• 소성∙가공
• /
• 제13권1호
• /
• pp.65-71
• /
• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• 한국전기전자재료학회논문지
• /
• 제28권3호
• /
• pp.175-179
• /
• 2015

In this study, we propose Ti hole pattern structure on the transparent conductive oxide (TCO) less dye-sensitized solar cells (DSSCs) using the lift-off process to improve the low light transmittance and low efficiency caused by opaque Ti electrode. The formation of Ti hole patterns make it possible to move the dye adsorption and electrolyte. The DSSCs with Ti hole patterns showed a higher photoelectric conversion efficiency (PCE) than those with general structure by 11.1%. As a result, The Ti hole pattern structure can be improved to increase the light absorption of the dyes and PCE of the TCO-less DSSCs is also increased.

• 한국멀티미디어학회논문지
• /
• 제18권9호
• /
• pp.997-1007
• /
• 2015

In this paper, we propose a method for automatically analyzing the bone formation in a mouse model of frontal bone defect. We perforate two holes of 0.8mm diameter in the frontal bone and observe the bone formation process using a micro CT. Because the conventional analysis software of the micro CT does not support automatic analysis of the bone formation status, we have to use a manual analysis method. However the manual analysis is very cumbersome and requires a lot of time, we propose an automatic analysis method. It rotates the image around three axes directions so that the mouse's skull come into regular position. It calculates the cumulative image of the voxel values for the perforated bone surface. It estimates the hole location by finding the darkest point in the cumulative image. The proposed method was applied to 24 CT images of saline administration group and PTH administration group and hole location was estimated. BV/TV index was calculated for the estimated hole to evaluate the bone formation status. Experimental results showed that bone formation process is more active in PTH administration group. The method proposed in this paper could replace successfully the cumbersome and time consuming manual job.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 추계학술대회논문집
• /
• pp.101-106
• /
• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2006년 추계학술발표대회 개요집
• /
• pp.190-192
• /
• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• 한국초전도ㆍ저온공학회논문지
• /
• 제20권3호
• /
• pp.5-10
• /
• 2018

This study presents that various grain boundary junctions are prepared by controlling the seed orientation combined with an artificial hole in a melt process REBCO bulk superconductor. Large grain YBCO superconductors have been fabricated with various grain boundary junctions that the angle between the grain boundary and the <001> axis of Y123 crystal is $0^{\circ}$, $30^{\circ}$ and $45^{\circ}$, respectively. The presence of the artificial hole is beneficial for the formation of clean grain boundary junction and single peak trapped magnetic field profiles have been obtained. Artificial hole makes two growth fronts meet at a point on a periphery of the artificial hole. The presence of artificial hole is not likely to affect on the distribution of Y211 particles. The newly formed <110> facet lines are explained by the formation of new Y123/liquid interface with (010) crystallographic plane.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1987년도 정기총회 및 창립40주년기념 학술대회 학회본부
• /
• pp.207-209
• /
• 1987

This paper reports the effect of additive elements such as Bi, Sb on degradation and hole formation of the Te-Se thin films. Changes in light transmission were used to monitor the degradation rate of thin Te films in an accelerated temperature-humidity environment. In thin accelerated temperature-humidity environment, $(Te_{86}Se_{14})_{70}Bi_{30}$ thin film was stable and $(Te_{86}Se_{14})_{50}Sb_{50}$ thin film was unstable in comparison with the other films that used in this experiment. The hole formation was carried out in the Te-based thin films.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2011년도 춘계학술대회 논문집
• /
• pp.201-202
• /
• 2011

• 한국지반공학회:학술대회논문집
• /
• 한국지반공학회 2005년도 지반공학 공동 학술발표회
• /
• pp.352-359
• /
• 2005

In this study, seismic refraction survey and MASW at dam crest and down-hole test and cross hole test in the boring holes located in dam crest through the core are performed to fin out dynamic material properties, are needed to evaluate dynamic safety of rockfill dam using dynamic analysis method. From the field test and geophysical exploration, applied such as above, p-wave and s-wave velocity profile of each layer of dam body. Dynamic material properties, such as elastic modulus, shear modulus, poissong's ration, are obtained from p-wave and s-wave velocity profile and density profile from formation density logging test.

• 천문학회보
• /
• 제42권1호
• /
• pp.59.1-59.1
• /
• 2017

Massive Population III black hole binary systems are one of the suggested candidate sources of the recently detected gravitational wave radiation (GWR). GWR detection from a black hole binary system requires a sufficiently short orbital separation at the time of their formation, such that they would undergo coalescence within the Hubble time. This condition cannot be simply fulfilled by a short initial period, because binary interactions such as mass transfer and common envelope evolution can largely change the orbital parameters and the masses of stellar components. Here, we discuss the possibility of black hole binary mergers from massive Pop III binary systems, using a new grid of Pop III binary evolutionary models with various initial primary masses ($20M_{\odot}{\leq}M{\leq}100M_{\odot}$) and initial separations, for different initial mass ratios (q = 0.5 - 0.9).