• Nuclear Engineering and Technology
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• 제44권3호
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• pp.273-282
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• 2012

A new effective methodology for optimizing the enrichment of low-enriched zones as well as gadolinia fuel ($UO_2/Gd_2O_3$) rod designs in PLUS7 fuel assemblies was developed to minimize the maximum peak power in the core and to maximize the cycle lifetime. An automated link code was developed to integrate the genetic algorithm (GA) and the core design code package of ALPHA/PHOENIX-P/ANC and to generate and evaluate the candidates to be optimized efficiently through the integrated code package. This study introduces an optimization technique for the optimization of gadolinia fuel rod designs in order to effectively reduce the peak powers for a few hot assemblies simultaneously during the cycle. Coupled with the gadolinia optimization, the optimum enrichments were determined using the same automated code package. Applying this technique to the reference core of Ulchin Unit 4 Cycle 11, the gadolinia fuel rods in each hot assembly were optimized to different numbers and positions from their original designs, and the maximum peak power was decreased by 2.5%, while the independent optimization technique showed a decrease of 1.6% for the same fuel assembly. The lower enrichments at the fuel rods adjacent to the corner gap (CG), guide tube (GT), and instrumentation tube (IT) were optimized from the current 4.1, 4.1, 4.1 w/o to 4.65, 4.2, 4.2 w/o. The increase in the cycle lifetime achieved through this methodology was 5 effective full-power days (EFPD) on an ideal equilibrium cycle basis while keeping the peak power as low as 2.3% compared with the original design.

• 한국농공학회지
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• 제37권E호
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• pp.31-39
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• 1995

Weight minimization for the steel bridge girders using an approximation based optimization technique is presented. To accomplish this, an optimization oriented finite element program is used to achieve continuous weight reduction until the optimum is reached. To reduce computational cost, approximation techniques are adopted during the optimization process. Constraint deletion as well as intermediate design variables and responses are also used for higher qualitv of approximations and for a better convergence rate. Both the reliability and the effectiveness of the underlying optimization method are reviewed.

• Nuclear Engineering and Technology
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• 제49권1호
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• pp.43-53
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• 2017

Increasing the operation cycle length can be an important goal in the fuel reload design of a nuclear reactor core. In this research paper, a new optimization approach, electromagnetism mechanism (EM), is applied to the fuel arrangement design of the Bushehr WWER-1000 core. For this purpose, a neutronic solver has been developed for calculating the required parameters during the reload cycle of the reactor. In this package, two modules have been linked, including PARCS v2.7 and WIMS-5B codes, integrated in a solver for using in the fuel arrangement optimization operation. The first results of the prepared package, along with the cycle for the original pattern of Bushehr WWER-1000, are compared and verified according to the Final Safety Analysis Report and then the results of exploited EM linked with Purdue Advanced Reactor Core Simulator (PARCS) and Winfrith Improved Multigroup Scheme (WIMS) codes are reported for the loading pattern optimization. Totally, the numerical results of our loading pattern optimization indicate the power of the EM for this problem and also show the effective improvement of desired parameters for the gained semi-optimized core pattern in comparison to the designer scheme.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.43-51
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• 2014

