• Journal of Welding and Joining
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• v.32 no.6
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• pp.41-46
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• 2014

In this study, cracking susceptibility of laser cladding was investigated according to the processing parameters such as laser power, scan speed and feeding rate with blended powders of stellite#6 and technolase40s (WC+NiCr). The solidification microstructure of clad was composed of Co-based dendrite structures with ${\gamma}+Cr7C3$ eutectic phases at the dendritic boundaries. The crack propagation showed transgranular fracture along dendritic boundaries due to brittle chrome carbide at the eutectic phases. From results of fractography experiments, the fracture surface was typical cleavage brittle fracture in the clad and substrate. The number of clad cracks, caused by a tensile stress after the solidification, increased with increase of laser power, scan speed and feeding rate. Increase of the laser power caused large pores by facilitating WC decarburizing reaction. And the pores affected increase of crack susceptibility. High scan speed caused increment of clad cracks due to thermal stress and WC particle fractures. Also, increase of the feeding rate accompanied an amount of WC particles causing crack initiation and decarburizing reaction.

• Journal of Electrical Engineering and Technology
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• v.6 no.1
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• pp.119-122
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• 2011

A new high speed AFM probe has been proposed and fabricated. The probe is integrated with PZT actuated cantilever realized in bulk silicon wafer using heavily boron doped silicon as an etch stop layer. The cantilever thickness can be accurately controlled by the boron diffusion process. Thick SCS cantilever and integrated PZT actuator make it possible to be operated at high speed for fast imaging. The resonant frequency of the fabricated probe is 92.9 kHz and the maximum deflection is 5.3 ${\mu}m$ at 3 V. The fabricated probe successfully measured the surface of standard sample in an AFM system at the scan speed of 600${\mu}m$/sec.

• Proceedings of the Optical Society of Korea Conference
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• 2004.02a
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• pp.30-31
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 2006.02a
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• pp.215-216
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• 2006

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.376-380
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• 2008

This paper presents the Projection Moire method using a line scan camera. The high resolution feature of a line scan camera makes it possible to scan an image quickly, thus enabling a much quicker 3D profile. This method uses a high resolution line scan camera making it possible to scan an image at high speed simultaneously measuring the 3D profile of a large FOV. When using a high resolution scan camera, a full FOV is scanned, thus requiring just one movement of a projection grating. As a result, the number of grating movements is reduced drastically. The end result is a faster and more accurate 3D measurement. Moving the grating too quickly causes vibration in the imaging system, which will normally be required to apply a stitching technique when using an area scan camera. However the technique is not required when using a line scan camera. Compared with the previous techniques, it has the advantages of simple hardware without moving mechanical parts - single exposure for obtaining three-dimensional information. A method using a high resolution line scan camera can be used in mass production to measure the bump height of wafers or the bump height of package substrates.

• Proceedings of the KIPE Conference
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• 2007.11a
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• pp.215-217
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• 2007

Recently, the demand for high definition TV is being increased by beginning of the digital broadcasting. The higher resolution of PDP is, the longer addressing time become, then, the sustain period for display image decreases. Because of the reason, dual-scan method which synchronously write information of an image on top and bottom of the screen is used for the high definition PDP. However, as the price competition of PDP becomes severe, we can`t avoid turning to a single-scan method which uses only a half of an expensive address IC. Accordingly, the sustain period becomes much shorter than prior method. In case of XGA level, it is impossible to display, eventually. In this paper, we are going to prove usefulness by realizing negative reset waveform and the driving circuit for high speed addressing.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.11-16
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• 2008

Confocal scanning microscopy is a widely used technique for three dimensional measurements because it is characterized by high resolution, high SNR and depth discrimination. Generally an image is generated by moving one optical probe that satisfies the confocal condition on the specimen. Measurement speed is limited by movement speed of the optical probe; scanning speed. To improve measurement speed we increase the number of optical probes. Specimen region to scan is divided by optical probes. Multi-point information each optical probe points to can be obtained simultaneously. Therefore image acquisition speed is increased in proportion to the number of optical probes. And multiple optical probes from red, green and blue laser sources can be used for color imaging and image quality, i.e., contrast, is improved by adding color information by this way. To conclude, this technique contributes to the improvement of measurement speed and image quality.

• Laser Solutions
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• v.9 no.2
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• pp.11-15
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• 2006

We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

• Journal of Powder Materials
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• v.29 no.5
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• pp.390-398
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• 2022

Recently, considerable attention has been given to nickel-based superalloys used in additive manufacturing. However, additive manufacturing is limited by a slow build rate in obtaining optimal densities. In this study, optimal volumetric energy density (VED) was calculated using optimal process parameters of IN718 provided by additive manufacturing of laser powder-bed fusion. The laser power and scan speed were controlled using the same ratio to maintain the optimal VED and achieve a fast build rate. Cube samples were manufactured using seven process parameters, including an optimal process parameter. Analysis was conducted based on changes in density and melt-pool morphology. At a low laser power and scan speed, the energy applied to the powder bed was proportional to ${\frac{P}{\sqrt{V}}}$ and not ${\frac{P}{V}}$. At a high laser power and scan speed, a curved track was formed due to Plateau-Rayleigh instability. However, a wide melt-pool shape and continuous track were formed, which did not significantly affect the density. We were able to verify the validity of the VED formula and succeeded in achieving a 75% higher build rate than that of the optimal parameter, with a slight decrease in density and hardness.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.932-934
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• 2006

A relationship between discharge delay time and the aging method were investigated: A-Y (Address electrode - Scan electrode) aging and conventional X-Y(Common electrode - Scan electrode) aging with the variation of sustain voltage beyond self-erasing discharge. Although A-Y aging decreases discharge delay time, it has several drawbacks like non-uniformity of discharge, degradation of luminous efficiency and a color temperature. In a conventional aging condition which is carried out near the mid-margin voltage, discharge delay time is short in low voltage and high frequency condition. As an alternative to conventional voltage aging, high voltage aging is suggested which is carried out at self-erasing sustain voltage region. High voltage aging shows lower discharge delay time and fast aging speed than conventional voltage aging.