• Korean Journal of Materials Research
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• v.21 no.6
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• pp.334-340
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• 2011

Saw wires have been widely used in industries to slice silicon (Si) ingots into thin wafers for semiconductor fabrication. This study investigated the microstructural and mechanical properties, such as abrasive wear and tensile properties, of a saw wire sample of 0.84 wt.% carbon steel with a 120 ${\mu}M$ diameter. The samples were subjected to heat treatment at different linear velocities of the wire during the patenting process and two different wear tests were performed, 2-body abrasive wear (grinding) and 3-body abrasive wear (rolling wear) tests. With an increasing linear velocity of the wire, the tensile strength and microhardness of the samples increased, whereas the interlamellar spacing in a pearlite structure decreased. The wear properties from the grinding and rolling wear tests exhibited an opposite tendency. The weight loss resulting from grinding was mainly affected by the tensile strength and microhardness, while the diameter loss obtained from rolling wear was affected by elongation or ductility of the samples. This result demonstrates that the wear mechanism in the 3-body wear test is much different from that for the 2-body abrasive wear test. The ultra-high tensile strength of the saw wire produced by the drawing process was attributed to the pearlite microstructure with very small interlamellar spacing as well as the high density of dislocation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.1
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• pp.24-31
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• 2019

The current study demonstrates an efficient procedure to create ingots from $Al_2O_3$ powder using the skull melting method to use these ingots as a starting material in conventional methods for growing synthetic single-crystal sapphire. Dimension of the cold crucible was 24 cm in inner diameter and 30 cm in inner height, 15 kg of $Al_2O_3$ powder was completely melted within 1 h at an oscillation frequency of 2.75 MHz, maintained in the molten state for 3 h, and finally air-cooled. The areal density and components of the cooled ingot by parts were analyzed through scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS). The areal density and $Al_2O_3$ content of the ingot were related to the temperature distribution inside the cold crucible during high-frequency induction heating, and the area with high temperature was high tends to be high in areal density and purity.

• Journal of Korea Foundry Society
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• v.41 no.2
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• pp.139-143
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• 2021

A type of titanium alloy, ferro-titanium, is the main material used to manufacture steel and stainless steel. Considering economic aspects, ferro-titanium ingots are intended to be manufactured using low-cost titanium scrap, and the best pretreatment process for removing impurities from recycled titanium scrap surfaces was studied here. Instead of ordinary acid or organic solvents, ecofriendly methods were researched and applied, and chip scrap materials were used. A high-quality ferro-titanium ingot was manufactured from titanium scrap after a pretreatment process was applied, and the impurities and properties were analyzed and compared with commercial material standards through a component analysis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.626-630
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• 2022

A 100 mm × 50 mm-sized (100) gallium oxide (Ga₂O₃) single crystal ingot was successfully grown by edge-defined film-fed growth (EFG). The preferred orientation and the quality of grown Ga₂O₃ ingot were compatible with a commercial Ga₂O₃ substrate by showing strong (100) orientation behaviors and 246 arcsec in X-ray rocking curve. Raman characterization was also performed for both samples; thereby providing various Raman-active characteristics of Ga₂O₃ crystals. In particular, we observed A_g(5) and A_g(10) peaks of Raman active mode, directly related to the impurity of the grown Ga₂O₃ crystal. Hence, the comparison of the crystal quality and Raman analysis might be useful for further enhancement of Ga₂O₃ single crystal quality in the future.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1999.06a
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• pp.419-431
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• 1999

InP, III-V binary compound semiconductor, single crystal was grown by VGF (vertical gradient freeze) method using quartz ampoule and its electrical optical properties were investigated. Phosphorous powders were put in the bottom of quartz ampoule and Indium metal changed in conical quartz crucible hat was attached at the upper side position inside the quartz ampoule. It was vacuous under the pressure of 10-5 Torr and sealed up. In metal in the quartz crucible was melted at 1070$^{\circ}C$ and phophorous sublimated at 450$^{\circ}C$, there after it was diffused in In melt and so InP composition was formed. By cooling the InP composition melt (2$^{\circ}C$∼5$^{\circ}C$/hr of cooling rate) in range of 1070$^{\circ}C$∼900$^{\circ}C$, InP crystal was grown. the grown InP single crystals were investigated by X-ray analysis and polarized optical microscopy. Electrical properties of them were measured by Van der Pauw method. At the cooling rate of 2$^{\circ}C$/hr, its direction was (111), quality of the ingot ws better upper side of the ingot than lower. It was found that the InP crystals were n-type semiconductor and the carrier concentration, electron mobility and relative resistivity were 1015∼1016/㎤, 2x103∼3x104$\textrm{cm}^2$/Vsec and 2x10-1∼2x10-3Ωcm in the range of 150K∼300K, respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.2
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• pp.148-156
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• 1994

