• Title/Summary/Keyword: hole filling

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Virtual View Generation by a New Hole Filling Algorithm

  • Ko, Min Soo;Yoo, Jisang
    • Journal of Electrical Engineering and Technology
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    • v.9 no.3
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    • pp.1023-1033
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    • 2014
  • In this paper, performance improved hole-filling algorithm which includes the boundary noise removing pre-process that can be used for an arbitrary virtual view synthesis has been proposed. Boundary noise occurs due to the boundary mismatch between depth and texture images during the 3D warping process and it usually causes unusual defects in a generated virtual view. Common-hole is impossible to recover by using only a given original view as a reference and most of the conventional algorithms generate unnatural views that include constrained parts of the texture. To remove the boundary noise, we first find occlusion regions and expand these regions to the common-hole region in the synthesized view. Then, we fill the common-hole using the spiral weighted average algorithm and the gradient searching algorithm. The spiral weighted average algorithm keeps the boundary of each object well by using depth information and the gradient searching algorithm preserves the details. We tried to combine strong points of both the spiral weighted average algorithm and the gradient searching algorithm. We also tried to reduce the flickering defect that exists around the filled common-hole region by using a probability mask. The experimental results show that the proposed algorithm performs much better than the conventional algorithms.

Hole-Filling Method for Depth-Image-Based Rendering for which Modified-Patch Matching is Used (개선된 패치 매칭을 이용한 깊이 영상 기반 렌더링의 홀 채움 방법)

  • Cho, Jea-Hyung;Song, Wonseok;Choi, Hyuk
    • Journal of KIISE
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    • v.44 no.2
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    • pp.186-194
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    • 2017
  • Depth-image-based rendering is a technique that can be applied in a variety of 3D-display systems. It generates the images that have been captured from virtual viewpoints by using a depth map. However, disoccluded hole-filling problems remain a challenging issue, as a newly exposed area appears in the virtual view. Image inpainting is a popular approach for the filling of the hole region. This paper presents a robust hole-filling method that reduces the error and generates a high quality-virtual view. First, the adaptive-patch size is decided using the color and depth information. Also, a partial filling method for which the patch similarity is used is proposed. These efforts reduce the error occurrence and the propagation. The experiment results show that the proposed method synthesizes the virtual view with a higher visual comfort compared with the existing methods.

TSV Filling Technology using Cu Electrodeposition (Cu 전해도금을 이용한 TSV 충전 기술)

  • Kee, Se-Ho;Shin, Ji-Oh;Jung, Il-Ho;Kim, Won-Joong;Jung, Jae-Pil
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.11-18
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    • 2014
  • TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

Hole-filling Method to Enhance Viewing Characteristics for Multilayer Type 3D Display System U sing a DMD

  • Baek, Hogil;Choi, Sungwon;Kim, Hyunho;Choi, Hee-Jin;Min, Sung-Wook
    • Current Optics and Photonics
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    • v.4 no.6
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    • pp.545-550
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    • 2020
  • We propose a hole-filling method to solve discontinuous depth representation and to reduce the visible seams and cracks that cause the limitation of the viewing angle of the three-dimensional (3D) image in the multilayer type 3D display system. The occlusion and the disocclusion regions between layers, such as the visible seams and cracks, are a major bottleneck of the multilayer type 3D display system to represent a volumetric 3D image by stacking multiple images. As a result, in the reconstructed 3D image, the visible seams and cracks appear as brighter overlapping and undesirable cut-off. In order to resolve the problems above, we applied the depth-fused effect to the sub-depth map generating algorithm and improve the viewing characteristics of the multilayer type 3D display. The experimental demonstrations are also provided to verify the proposed scheme.

