• Journal of the Korean Society for Precision Engineering
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• v.14 no.5
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• pp.85-91
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• 1997

Air grinding time in grinding process has a great effect on its efficiency due to low feedrate. This paper presents a reduction methos of air grinding time in cylindrical plunge grinding operation. Tje reduction of air grinding time is accomplished by finding the distance between contact point and rising point of ultra- sonic signal of the grinding wheel to workpiece. It uses a variation of sound signal generated by the flow of coolant when the grinding wheel approaches to workpiece. The ultrasonic sensor with 23 kHz center fre- quency and 8 kHz bandwidth is used to find the nearest approaching point(NAP). Monitoring and control system of the grinding conditions is implemented with CNC controller to control feedrate override and ultrasonic sensor to find NAP. The experimental result shows that the ultrasonic signal is a good measure- ment to find NAP. But it needs the considerations for the effect of the relationship between flowrate of coolant and diameter of workpiece.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.1
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• pp.69-74
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• 2014

An OrthoMTA compacter is made by machining a Ni-Ti alloy wire using tapered helix creep-feed grinding machines. This aim of this study is to find the optimal dressing conditions to sharpen the corner of a cubic boron nitride (CBN) wheel. On the basis of the results of various experiments, it is verified that the most important factors in dressing are the dressing depth and feeding method, whereas the feed rate has less importance for producing a smaller corner R value. The study also finds the optimum dressing depth to reduce the dressing time, a feeding speed and method to stabilize the machining, and the mesh grade for the CBN wheel to make the groove of the compacter deeper.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.42-45
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• 2002

General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.90-94
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• 1996

Thermal problems of creep-feed grinding are more serious than regular grinding. So grinding fluid supply in creep-feed grinding is very important. Grinding fluid supply quantity is not linear with effectiveness because grinding wheel is porosity material and the grinding area is solid contact area. In this paper, by using AE signal, optimal quantity of fluid supply was determined. And surface characteristics of wet creep-feed grinding were analized.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.411-412
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.318-318
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• 2004

원통 연삭기(cylindrical grinding machine)는 원통형 공작물을 센터나 척으로 지지하면서 연삭 공정을 수행하기 때문에 연속적인 작업이 어렵지만, 무심 연삭기(centerless grinding machine)는 원통형 공작물을 받침판으로 지지하면서 연삭 숫돌(grinding wheel)과 조정 숫돌(regulating wheel)로 연삭 공정과 축방향 이송을 동시에 수행하기 때문에 연속적인 작업이 가능하다. 특히 고정밀 부품을 작업자의 숙련도와 무관하게 고능률적으로 가공할 수 있는 무심 연삭기는 구름 베어링, 축, 피스톤 핀 등과 같은 고정밀 기계류 부품들을 대량 연삭하기 위한 용도로 많이 사용되어 왔다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.701-702
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.938-942
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding renditions of ceramic materials in the grinding with diamond wheel by the experimental plan method. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the Si$_3$${N^4} and Zr{O_2}$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the ${Al_2}{O_3}$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using the experimental plan method.