Three composition in the system of $YO_{1.5}-BaO-CuO$ were grown using a cold crucible (skull) melting technique with a 50 kW R.F. induction generator operating at 4 MHz as the power source. The starting materials were prepared by conventional ceramic powder processing methods, loaded into the skull, and melted at about $1200^{\circ}C$. For this study, compositions near the $YBa_2Cu_3O_X$ region were selected. The growth rates used ranged from 4 cm/hr to 0.25 cm/hr. The relation between the microstructures and the starting composition of each ingot was determined using metallograph, X-ray diffraction, and energy dispersive X-ray analysis. Both $YBa_2Cu_3O_X$ and $Y_2BaCuO_5$ needle-shaped crystals, aligned with the growth direction, were formed in the $CuO-BaCuO_2$ eutectic matrix of the $YBa_2Cu_7O_x and YBa_5Cu_{11}O_x$ ingot.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.329-332
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• 2008

Nowadays, It is required human body-friendly, good mechanical properties, and economical efficiency material, simultaneously. The material to meet above requirement condition rear up high nitrogen stainless steel(HNS). However, HNS have a lot of problem such as poor workability, hot crack sensitivity. So, It is needed the condition of plastic working to overcome above many problem. In this study, VIM ingot with 100kg was made by pressurized vacuum induction melting. And then, The slab perform for hot rolling was prepared by open-die forging. Hot rolling process was performed by computer simulation according to change of height reduction, rolling temperature, heating numbers, rolling pass and so forth. The results of analysis were investigated between analysis and lab-scale rolling product.

• Journal of Korea Foundry Society
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• v.11 no.3
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• pp.245-253
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• 1991

It is known that the analysis of thermal stresses is substantially important in optimal design of casting mould. In this paper unsteady state thermal stresses generated in ingot and mould during the solidification process are analyzed by the two dimensional thermal elasto-plastic analysis. Distribution of temperature and stress of the mould is calculated using the finite element method and compared with experimental result. The significant results obtained in this study are as follows. At the early stage of the casting process, abrupt temperature change was shown in the vicinity of the inner surface of the mould. The largest temperature gradient is occurred at the corner of the mould. In the thermal stress analysis, compressible stress occurred in the inside wall of the mould where as tensile stress on outside wall. Smaller thermal stress is observed at the rounded corner. It is also observed that the shown is influenced by the thickness of the wall. A fairly good coincidence is found between analytical and experimental results, showing that the proposed analytical methodology is reliable.

• Journal of Korea Foundry Society
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• v.18 no.5
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• pp.462-466
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• 1998

Interest in rapid solidification of magnesium alloys stems from the fact that conventional ingot metallurgy alloys exhibit poor strength, ductility, and corrosion resistance. Such properties can be improved by microstructural refinement via rapid solidification processing. Mg-5wt%Zn alloys have been produced as continuous strips by melt overflow technique and the strips were consolidated by hot extrusion. The yield stress, tensile strengh and ductility obtained in asextruded Mg-5wt%Zn alloy were ${\sigma}_{0.2}=152\;MPa$, ${\sigma}_{T.S{\cdot}}=263\;MPa$ and ${\varepsilon}=21.8%$. In order to evaluate the influence of additional elements on mechanical properties, Th and Zr were added in rapidly solidified Mg-5wt%Zn alloy. An 130% increase in yield stress of as-extruded Mg-5wt%Zn-3wt%Th-1wt%Zr alloy was attributed to grain refinement by rapid solidification and elemental addition.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.295-298
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• 2015

Ozone micro-bubble cleaning system was designed, and made to develop a unique technique to clean wafers by using ozone micro-bubbles. The ozone micro-bubble cleaning system consisted of loading, cleaning, rinsing, drying and un-loading zones, respectively. In case of the cleaning the silicon wafers of a solar cell, more than 99 % of cleaning efficiency was obtained by dipping the wafers at 10 ppm of ozone for 10 minutes. Both of long cleaning time and high ozone concentration in the wet-solution with ozone micro-bubbles reduced cleaning efficiency because of the re-sorption of debris. The cleaning technique by ozone micro-bubbles can be also applied to various wafers for an ingot and LED as an eco-friendly method.