Parametric Blending of Hole Patches Based on Shape Difference (형상 차이 기반 홀 패치의 파라미트릭 블렌딩 기법)

  • Park, Jung-Ho;Park, Sanghun;Yoon, Seung-Hyun
    • Journal of the Korea Computer Graphics Society
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    • v.26 no.3
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    • pp.39-48
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    • 2020
  • In this paper, we propose a new technique for filling holes in triangular mesh. First, arbitrary shaped holes are detected. Second, source and target hole patches are generated through triangulation, refinement, fairing, and smoothing. Finally, the shape difference between the two patches is analyzed and a patch with enhanced features is obtained through blending between patches. The effectiveness of the proposed technique is demonstrated by applying the hole filling technique to the triangular mesh model with various shaped holes.

Filling the Submicron Contact Holes with Al Alloys (AI 합금의 Contact Hole Filling 에 관한 연구)

  • 김용길
    • Journal of the Korean Vacuum Society
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    • v.2 no.4
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    • pp.474-479
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    • 1993
  • Submicron contact hole filling with aluminum alloys has been achieved with a multistep metallization method, which utilizes a metal " flow" or self-diffusion process at elevated temperatures after the metal was sputter-deposited. A multi-chamber, modular sputtering system was employed to deposit aluminum alloys and subsequently to anneal the deposited metal films under vacuum at high temperatures. The film were deposited on 200 mm wafers with planar, dc magnetron sputtering sources without anysubstrate bias. The basic process steps studied for the multistep metallization include an initial layer deposition at low temperatures less than $100^{\circ}C$, and an annealin gstep at elevated temperatures, between 450 and $550^{\circ}C$. The degree of planarization or step coverage was dependent strongly upon the temperature and time of the flow step and complete filling of the submicron contacts with aluminum alloys was achieved. Responsible mechanisms for the enhancement in step coverge and factros determining uniform and reproducible flow of aluminum alloys during the high temperauture step are discussed.discussed.

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Development of Tip Device for Hydraulic Filling Efficiency Improvements (수압식 충전의 효율 향상을 위한 선단장치 개발에 관한 연구)

  • Yu, Sung-Kon;Kim, Tae-Heok;Shin, Dong-Chun
    • Tunnel and Underground Space
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    • v.22 no.6
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    • pp.403-411
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    • 2012
  • In recent, the using of the hydraulic filling method has increased on the underground reinforcement of the abandoned mine in Korea, however it is the lack of research on the efficient filling method. In this study, tank model tests and field tests were conducted for development of tip device for filling efficiency improvements on the hydraulic filling method. In tank model experiments, the filling efficiency was evaluated according to the form and angle of the nozzle on tip device in the same condition. Then tip device model designed by tank model tests was applied to the field experiment. As a result, the amount of filling of nozzle $90^{\circ}$ tube is increased by approximately 18% compared to the common vertical injection pipe. The angle of repose was $30.82^{\circ}$. Filling hole spacing in the field is usually designed from 5m up to 10m assumed to be $40^{\circ}$ of the angle of repose. According to the results of this study, it is possible that the filling hole spacing expands at least 10m up to 15m applied to be $30^{\circ}{\sim}35^{\circ}$ of the angle of repose. Therefore, it is expected to be economical and efficient mine filling.

Boundary Noise Removal and Hole Filling Algorithm for Virtual Viewpoint Image Generation (가상시점 영상 생성을 위한 경계 잡음 제거와 홀 채움 기법)

  • Ko, Min-Soo;Yoo, Ji-Sang
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.37 no.8A
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    • pp.679-688
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    • 2012
  • In this paper, performance improved hole-filling algorithm including boundary noise removing pre-process which can be used for an arbitrary view synthesis with given two views is proposed. Boundary noise usually occurs because of the boundary mismatch between the reference image and depth map and common-hole is defined as the occluded region. These boundary noise and common-hole created while synthesizing a virtual view result in some defects and they are usually very difficult to be completely recovered by using only given two images as references. The spiral weighted average algorithm gives a clear boundary of each object by using depth information and the gradient searching algorithm is able to preserve details. In this paper, we combine these two algorithms by using a weighting factor ${\alpha}$ to reflect the strong point of each algorithm effectively in the virtual view synthesis process. The experimental results show that the proposed algorithm performs much better than conventional algorithms.