• Journal of the Korean Society for Railway
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• v.13 no.4
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• pp.447-454
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• 2010

The defects of rail head induced by fatigue and deterioration are mainly classified by two types ; one occurred on the surface of rail head the another occurred on the inner rail head. This study performed the surface irregularity measurement of rail head according to the passing tonnage in the urban railway. Also, we carried out microscopic structure test, chemical component test and micro-hardness test for the specimen which is the used rail on metro line by accumulated passing tonnage. As a result of this study, for new rail, it should be performed initial grinding in order to remove 0.3mm of de-carbonized layer. The preventive-cyclic grinding for preventing RCF defects is proposed two options : grinding by the whole line and grinding by specified sections.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.61-65
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• 2009

We produced noble surface structure of crystalline Si for solar cells by using preferential aqueous etching on crystallographic defects which were induced by grinding process. We analyzed the reflectance of textured surface according to surface topography resulting from various etchant concentrations and duration of etching process. The crystallographic defects and textured surface topography were investigated by using transmission electron microscopy and secondary electron microscopy, respectively. Also, the measurement of reflectance of textured surface utilizes spectrophotometer. The optimized texture surface exhibits improved result indicating reflectance of below ave. 1%. And it is cost-effective as well as taking short time within a few minutes.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.65-69
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• 2008

This work shows that the grinding-induced scratches formed on the back surface of silicon chips can highly influence the flexural strength of the chips. Meanwhile, in a case that excellent adhesion between the back surface and the plastic package body maintains, the flexural strength of plastic-encapsulated packages is not so sensitive to the geometry of the scratch marks. This article explains why such different flexural fracture behavior between bare chips and plastic-encapsulated chips appears.