• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.121-125
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• 1992

Grinding is considered as a very effective machining technology to attain the good surface quality of a components. However, the grinding operation still needs the skill and experience of an operator because of a lack of scientific and engineering principles. Therefore, recent development focus on expert systems which deal with domain specific knowledge in order to solve this problem. This paper describes an expert system for selecting the optimism grinding wheel by using the fuzzy reasoning and operation conditions in grinding. By the system unskilled workers will be able to make use of the knowledge and experience of skilled workers. The system is consist of programs that, (1) selection of the best wheel form among avairable wheel by using fuzzy reasoning, (2) determine wheel depth of cut, feed and wheel speed for grinding, work speed, and dressing condition. The developed system perform in using the CLIPS as a software tool and run under the IBM PC/AT as a hardware tool.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.785-792
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• 1994

Ferrite is widely used in the material of magnetic head, but is difficult of grinding because of their brittleness and hardness. Therefore, diamond wheel with superabrasive is required for surface grinding of this brittle material. But the conventional dressing method can not apply to the diamond wheel with superabrasive. In this study describes a newly proposed method for carrying out effective inprocess dressing of diamond wheel with superabrasive. Using the IEDD the surface roughness of workpiece was improved and grinding force was very low. Resently IEDD is good method to obtain the efficiency grinding and surface grinding of brittle materials.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.1
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• pp.52-59
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• 1999

An experimental study on the grinding temperature, surface roughness and Acoustic Emission(AE) signals was conducted with different shapes of wheel. The grinding characteristics for slotted shapes of wheel changed by width and helical angle, were compared with those by general one. Lower grinding temperature was obtained for 30$^{\circ}$helical angle with 10mm width and Root Mean square(RMS) values of AE signals were lower for slotted shapes rather than general one. Surface roughness characteristics of slotted shapes found to be rough but the value of roughness for 45$^{\circ}$helical angel with 6mm width, represented to similar tendency general one.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.1
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• pp.16-21
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• 2004

In order to investigate the characteristics of diamond wheel grinding of ceramic materials, grinding resistance, surface roughness of ground surface and image of grinding wheel were acquired using experimental method. Through the experiments, this makes it possible to observe grinding wheel behavior by grinding resistance, surface roughness and cutting edge ratio. In case of $Al_2O_3$, cutting edge ratio is bigger than that of $ZrO_2$ and $Si_3N_4$. That's because $Al_2O_3$ has a characteristic of low fracture toughness and bending stress.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.6
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• pp.45-51
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• 1996

Silicon wafers are required to be finished under the roughness of nanometer order for the subsequent chip fabrication processes. Recently, the finish grinding techniques have been researched for the improvement of accuracy and surface roughness simultaneously. Among them, the grinding technique using fine abrasive has been known as an easily accessible method. However, the manufacture of the fine grit grinding wheel has been very difficult because of the coherence of the grits. In this paper, the development of the ultrafine grit silica($SiO_2$) grinding wheel by the combination of the binder coating and the vacuum forming techniques is reported. And, the mechanochemical removal effects of the grinding conditions are discussed. Finally, a successful result of Ra O.4nm. Rmax 4nm in the ground surface roughness of a 6 inch silicon wafer was achieved.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.4 no.3
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• pp.12-24
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• 1995

Various surface grinding experiments using resin bonded diamond abrasive wheels are carried out for tungsten carbide materials in order to minimize the damage on the ground surface and to purse the precise dimension compared to conventional grinding machine. When grinding quality is constant, theoretical grinding effect is changed according to the speed of workpiece. Accordingly, grinding forces, which are Fn, Ft, were analyzed for the machining processes of tungsten-carbide material to obtain optimum grinding conditions. Brief investigation is carried out to decrease the dressing efficiency of resinoid bonded diamond grinding wheel to grind tungsten-carbide. Truing is also carried out to provide a desired shape on a wheel or to correct a dulled profile. High quality in dimensional accuracy and surface are often required as a structural components, therefore 3-points bending test is carried out to check machining damage on the ground surface layer, which in one of sintered brittle material. From this experimental study, some useful machining data and information to determine proper machining condition for grinding of tungsten-carbide materials are obtained.

• Journal of the Korean Society for Precision Engineering
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• v.2 no.2
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• pp.60-68
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• 1985

The Surface roughness is affected by the factors such as elements of grinding wheel, grinding conditions, and so on. Of all these factors, we studied surface roughness variation in accordance with grain size of grinding wheel and grinding depth of cut on the surface grinding. Tempered, annealed, quenched, and non-heat treated materials were used as specimen. The results obrained in these experiments are as follows: 1) The smaller the hardness is, the better the grinding surface roughness becomes. 2) Tempered materials after quenching shows the finest finished surface on grinding.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.1 s.94
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• pp.18-25
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• 1999

Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.48-52
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• 1995

Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.1018-1021
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• 1997

This paper presents a result of simulation and improvement of grinding process for linear motion guide blocks. A simulation software, which is based on cylindrical grinding process. is used to predict the grinding wheel wear during the grinding process. To validate the simulation, the simulation result is compared with the experimental one. Simulation study is extended to obtain an optimal grinding condition for minimizing the grinding wheel wear. The optimal condition is validated through an experiment.