• Proceedings of the Korean Nuclear Society Conference
• /
• 2001.10a
• /
• pp.276.2-276
• /
• 2001

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.13 no.2
• /
• pp.808-816
• /
• 2012

This paper is the study for the directional solidification of the ingot through the thermal analysis simulation and structural change of casting furnace. With the results of thermal analysis simulation, the silicon as a whole has reached the melting temperature as the retention time 80 min. The best cooling conditions showed at the upper cooling temperature $1,400^{\circ}C$ and cooling time 60min. The fabricated wafers showed the superior etching result at the grain boundary than that of existing commercial wafers. The FTIR measurements of oxygen and carbon impurities were not in the critical value for solar conversion efficiency. The NAA analysis of metal impurities were also detected the total number of 18 different metals, but the concentration distribution showed no significant positional deviations in the same position from the top to the bottom.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.9 no.6
• /
• pp.542-546
• /
• 1999

InP single crystal, III-V binary compound semiconductor, was grown by VGF(vertical gradient freeze) method using quartz ampoule and its electrical optical properties were investigated. Phosphorous powders were put in the bottom of quartz ampoule and Indium metal charged in conical quartz crucible what was attached at the upper side position inside the quartz ampoule. It was vacuous under the pressure of $10^5$Torr and sealed up. Indium metal was melted at $1070^{\circ}C$ and InP composition was formed by diffusion of phosphorous sublimated at $450^{\circ}C$ into Indium melt. By cooling the InP composition melt ($2^{\circ}C$~$5^{\circ}C$/hr of cooling rate) in range of $1070^{\circ}C$~$900^{\circ}C$, InP crystal was grown. The grown InP single crystals were investigated by X-ray analysis and polarized optical microscopy. Electrical properties were measured by Van der Pauw method. At the cooling method. At the cooling rate of $2^{\circ}C$/hr, growth direction of ingot was [111] and the quality of ingot was better at the upper side of ingot than the lower side. It was found that the InP crystals were n-type semiconductor and the carrier concentration, electron mobility and relative resistivity were $10^{15}$~$10^{16}/\textrm{cm}^3$ , $2\times 10^3$~$3\times 10^4{\textrm}{cm}^2$/Vsec and$2\times 10^{-1}$~$2\times 10^{-3}$/ Wcm in the range of 150K~300K, respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.1
• /
• pp.29-35
• /
• 1998

Substrates, SiC raw materials and graphite crucibles were purified for growing the high quality 6H-SiC single crystal ingot. Especially, XRD data of raw materials were analyzed before and after purification. We have grown 6H-SiC single crystal ingot up to 33 mm in diameter and 11 mm in length and SiC wafer for using the substrate and observing the internal defects was about 33 mm in diameter and 0.5 mm in thickness. Utilizing optical microscpe and Raman spectroscopy, internal defects density and crystallinity of the SiC wafer obtained by purification processes before crystal growth were measured. As a result, micropipe density and planar defect density were 100/$\textrm{cm}^2$ and 30/$\textrm{cm}^2$ respectively. Therefore, high quality 6H-SiC single crystal could be grown because internal defects density of 6H-SiC single crystal ingot was decreased by the purification processes before crystal growth.

• Nuclear Engineering and Technology
• /
• v.38 no.1
• /
• pp.93-98
• /
• 2006

The radial uniformity of neutron irradiation in silicon ingots for neutron transmutation doping (NTD) at HANARO is examined by both calculations and measurements. HANARO has two NTD holes named NTD1 and NTD2. We have been using the NTD2 hole for 5 in. NTD commercial service, and we intend to use two holes for 6 in. NTD. The objective of this study is to predict the radial uniformity of 6 in. NTD at the two holes. The radial neutron flux distributions inside single crystal and noncrystal silicon loaded at the NTD2 hole are calculated by the VENTURE code. For NTD1, the radial distributions of the reaction rate for a 6 in. NTD with a neutron screen are calculated by MCNP, and measured by gold wire activation. The results of the measurements are compared with those of the calculations. From the VENTURE calculation, it is confirmed that the neutron flux distribution in the single crystal silicon is much flatter than that in the non-crystal silicon. The non-uniformities of the measurements for radial neutron irradiation are slightly larger than those of the calculations. However, excluding local dips in the measurements, the overall trends of the distributions are similar. The radial resistivity gradient (RRG) for a 5 in. silicon ingot is estimated to be about $1.5\%$. For a 6 in. ingot, the RRG of a silicon ingot irradiated at HANARO is predicted to be about $2.1\%$. Also, from the experimental results, we expect that the RRG would not be larger than $4.4\%$.

