• Journal of the Korean Society for Precision Engineering
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• 제10권2호
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• pp.190-196
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• 1993

Internal high speed grinding under several high grinding wheel speed condition has been performed in this study for the effects have analyzed and compared with the grinding power, grinding tangential force and accuracy of surface with the carbon tool steel(SK3). The following results have been obtained: (1) Under the workpiece speed constant condition, increasing the grinding speed, the tangential force is decreased, and on the contrary, accuracy of surface is improved. (2) Under the speed ratio (V$_{w}$/V$_{s}$) contant condition it is possible to increase the high machining efficiency constraint to tangential grinding force constant.ant.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.961-964
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• 1997

In this paper, grinding characteristics of ultra high speed cylindrical plunge grinding was investigated by use of vitrified CBN wheel. From the experimental result, it was convinced that grinding power is decreased according to the increase of wheel and workpiece speed due to changing of grinding mechanism which decreases depth of cut and length of contact curve according to increment of wheel speed. And also, stock removal reduction of each gram lead to improvement of surface roughness by increasing the wheel speed.

• Transactions of the Korean Society of Automotive Engineers
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• 제2권6호
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• pp.87-93
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• 1994

This paper describes on the establishment of an optimal internal grinding conditions for the purpose of improving the grinding efficiency against to the high-speed grinding. Through the fundamental grinding tests for the brittle and hardened material, we are concluded that high-speed internal grinding is effective to improve the grinding accuracy as well as the grinding efficiency. The obtained results are as follows: (1) Under the speed ratio $(V_w/V_g)$ is constant, it is possible to increase the grinding efficiency with satifying the constraint conditions. (2) Increasing the wheel velocity, surface roughness and out-roundness are improved. (3) Under the wheel depth of cut is constant and increasing the speed ratio, workpiece residual stress is decreased. The described method, in this paper, is capable of determining the optimum internal grinding conditions taking into account some constraint conditions, and practical algorithm for optimum internal grinding conditions are presented.

• Journal of the Korean Society for Precision Engineering
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• 제7권4호
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• pp.65-72
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• 1990

After observing grinding characteristics according to variable grinding condition in order to raise the grinding effect without making worse the grinding quality by using general grinding machine, main conclusions of this study are as follows; 1) When grinding quality is constant, grinding effect is changed according to the speed of the workpiece. But the rapidly increasing critical speed of table is($V_w{\leq}4m/min$). 2) As grinding effect is equal, the lower the speed of the workpiece becomes, the lower the grinding force and surface roughness obtains good results. 3) In terms of grinding method, the down cut grinding method produces good grinding surface royghness in case of little grinding depth;otherwise, the up cut method in case of more grinding depth.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.925-929
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• 2001

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel and Resinoid-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and the material removal are measured and discussed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.315-320
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• 2001

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel and Resinoid-bond CBN wheel. For various condition of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and material removal are measured and discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.787-792
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• 2000

Ultra-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with Vitrified-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance, the surface roughness, and the material removal are measured and discussed. The results are as follows.

• Transactions of the Korean Society of Machine Tool Engineers
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• 제10권3호
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• pp.1-6
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• 2001

An analytical thermal model of HESG(higt efficiency speed grinding) is presented, in which the heat flux to workpiece in grinding zone is modeled as time dependent and moves along a slope decided by contact chord(approximation of con-tact arc). By matching the maximum surface temperature of workpiece derived from this model to the maximum surface temperature of grinding wheel composite as done in Lavins simple thermal model, the relation of maximum surface tem-perature and energy partition of workpiece to grinding speed is obtained. In high speed grinding, as wheel speed increases, energy partition decreases with no regard to table speed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• 제6권3호
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• pp.17-25
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• 1997

This paper aims to clarify the effects of grinding conditions on the grinding force, ground surface and chipping size of workpiece in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows: In a constant peripheral wheel speed, the specific grinding energy is fitted by straight lines with grinding depth coefficient($\delta$) in a logarithmic graph. The effect of both depth of cut and workpiece speed on grinding energy becomes larger in the order of Mn-Zn, Cu-Ni-Zn and Sr. When using the diamond grain of the lower toughness, the roughness of the ground surface becomes lower. The ground surfaces show that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn. The chipping size at the corner of workpiece in grinding increases with the the increases of the depth of cut and workpiece speed, and the decrease of peripheral wheel speed. The effect of both depth of cut and workpiece speed on chipping size becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn.