• Title/Summary/Keyword: high-temperature shift

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Long-Term Stability for Co-Electrolysis of CO2/Steam Assisted by Catalyst-Infiltrated Solid Oxide Cells

  • Jeong, Hyeon-Ye;Yoon, Kyung Joong;Lee, Jong-Ho;Chung, Yong-Chae;Hong, Jongsup
    • Journal of the Korean Ceramic Society
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    • v.55 no.1
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    • pp.50-54
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    • 2018
  • This study investigated the long-term durability of catalyst(Pd or Fe)-infiltrated solid oxide cells for $CO_2$/steam co-electrolysis. Fuel-electrode supported solid oxide cells with dimensions of $5{\times}5cm^2$ were fabricated, and palladium or iron was subsequently introduced via wet infiltration (as a form of PdO or FeO solution). The metallic catalysts were employed in the fuel-electrode to promote $CO_2$ reduction via reverse water gas shift reactions. The metal-precursor particles were well-dispersed on the fuel-electrode substrate, which formed a bimetallic alloy with Ni embedded on the substrate during high-temperature reduction processes. These planar cells were tested using a mixture of $H_2O$ and $CO_2$ to measure the electrochemical and gas-production stabilities during 350 h of co-electrolysis operations. The results confirmed that compared to the Fe-infiltrated cell, the Pd-infiltrated cell had higher stabilities for both electrochemical reactions and gas-production given its resistance to carbon deposition.

Numerical Study on the Performance and the Heat Flux of a Coaxial Cylindrical Steam Reformer for Hydrogen Production (수소 생산을 위한 동축원통형 수증기 개질기의 성능 및 열유속에 대한 수치해석 연구)

  • Park, Joon-Guen;Lee, Shin-Ku;Bae, Joong-Myeon;Kim, Myoung-Jun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.33 no.9
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    • pp.709-717
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    • 2009
  • Heat transfer rate is a very important factor for the performance of a steam reformer because a steam reforming reaction is an endothermic reaction. Coaxial cylindrical reactor is the reactor design which can improve the heat transfer rate. Temperature, fuel conversion and heat flux in the coaxial cylindrical steam reformer are studied in this paper using numerical method under various operating conditions. Langmuir-Hinshelwood model and pseudo-homogeneous model are incorporated for the catalytic surface reaction. Dominant chemical reactions are assumed as a Steam Reforming (SR) reaction, a Water-Gas Shift (WGS) reaction, and a Direct Steam Reforming (DSR) reaction. Although coaxial cylindrical steam reformer uses 33% less amount of catalyst than cylindrical steam reformer, its fuel conversion is increased 10 % more and its temperature is also high as about 30 degree. There is no heat transfer limitation near the inlet area at coaxial-type reactor. However, pressure drop of the coaxial cylindrical reactor is 10 times higher than that of cylindrical reactor. Operating parameters of coaxial cylindrical steam reformer are the wall temperature, the inlet temperature, and the Gas Hourly Space Velocity (GHSV). When the wall temperature is high, the temperature and the fuel conversion are increased due to the high heat transfer rate. The fuel conversion rate is increased with the high inlet temperature. However, temperature drop clearly occurs near the inlet area since an endothermic reaction is active due to the high inlet temperature. When GHSV is increased, the fuel conversion is decreased because of the heat transfer limitation and short residence time.

High-Resolution Interrogation Technique for Fiber Bragg crating Sensor Using Long-Period Fiber Grating Pair and Erbium-Doped fiber

  • Jung, Jae-Hoon;Lee, Yong-Wook;Lee, Byoung-Ho
    • Journal of the Optical Society of Korea
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    • v.6 no.1
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    • pp.5-12
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    • 2002
  • A novel interrogation scheme to detect fine Bragg wavelength shift using a long period fiber grating pair with erbium-doped fiber inserted between the two gratings is reported. The technique is shown to feature high resolution and much more immunity to temperature perturbation compared to the conventioned Mach-Zehnder interferometer demodulation system. For quasi-static strain measurement, this approach provides high wavelength resolution of 0.05 pm that corresponds to 41.7 ne in strain and $3.8 $\times$ 10^{-3}$$^{\circ}C$ in temperature. This interrogation system is also employed in dynamic measurement to obtain the minimum detectable strain perturbation of ~ 8.76 ne/H $z^{{\frac}{1}{2}}$ at 100 Hz. Moreover, this interrogation system has prominent thermal stability. This thermal stability comes from the fact that two arms of the interferometer, the core and cladding in erbium-doped fiber, are exposed to nearly the same environment .