• Current Photovoltaic Research
• /
• v.4 no.3
• /
• pp.124-129
• /
• 2016

Recently industry has voiced a need for optimally designing the production process of low-cost, high-quality ingots by improving productivity and reducing production costs with the Czochralski process. Crystalline defect control is important for the production of high-quality ingots. Also oxygen is one of the most important impurities that influence crystalline defects in single crystals. Oxygen is dissolved into the silicon melt from the silica crucible and incorporated into the crystalline a far larger amount than other additives or impurities. Then it is eluted during the cooling process, there by causing various defect. Excessive quantities of oxygen degrade the quality of silicone. However an appropriate amount of oxygen can be beneficial. because it eliminates metallic impurities within the silicone. Therefore, when growing crystals, an attempt should be made not to eliminate oxygen, but to uniformly maintain its concentration. Thus, the control of oxygen concentration is essential for crystalline growth. At present, the control of oxygen concentration is actively being studied based on the interdependence of various factors such as crystal rotation, crucible rotation, argon flow, pressure, magnet position and magnetic strength. However for methods using a magnetic field, the initial investment and operating costs of the equipment affect the wafer pricing. Hence in this study simulations were performed with the purpose of producing low-cost, high-quality ingots through the development of a process to optimize oxygen concentration without the use of magnets and through the following. a process appropriate to the defect-free range was determined by regulating the pulling rate of the crystals.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.20 no.2
• /
• pp.101-105
• /
• 2010

Silicon electrode and ring in a plasma etcher those are in contact with harsh plasma suffer from periodic heating and cooling during their lifetime. This causes the silicon components failure due to thermal stress remaining the persistent slip bands (PSBs) on their surfaces. The factors that determine the lifetime of silicon electrode and ring were discussed with respect to silicon ingot. The impurity level and the average defect concentration measured with glow discharge mass spectrometer (GDMS) and microwave photo-conductance decay (${\mu}$-PCD) were compared with the grade of silicon ingots those are divided to slip-free and slip-allowed ingot. Some silp-allowed samples showed planar defects along <110> direction on {001} surface. The role of these defects was suggested from the viewpoint of the lifetime of silicon components.

• Journal of Technologic Dentistry
• /
• v.36 no.3
• /
• pp.149-158
• /
• 2014

Purpose: Dental casting Co-Cr-Mo based alloys of five kinds of ingot type and two kinds of shot type were analyzed the melting processes with heating time of high frequency induction centrifugal casting machine using infrared thermal image analyzer. Methods: When Co-Cr-Mo based alloys were put about 30g/charge in the ceramic crucible of high frequency induction centrifugal casting machine and heat, Infrared thermal image analyzer and IR thermometer indicated these alloys in the crucible were set and operated. Results: The melting temperatures of alloys measuring infrared thermal image analyzer were deviated ${\pm}10^{\circ}C$ compared to those of manufacturing company. On the other hand, the melting time of alloys were differently appeared with the shape of alloys(ingot and shot type). Conclusion: The melting temperatures of dental Co-Cr-Mo based alloys were measured the degree of $1,360{\sim}1410^{\circ}C$ and the heating time with the alloys of ingot and shot type were deviated ${\pm}10sec$.

• Korean Journal of Materials Research
• /
• v.8 no.11
• /
• pp.1038-1042
• /
• 1998

Mechanical grinding and subsequent annealing were applied to the $Nd_5Pr_7Fe_{82}B_6$ and $Nd_{12}Fe_{82}B_6$ ingots, and the crystal structure and magnetic properties were investigated. After 330 hours milling, the particles with $2~3\mu\textrm{m}$average size were identified to be composed of very fine crystallites judging from the x-ray diffraction patterns. The intrinsic coercivity of 18.36 ~ 18.79 kOe and the maximum energy product of 8.32-8.38 MGOe were obtained by the annealing of the milled powders at $600^{\circ}C$ for 2 hours. Annealing at a higher temperature resulted in the improved magnetic properties. However it was revealed that the control of the micro-crystallites formed during the grinding process was more important to get an optimized magnetic properties than the annealing condition.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.4
• /
• pp.1915-1920
• /
• 2013

This paper is the study for the directional solidification of the ingot through the thermal analysis simulation and structural change of casting furnace. With the results of thermal analysis simulation, the silicon as a whole has reached the melting temperature as the retention time 80 min. The best cooling conditions showed at the upper cooling temperature $1,400^{\circ}C$ and cooling time 60min. The fabricated wafers showed the superior etching result at the grain boundary than that of existing commercial wafers. The FTIR measurements of oxygen and carbon impurities were not in the critical value for solar conversion efficiency. The NAA analysis of metal impurities were also detected the total number of 18 different metals, but the concentration distribution showed no significant positional deviations in the same position from the top to the bottom.