), the improvement effect on adhesion strength was accepted. In particular, 90-degree peel strength increased up to a maximum of 400% of the original value.

• 한국재료학회지
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• 제9권10호
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• pp.992-999
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• 1999

본래 약한 구리계 리드프레임/EMC(Epoxy Molding Compound) 계면의 접착력은 솔더 리플로우 (solder reflow) 공정 중에 종종 박형 플라스틱 패키지의 팝콘 균열 현상(popcorn-cracking phenomena)을 일으킨다. 본 연구에서는 리드프레임/EMC 계면의 접착력을 향상시키기 위하여 리드프레임을 알칼리 용액에 담궈 표면에 brown oxide를 형성시켰으며, EMC로 몰딩(molding)하여 SDCB(Sandwiched Double Cantilever Beam) 시편 및 SBN(Sandwiched Brazil-Nut) 시편을 준비하여 접착력을 측정하였다. 리드프레임의 brown oxide 처리는 미세한 바늘모양의 CuO 결정들을 리드프레임 표면에서 형성시켰으며, 리드프레임/EMC 계면의 접착력을 향상시켰다. 접착력의 향상은 산화층의 평균두께와 직접적인 관련이 있었다. 이는 미세한 바늘모양의 CuO 결정들이 EMC와 기계적인 고착(mechanical interlocking)을 하기 때문으로 생각된다.

• 접착 및 코팅기술
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• 제1권1호
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• pp.1-6
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• 2022

• 접착 및 코팅기술
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• 제1권1호
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• pp.7-14
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• 2022