Characteristics of damaged layer in high speed end milling (고속 엔드밀 가공에서 가공변질층의 특성)

  • 김동은
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.326-331
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    • 2000
  • In this study, residual stress was investigated experimentally to evaluate damaged layer in high-sped machining. In machining difficult-to-cut material, residual stress remaining in machined surface was mainly speared as compressive stress. The scale of this damaged layer depends upon cutting speed, feed per tooth and radial cutting depth. Damaged layer was measured by optical microscope. The micro-structure of damaged layer was a mixed maternsite and austenite. depth of damaged layer is increased with increasing of cutting temperature, cutting force and radial depth. On the other hand, that is slightly decreased with decreasing of cutting force. The increase of tool wear causes a shift of the maximum residual stress in machined surface layer.

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The Effect of Grain Size on the Stress Shift toward Tensile Side by Deposition Interruptions in Copper Thin Films (구리 박막 제조중 증착 중단시 박막 결정립 크기 변화가 인장응력 방향으로의 응력 이동에 미치는 영향)

  • Lee, Seri;Oh, Seungkeun;Kim, Youngman
    • Journal of the Korean institute of surface engineering
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    • v.47 no.6
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    • pp.303-310
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    • 2014
  • In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

Comparative study between inelastic compressive buckling analysis and Eurocode 3 for rectangular steel columns under elevated temperatures

  • Seo, Jihye;Won, Deokhee;Kim, Seungjun
    • Steel and Composite Structures
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    • v.43 no.3
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    • pp.341-351
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    • 2022
  • This paper presents an inelastic buckling behavior analysis of rectangular hollow steel tubes with geometrical imperfections under elevated temperatures. The main variables are the temperature loads, slenderness ratios, and exposure conditions at high temperatures. The material and structural properties of steels at different temperatures are based on Eurocode (EN 1993-1-2, 2005). In the elastic buckling analysis, the buckling strength decreases linearly with the exposure conditions, whereas the inelastic buckling analysis shows that the buckling strength decreases in clusters based on the exposure conditions of strong and weak axes. The buckling shape of the rectangular steel column in the elastic buckling mode, which depicts geometrical imperfection, shows a shift in the position at which bending buckling occurs when the lower section of the member is exposed to high temperatures. Furthermore, lateral torsional buckling occurs owing to cross-section deformation when the strong axial plane of the model is exposed to high temperatures. The elastic buckling analysis indicates a conservative value when the model is exposed to a relatively low temperature, whereas the inelastic buckling analysis indicates a conservative value at a certain temperature or higher. The comparative results between the inelastic buckling analysis and Eurocode 3 show that a range exists in which the buckling strength in the design equation result is overestimated at elevated temperatures, and the shapes of the buckling curves are different.

Digital Predistortion Algorithm using Techniques of Temperature Compensation (온도보상 기법을 적용한 디지털 방식의 사전 왜곡제거기 알고리듬)

  • Ko, Young-En;Bang, Sung-Il
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.42 no.9 s.339
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    • pp.1-10
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    • 2005
  • In this paper, we proposed predistortion algerian that can compensate temperature distortion by digital. Predistortion algorithm produces compensation value of distortion by temperature as well as system nonlinear distortion by input level, and warps beforehand signal of baseband. To prove excellency of such algorithm we applied predistortion algorithm to Saleh's high power amplifier model, and did computer simulation. As a result, P1dB increased about 0.5 dBm phase shift reduced about $0.8^{o}$ than existent the A&P PD, and predistiortion algorithm to apply temperature compensation techniques improved P1dB about 2dBm and stabilized phase shift by about $0.1^{o}$ low. When approved UMTS's sample signal to this amplifier, IMD3 of amplifier decreased 10dBm than is no temperature compensation techniques, and reduced 19dBm than signal that is no distortion.

