• Journal of Advanced Marine Engineering and Technology
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• v.31 no.6
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• pp.777-783
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• 2007

In this work, a highly integrated downconverter MMIC employing HBT(heterojunction bipolar transistor) was developed for application to one chip tranceiver solution of Ku-band commercial wireless communication system. The downconverter MMIC (monolithic microwave integrated circuit) includes mixer filter. amplifier and input/output matching circuit. Especially, spiral inductor structures employing SiN film were used for a suppression of LO and its second harmonic leakage signals. Concretely, they were properly designed so that the self-resonance frequency was accurately tuned to LO and its second harmonic frequency, and they were integrated on the downconverter MMIC.

• Journal of the Optical Society of Korea
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• v.12 no.3
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• pp.162-165
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• 2008

A novel planar lightwave circuit(PLC) triplexer using a three-waveguide interferometer(TWI) is proposed and examined using the transfer matrix and the beam propagation methods. The proposed triplexer consists of two three-waveguide couplers and three waveguides connecting the couplers. Simulation for the TWI triplexer shows the excess losses of 0.03 dB and 0.94 dB with the crosstalks of -22.3 dB and -14.5 dB in reception, respectively, for the wavelength of 1490- and 1550-nm, while showing the excess loss of 1.75 dB in transmission for the wavelength of 1310 nm. The proposed design shows compact feature as short as 11.5 mm for the refractive-index contrast of 0.45%.

• ETRI Journal
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• v.32 no.1
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• pp.151-153
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• 2010

A highly efficient linear and compactly integrated series-type Doherty power amplifier (PA) has been developed for wideband code-division multiple access handset applications. To overcome the size limit of a typical Doherty amplifier, all circuit elements, such as matching circuits and impedance transformers, are fully integrated into a single monolithic microwave integrated circuit (MMIC). The implemented PA shows a very low idle current of 25 mA and an excellent power-added efficiency of 25.1% at an output power of 19 dBm by using an extended Doherty concept. Accordingly, its average current consumption was reduced by 51% and 41% in urban and suburban environments, respectively, when compared with a class-AB PA. By adding a simple predistorter to the PA, the PA showed an adjacent channel leakage ratio better than -42 dBc over the whole output power range.

• Proceedings of the KIPE Conference
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• 1999.07a
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• pp.626-630
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• 1999

A new integrated single-stage zero current switched(ZCS) quasi-resonant converter (QRC) for the power factor correction(PFC) converter is introduced in this paper. The power factor correction can be achieved by the discontinuous conduction mode(DCM) operation of an input current. The proposed converter has the characteristics of the good power factor, low line current harmonics, and tight output regulation. Furthermore, the ringing effect due to the output capacitance of the main switch can be eliminated by use of active clamp circuit.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.389-393
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• 2003

This paper presents circuit modeling and characterization of silicon-based on-chip integrated inductors in Giga Hertz range for wireless communication products. We compare several different designs of on-chip inductors for self-resonant frequency and quality factor. The measurement data could be used as a design guide for manufacturing practical spiral inductors for wireless applications. We provide the equivalent inductor circuit parameters from the actual measurement data.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.6
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• pp.58-65
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• 1993

In this research, we developed a new algorithm for hierarchical placement of integrated circuits. For efficient placement of a large circuit, the given circuit is recursively partitioned to form a hierarchy tree and then simulated-annealing-based placement method is applied at each level of the hierarchy to find a near optimum solution. During the placemtnt, global optimization is performed at high levels of the hierarchy and local optimization is performed at low levels. When compared with conventional placement methods, the new hierarchical placement method produced favorable results.

• Journal of the Korean Society of Industry Convergence
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• v.21 no.6
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• pp.265-271
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• 2018

DC-DC buck converter is a critical building block in the power management integrated circuit (PMIC) architecture for the portable devices such as cellular phone, personal digital assistance (PDA) because of its power efficiency over a wide range of conversion ratio. To ensure a safe operation, avoid unexpected damages and enhance the reliability of the converter, fully-integrated protection circuits such as over voltage protection (OVP), under voltage lock out (UVLO), startup, and thermal shutdown (TSD) blocks are designed. In this paper, these three fully-integrated protection circuit blocks are proposed for use in the DC-DC buck converter. The buck converter with proposed protection blocks is operated with a switching frequency of 1 MHz in continuous conduction mode (CCM). In order to verify the proposed scheme, the buck converter has been designed using a 180 nm CMOS technology. The UVLO circuit is designed to track the input voltage and turns on/off the buck converter when the input voltage is higher/lower than 2.6 V, respectively. The OVP circuit blocks the buck converter's operation when the input voltage is over 3.3 V, thereby preventing the destruction of the devices inside the controller IC. The TSD circuit shuts down the converter's operation when the temperature is over $85^{\circ}C$. In order to verify the proposed scheme, these protection circuits were firstly verified through the simulation in SPICE. The proposed protection circuits were then fabricated and the measured results showed a good matching with the simulation results.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.6
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• pp.42-49
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• 2000

In this paper, we propose the parallel ternary logic circuit design algorithm to DCG Property with 2$^n$ nodes. To increase circuit integration, one of the promising approaches is the use of multiple-valued logic(MVL). It can be useful methods for the realization of compact integrated circuit, the improvement of high velocity signal processing using parallel signal transmission and the circuit design algorithm to optimize and satisfy the circuit property. It is all useful method to implement high density integrated circuit. In this paper, we introduce matrix equation to satisfy given DCG with 2$^n$ nodes, and propose the parallel ternary logic circuit design process to circuit design algorithm. Also, we propose code assignment algorithm to satisfy for the given DCG property. According to the simulation result of proposed circuit design algorithm, it have the following advantage ； reduction of the circuit signal lines, computation time and costs.

• Journal of electromagnetic engineering and science
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• v.13 no.4
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• pp.233-239
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• 2013

This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.5
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• pp.682-687
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• 2022

In this paper, the research results on monolithic three-dimensional integrated-circuit (M3DICs) stacked with tunneling field effect transistors (TFETs) are introduced. Unlike metal-oxide-semiconductor field-effect transistors (MOSFETs), TFETs are designed differently from the layout of symmetrical MOSFETs because the source and drain of TFET are asymmetrical. Various monolithic 3D inverter (M3D-INV) structures and layouts are possible due to the asymmetric structure, and among them, a simple inverter structure with the minimum metal layer is proposed. Using the proposed M3D-INV, this M3D logic gates such as NAND and NOR gates by sequentially stacking TFETs are proposed, respectively. The simulation results of voltage transfer characteristics of the proposed M3D logic gates are investigated using mixed-mode simulator of technology computer aided design (TCAD), and the operation of each logic circuit is verified. The cell area for each M3D logic gate is reduced by about 50% compared to one for the two-dimensional planar logic gates.