• Journal of agriculture & life science
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• v.46 no.2
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• pp.9-17
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• 2012

In this study, in addition to the green tea - wood fiber hybrid composite boards of previous researches, to make effective use of saw dust of domestic cypress tree with functionalities and application as interior materials, eco-friendly hybrid composite boards were manufactured from wood fiber, green tea and saw dust of cypress tree. We investigated the effect of the component ratio of saw dust and green tea on dynamic MOE (modulus of elasticity). Dynamic MOE was within 1.41~1.65 GPa, and showed the highest value in wood fiber : green tea : saw dust = 50 : 40 : 10 of the component ratio, and had the lowest value in 50 : 30 : 20 of component ratio. These values were 1.4~1.6 times higher than static bending MOE of wood fiber - saw dust - green tea hybrid composite boards, and were 2.0~2.9 times lower than those of green tea - wood fiber hybrid composite boards reported in the previous researches. From the results of correlation regression analyses between dynamic MOE and static strength performances, a very high correlation coefficients were obtained, therefore it was found that static bending strength performances can be estimated with a high reliability from dynamic MOE.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.