• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1998.03a
• /
• pp.11-18
• /
• 1998

In grinding operations, one of the most important problems is to increase efficiency of process. In order to achive this purpose, it is necessary to administer the tool life of grinding wheel and to optimize grinding conditions. Frequently dressing result in lowering the process efficiency remarkably and makes production cost high. On the other hand, grinding with a worn wheel causes the workpiece surface roughness to increase and often results in the occurrence of such troubles as chatter vibration and burning.

• International Journal of Precision Engineering and Manufacturing
• /
• v.4 no.4
• /
• pp.32-38
• /
• 2003

An analytical model of the interference phenomena in the centerless grinding process is developed to investigate their effects on the roundness profile of a centerless ground workpiece. In this work, the regulating wheel and work-rest blade interferences are modeled as a single point contact. The grinding wheel interference is modeled as multiple points contact because material removal is determined by the duration of contact. The computer simulation results show good agreement with the experimental data. From this work, the existence and effects of the interference phenomena in the centerless grinding process are found.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.167-168
• /
• 2012

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.3
• /
• pp.247-252
• /
• 2012

This study has been focused on application of ELID mirror-surface grinding technology for manufacturing single crystal optic sapphire. Single crystal sapphire is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. Mirror-surface machining technology is necessary to use sapphire as optic parts. The ELID grinding system has been set up for machining of the sapphire material. According to the ELID experimental results, it shows that the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

• Journal of the Korean Society of Safety
• /
• v.17 no.4
• /
• pp.45-51
• /
• 2002

In this study, the fracture characteristics of carbonized silicon grinding wheels were examined with tensile, compression, impact and bending test. The experiment was performed for the various grinding wheels with grain size #46, #80, and grade H, L, P, and one vitrified bond and one structure No.7. Also the centrifugal fracture rpm of carbonized silicon grinding wheels were measured and compared with the calculated values for the various wheel diameters and thicknesses. The results showed that the fracture tensile strength was $1.5~2.0Kg_f/mm^2$, and it was increased by decreasing grain size and increasing grade. The fracture compression loads were $1,600~3,000Kg_f$, and the inner stress was higher than outer's. And the absorption energy of impact test was 3.3~4.7 J, and it was increased by decreasing grain size but it was not effected by grade. The fracture bending stress was $0.1~0.2Kg_f/mm^2$, and it was increased by decreasing grain size and increasing grade. The centrifugal fracture rpm of carbonized silicon grinding wheel was about 8,500~12,000 and agreed well with the calculated value, and it was increased by decreasing diameter. However, it was almost constant for the reduction of wheel thickness.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.13 no.3
• /
• pp.24-29
• /
• 2004

The grinding process plays a key role which decides the quality of a product finally. But the grinding process is very irregular, so it is very difficult to analyse the process accurately. Therefore it is very important in the aspect of precision and automation to reduce the idle time and to decide the proper dressing time by watching. In this study, we choose the method which can be observed directly by using of computer vision and then apply pattern classification technique to the method of measuring the wheel surface. Pattern classification technique is proper to analyse complicated surface image. We observe the change of the wheel surface by using of the gray level run lengths which are representative in this technique.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2000.04a
• /
• pp.447-452
• /
• 2000

The grinding plays a key role which decide the quality of a product finally. But the grinding process is very irregular, so it is very difficult to analyse the process accurately. Therefore it is very important in the aspect of precision and automation to reduce the idle time and to decide the proper dressing time by visualizing. In this study, we choose the direct method of observation by making use of computer vision, and apply pattern classification technique to the method of measuring the wheel surface. Pattern classification technique is proper to analyse complex surface image. We observe the change of the wheel surface by making use of the gray level run lengths which are representative prince in this technique.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.946-949
• /
• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• Proceedings of the KSME Conference
• /
• 2003.04a
• /
• pp.974-979
• /
• 2003

As recently optical communication industry is developed, request of optical communication part is increased. Ferrule is very important part which determines transmission efficiency and quality of information in the optical communication part. Most of ferrule processes are grinding which request high processing precision. Particularly, concentricity and cylindricity of inner and outer diameter is very important. The co-axle grinding process of ferrule is to make its concentricity all of uniform before centerless grinding. Surface integrity of ferrule is affected by kind of grinding wheels, grinding conditions, and characteristic of workpiece and equipment. In this study, surface integrity of workpiece according to change of grinding wheel speed, feed rate, regulating wheel speed and grinding force is investigate to improve the concentricity and roundness of ferrule from many experiments.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.2
• /
• pp.63-69
• /
• 2007

The surface roughness in centerless grinding is mainly affected by the many process parameters. For improving the surface roughness, the control of grinding parameters is very important. This paper deals with the analysis of the process parameters such as height of renters, tilting angle of the regulating wheel with respect to grinding wheel, rotation speed of regulating wheel, which are developed based on design of experiments such as factorial design. The investigation can enhance the surface roughness of ferrule. Finally, we have verified improved results of the optimized conditions.