3차원 적층 패키지(3D integrated package) 에서 초소형 패키지 내에 적층되어 있는 칩들의 발열로 인한 열 신뢰성 문제는 3차원 적층 패키지의 핵심 이슈가 되고 있다. 본 연구에서는 TSV(through-silicon-via) 기술을 이용한 3차원 적층 패키지의 열 특성을 분석하기 위하여 수치해석을 이용한 방열 해석을 수행하였다. 특히 모바일 기기에 적용하기 위한 3D TSV 패키지의 열 특성에 대해서 연구하였다. 본 연구에서 사용된 3차원 패키지는 최대 8 개의 메모리 칩과 한 개의 로직 칩으로 적층되어 있으며, 구리 TSV 비아가 내장된 인터포저(interposer)를 사용하여 기판과 연결되어 있다. 실리콘 및 유리 소재의 인터포저의 열 특성을 각각 비교 분석하였다. 또한 본 연구에서는 TSV 인터포저를 사용한 3D 패키지에 대해서 메모리 칩과 로직 칩을 사용하여 적층한 경우에 대해서 방열 특성을 수치 해석적으로 연구하였다. 적층된 칩의 개수, 인터포저의 크기 및 TSV의 크기가 방열에 미치는 영향에 대해서도 분석하였다. 이러한 결과를 바탕으로 메모리 칩과 로직 칩의 위치 및 배열 형태에 따른 방열의 효과를 분석하였으며, 열을 최소화하기 위한 메모리 칩과 로직 칩의 최적의 적층 방법을 제시하였다. 궁극적으로 3D TSV 패키지 기술을 모바일 기기에 적용하였을 때의 열 특성 및 이슈를 분석하였다. 본 연구 결과는 방열을 고려한 3D TSV 패키지의 최적 설계에 활용될 것으로 판단되며, 이를 통하여 패키지의 방열 설계 가이드라인을 제시하고자 하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.59-65
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• 2011

소형화, 박형화 및 집적화의 경향에 따라 FCBGA가 휴대폰과 같은 전자제품에 활발히 사용되고 있다. 그러나, 플립칩은 전기적 저항에 의한 열이 필연적으로 발생하며, 발생된 열은 패키지의 소형화에 따라 열의 분산 면적 감소로 인하여 발열의 증가가 나타나게 된다. 발열은 온도와 응력에 민감하게 반응하는 소자의 수명을 저해하고, 시스템에 있어 고장의 발생을 가져올 수 있다. 따라서 본 논문에서는 플립칩의 발열문제를 해결하기 위하여 Comsol 3.5a의 heat transfer module을 이용하여 FCBGA의 발열 특성을 정량적으로 분석하였다. 그리고 열 문제를 해결하기 위하여 시뮬레이션을 통한 새로운 마이크로 구조가 부착된 플립칩을 제안하였다. 또한 마이크로 패턴 구조의 형상, 높이, 간격에 대한 열 소산을 분석함으로써, 기존 플립칩에 비하여 열소산 특성이 18% 향상됨을 확인하였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2005년도 제17회 워크샵 및 추계학술대회
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• pp.541-544
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• 2005

This study presents the integrated modeling approach to simulate the proton exchange membrane (PEM) fuel cell system for vehicle application. The fuel cell system consisting of stack and balance of plant (BOP) was simulated with MATLAB/Simulink environment to estimate the maximum system power and investigate the effect of BOP component sizing on system performance and efficiency. The PEM fuel cell stack model was established by using a semi-empirical modeling. To maximize the net efficiency of fuel cel1 system, multi-variable optimization code was adopted. Using this method the optimized operating values were obtained according to various system net power levels. The fuel cell model established was co-linked to AVL CRUISE, a vehicle simulation package. Through the vehicle simulation software, the fuel economy of fuel cell powered electric vehicle for two types of driving cycles was presented and compared. It is expected that this study tan be effectively employed in the basic BOP component sizing and in establishing system operation map with respect to net power level of fuel cell system.

• 신재생에너지
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• 제1권4호
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• pp.43-48
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• 2005

This study presents the integrated modeling approach to simulate the proton exchange membrane [PEM] fuel cell system for vehicle application. The fuel cell system consisting of stack and balance of plant (BOP) was simulated with MATLAB/Simulink environment to estimate the maximum system power and investigate the effect of BOP component sizing on system performance and efficiency. The PEM fuel cell stack model was established by using a semi-empirical modeling. To maximize the net efficiency of fuel cell system, multi-variable optimization code was adopted. Using this method, the optimized operating values were obtained according to various system net power levels. The fuel cell model established was co-linked to AVL CRUISE, a vehicle simulation package. Through the vehicle simulation software, the fuel economy of fuel cell powered electric vehicle for two types of driving cycles was presented and compared. It is expected that this study can be effectively employed in the basic BOP component sizing and in establishing system operation map with respect to net power level of fuel cell system.

• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.