Influence of the hydrogen post-annealing on the electrical properties of metal/alumina/silicon-nitride/silicon-oxide/silicon capacitors for flash memories

  • Kim, Hee-Dong;An, Ho-Myoung;Seo, Yu-Jeong;Zhang, Yong-Jie;Kim, Tae-Geun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.122-122
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    • 2008
  • Recently, Metal/Alumina/Silicon-Nitride/Silicon-Oxide/Silicon (MANOS) structures are one of the most attractive candidates to realize vertical scaling of high-density NAND flash memory [1]. However, as ANO layers are miniaturized, negative and positive bias temperature instability (NBTI/PBTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density increase, ${\Delta}D_{it}$, the gate leakage current, ${\Delta}I_G$. and the retention characteristics, in MONOS capacitors, becomes an important issue in terms of reliability. It is well known that tunnel oxide degradation is a result of the oxide and interfacial traps generation during FN (Fowler-Nordheim) stress [2]. Because the bias temperature stress causes an increase of both interfacial-traps and fixed oxide charge could be a factor, witch can degrade device reliability during the program and erase operation. However, few studies on NBTI/PBTI have been conducted on improving the reliability of MONOS devices. In this work, we investigate the effect of post-annealing gas on bias temperature instability (BTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density shift, ${\Delta}I_G$ retention characteristics, and the gate leakage current characteristics of MANOS capacitors. MANOS samples annealed at $950^{\circ}C$ for 30 s by a rapid thermal process were treated via additional annealing in a furnace, using annealing gases $N_2$ and $N_2-H_2$ (2 % hydrogen and 98 % nitrogen mixture gases) at $450^{\circ}C$ for 30 min. MANOS samples annealed in $N_2-H_2$ ambient had the lowest flat band voltage shift, ${\Delta}V_{FB}$ = 1.09/0.63 V at the program/erase state, and the good retention characteristics, 123/84 mV/decade at the program/erase state more than the sample annealed at $N_2$ ambient.

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Deformation Measurement of Electronic Components in Mobile Device Using High Sensitivity Shadow Moiré Technique (고감도 그림자 무아레 기법을 이용한 모바일 전자부품의 변형 측정)

  • Yang, Hee-Gul;Joo, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.57-65
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    • 2017
  • The electronic components in mobile device are composed of electronic chips and various other materials. These components become extremely thin and the constituent materials have different coefficient of thermal expansion, so that considerable warpages occurs easily due to temperature change or external load. Shadow $moir{\acute{e}}$ is non-contact, whole field technique for measuring out-of-plane displacement, but the measurement sensitivity is not less than $50{\mu}m/fringe$, which is not suitable for measuring the warpage of the electronic components. In this paper, we implemented a measurement method with enhanced sensitivity of $25{\mu}m/fringe$ by investigating and optimizing various experimental conditions of the shadow $moir{\acute{e}}$. In addition, four $moir{\acute{e}}$ fringe patterns recorded by the phase shift are processes to obtain a $moir{\acute{e}}$ fringe patterns with a sensitivity four times higher. The measurement technique is applied to small electronic components of a smart phone for measuring warpage with a high sensitivity of $5{\mu}m/fringe$ at room temperature and at the temperature of $100^{\circ}C$.

Analysis of the spectral characteristics of white light-emitting diodes under various thermal environments

  • Jeong, Su-Seong;Ko, Jae-Hyeon
    • Journal of Information Display
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    • v.13 no.1
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    • pp.37-42
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    • 2012
  • An empirical functional form was suggested for the analysis of the emission spectrum of high-power light-emitting diode (LED) consisting of a sharp blue peak from the LED chips and a broad yellow peak from the phosphor layer. The peak positions, half widths, shape parameters, and amplitudes of these two peaks were reliably obtained as a function of the temperature, and the results were discussed qualitatively in relation with the junction temperature. The adoption of an inert liquid was found to have significantly reduced the LED temperature and the color shift of the emitted light. The phenomenological approach used in this study may be helpful in the simulation of the LED spectrum under various thermal conditions, and may thus be helpful in the improvement of the device performance.