• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.61-65
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• 1996

This paper experimentally describes the grinding characteristic of discontinuous grinding wheels in creep-feed grinding. In creep-feed grinding, grinding temperature increases rapidly and thermal damage such as a burn occurs on a workpiece. Discontinus grinding wheel with Conventional grinding wheel shows an exellent cooling effect has been developed. The wheels have 6, 12, 24 pieces of slotted which compare with characteristics of each wheels

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.42-48
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• 1998

This paper is concerned with the heat flux distribution and energy partition for creep-feed grinding. From measurements of transient grinding temperatures in the workpiece sub-surface using an embedded thermocouple, the overall energy partition to the workpiece was estimated from moving heat source theory for a triangular heat flux distribution as 3.0% for down grinding and 4.5% for up grinding. The higher energy partition for up grinding can be attribute to the need to satisfy thermal compatibility at the grinding zone. The influence of cooling outside the grinding zone can be analytically taken into account by specifying convective heat transfer coefficients on the workpiece surface ha ahead of the heat source (grinding zone) and hb behind the heat source. The smaller energy partition together with slightly lower grinding power favors down grinding over up grinding.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.6
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• pp.44-51
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• 1997

Crinding of stainless steel, aluminium alloy, copper alloy, and titanium alloy are difficult to obtain high quality finish, because they have the mechanical properties such as low hardness, high toughness. The low hardness and the high toughness result in the loading of wheel and the poor surface finish. In order to perform the grinding operations for these sorts of materials easily, the discontinuous grinding wheel wiht multi-porous grooves has been newly developed. The multi-porous grooves inthe discontinuous grinding wheel were formed during grinding wheel manufacturing process. In this paper, discontinuous grinding wheels having intermittent ratio 0.66, 0.81 and number of grooves 18,32 have been manufactured and grinding surface characteristics of these grinding wheels for SUS304 have been analyzed. Discontinuous grinding temperature according to intermittent ratiohas been also estimated by simulation. The discontinuous grinding wheels increase the grinding performance considerably. It is desirable to use the discontinuous grinding wheel in grinding the materials with high efficiency and accuracy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.86-89
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• 2005

Design and estimation of a spindle system which was composed of grinding spindle and regulating spindle for the centerless grinding of ferrule was performed and prototypes of each spindle were manufactured. Loop stiffness of the spindle system was 130 N/${\mu}m$. Although the value was lower than the target value of 150 N/${\mu}m$, as there included 20% of the safety factor, it was enough to machine the ferrule. Rotational accuracies of each spindle were about 0.2${\mu}m$ at the primary speed of 2,300 rpm(grinding spindle) and 300 rpm(regulating spindle). Temperature rises at the same speed were about $4.4\;\~\;4.7^{\circ}C$ in the case of grinding spindle and $1.8^{\circ}C$in the case of regulating spindle, which were well agreed with the designed value. From these results, it was estimated that the prototype of spindle system had a enough performances for the centerless grinding machine to machine the ferrule.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.142-150
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• 2005

Design and performance evaluation of a spindle system which was composed of a grinding spindle and a regulating spindle for the centerless grinding of ferrule were performed in this paper. Layout and details of spindle system were designed and hydrostatic bearings for spindles were also designed. Prototype of spindle system was developed and its availabilities to machine the ferrule were discussed using the experimental results on the spindle stiffness of each spindle, loop stiffness, rotational accuracy and thermal characteristics. Loop stiffness of the spindle system was $130\;N/{\mu}m$, which was enough to machine the ferrule. Rotational accuracies of each spindle were about $0.2{\mu}m$ at the primary speed of 2,300 rpm(grinding spindle) and 300 rpm(regulating spindle). Temperature rises at the same speed were about $4.4\~4.7^{\circ}C$ in the case of grinding spindle and $1.8^{\circ}C$ in the case of regulating spindle, which agreed well with the designed value. From these results, it was estimated that the prototype of spindle system had enough performances for the centerless grinding machine to machine the ferrule.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.19-24
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• 1998

This paper aims to clarify the effects of grinding conditions on the ground surface and bending strength in surface grinding of various ferrites with diamond wheel. The main conclusions obtained were as follows. The surface roughness becomes better at lower wheel speed in the case of v/V=1$\times$10-3, and the condition of v/V=1$\times$10-4shows the best performance for the finish grinding. When the relative contact temperature becomes lower at a constant value of v/V, the ground surface exhibits lower roughness. The ground surface shows that the fracture process during grinding becomes more brittle at the higher value of v/V. The damage depth which affect the bending strength is below 10$\mu$m in the grinding condition of S=10㎣/mm.s with the diamond tool after dressing & truing, however, the depth increases with increasing removal rate(S). When the strength degradation due to grinding is larger, the removal depth for the recovery of strength requires a larger size.

• The Journal of Advanced Prosthodontics
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• v.6 no.4
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• pp.317-324
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• 2014

PURPOSE. This study was to evaluate the effect of grinding of the inner metal surface during the porcelain try-in stage on metal-porcelain bonding considering the maximum temperature and the vibration of samples. MATERIALS AND METHODS. Ninety-one square prism-shaped ($1{\times}1{\times}1.5mm$) nickel-chrome cast frameworks 0.3 mm thick were prepared. Porcelain was applied on two opposite outer axial surfaces of the frameworks. The grinding was performed from the opposite axial sides of the inner metal surfaces with a low-speed handpiece with two types of burs (diamond, tungsten-carbide) under three grinding forces (3.5 N, 7 N, 14 N) and at two durations (5 seconds, 10 seconds). The shear bond strength (SBS) test was performed with universal testing machine. Statistical analyzes were performed at 5% significance level. RESULTS. The samples subjected to grinding under 3.5 N showed higher SBS values than those exposed to grinding under 7 N and 14 N (P<.05). SBS values of none of the groups differed from those of the control group (P>.05). The types of bur (P=.965) and the duration (P=.679) did not affect the SBS values. On the other hand, type of bur, force applied, and duration of the grinding affected the maximum temperatures of the samples, whereas the maximum vibration was affected only by the type of bur (P<.05). CONCLUSION. Grinding the inner metal surface did not affect the metal-porcelain bond strength. Although the grinding affected the maximum temperature and the vibration values of the samples, these did not influence the bonding strength.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Ceramic Society
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• v.34 no.2
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• pp.195-201
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• 1997

The present paper describes the effect of dry mixed grinding on kaolinite-aluminum trihydroxide mixture with a planetary ball mill before sintering and its influence on mullite formation during sintering. The size reduction of the mixture is market in the early stage of grinding and the obtained fine particles agglomerate subsequently with an increase of grinding time. The crystal structure of the mixture is collapsed easily into an amorphous one by planetary ball milling, of which amount increases with an increase of grinding time. Only mullite phase except for anatase as an inherent impurity in kaolinite appeared in the sintered body of the mixtures with mixed grinding as relatively lower temperature 1523K, while corundum, cristobalite, and Al-Si spinel phases, besides mullite were formed in the sintered body of the mixture without mixed grinding. Therefore, the mixed grinding treatment is very effective to improve the homogeneous mixing and disp-ersion of the mixture of raw materials on a micro scale and to decrease the thermal decomposition tem-perature by crystal structure change of them so as to obatin direct preparation of mullite with high purity at relatively low temperature.