• Title/Summary/Keyword: grinder

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Force-Reflecting Teleoperation for Grinding Work

  • Choo, Jung-Hoon;Lee, Jae-Yong;Lee, Jae-Won
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.824-828
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    • 2003
  • This paper explains problems of force-reflecting teleoperation grinding work and proposes some methods to solve those. For stable contact between robot tool(grindstone) and contact surface the mechanical impedance force control is used. The sliding phenomenon of grindstone has been appeared at the contact surface during the grinding work. The sliding problems caused by friction and rotation of grindstone are eliminated by using tangential direction sliding compensation control. The rotation force of grindstone makes the tool move to tangential direction along the surface suddenly even though an operator pushes the tool only in normal direction to the surface. Normal direction force control is applied for grinder not to roll and fracture on the grinding surface. Vibration problem of grindstone is decreased by second order low-pass filter. Therefore we can precise grinding work at the grinding surface and feel the reality

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The Design and Dynamic Characteristics Analysis of the Grinder Bed using Epoxy-Granite (에폭시-그래나이트재를 이용한 연삭기 베드의 설계 및 동특성 해석)

  • 박영일
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.2
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    • pp.62-72
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    • 1999
  • In this study, the griding machine bed was designed and analyzed by using epoxy-granite. Finite element technique was employed to design and analyze the composite bed structure. Von Mises stress and relative displacements between a tool and a workpiece were checked to compare a cast iron bed structure with a composite bed structure. Dynamic features of structures were also studied according to the process of modal analysis through natural frequency and mode shape measurement. Another improved model was also designed using the accumulation of knowledge based on the use of the structural analysis and experiments. Comparing with the cast iron bed structure, the composite bed structure maintains better functions.

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Experimental Analysis about Hand-transmitted Vibration Characteristics of Human Body (인체의 팔굽진동 특성에 관한 실험적 해석)

  • 김대원
    • Journal of KSNVE
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    • v.10 no.2
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    • pp.299-305
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    • 2000
  • In this study, the characteristics of transmitted vibration on hand-arm system are examined when operating electric hand tools. Also through the correlation analysis between anthroponetric data and transmitted vibration, and comparison study with appropriate amount of work done based on the ISO criteriaa, the basic data for the ergonomic work design can be presented. The types of electric tools and works for the experiment are drill (general type and impact type), grinder, wire brush and steel to analyze the characteristics of transmitted vibrations, the amount of transmitted vibrations in X, Y and Z direction at tool(T), hand(H), wrist(W), and the joint between foream and upper arm(A) were measured at the frequency range of 6.3∼1000[HZ]. Also, the limit of human exposure to vibration, and the response of frequency were conducted.

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A Quick and Safe Method for Fungal DNA Extraction

  • Chi, Myoung-Hwan;Park, Sook-Young;Lee, Yong-Hwan
    • The Plant Pathology Journal
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    • v.25 no.1
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    • pp.108-111
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    • 2009
  • DNA-based studies, including cloning and genotyping, have become routine in fungal research laboratories. However, preparation of high-quality DNA from fungal tissue requires much time and labor and is often a limiting step for high-throughput experiments. We have developed a quick and safe (QS) DNA extraction method for fungi. Time efficiency and safety in the QS method were achieved by using plate-grown mycelia as the starting material, by eliminating phenol-chloroform extraction procedures, and by deploying a simple electric grinder. This QS method is applicable not only to a broad range of microbial eukaryotes, including true fungi and oomycetes, but also to lichens and plants.

The Trend of wafer Grinding Technology and Improvement of Machining Accuracy (웨이퍼 연삭 가공 기술의 동향 및 가공 정밀도 향상에 관한 연구)

  • 안대균;황징연;이재석;이용한;하상백;이상직
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.20-23
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    • 2002
  • In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

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A Study on Precision Infeed Grinding for the Silicon Wafer (실리콘 웨이퍼의 고정밀 단면 연삭에 관한 연구)

  • Ahn D.K.;Hwang J.Y.;Choi S.J.;Kwak C.Y.;Ha S.B.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1-5
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    • 2005
  • The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

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Urgent Intracranial Carotid Artery Decompression after Penetrating Head Injury

  • Kim, Seong Joon;Park, Ik Seong
    • Journal of Korean Neurosurgical Society
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    • v.53 no.3
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    • pp.180-182
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    • 2013
  • We describe a case of intracranial carotid artery occlusion due to penetrating craniofacial injury by high velocity foreign body that was relieved by decompressive surgery. A 46-year-old man presented with a penetrating wound to his face. A piece of an electric angular grinder disc became lodged in the anterior skull base. Computed tomography revealed that the disc had penetrated the unilateral paraclinoid and suprasellar areas without flow of the intracranial carotid artery on the lesion side. The cavernous sinus was also compromised. Removal of the anterior clinoid process reopened the carotid blood flow, and the injection of glue into the cavernous sinus restored complete hemostasis during extraction of the fragment from the face. Digital subtraction angiography revealed complete recanalization of the carotid artery without any evidence of dissection. Accurate diagnosis regarding the extent of the compromised structures and urgent decompressive surgery with adequate hemostasis minimized the severity of penetrating damage in our patient.

Study on Design of Cone-Shaped Magnetic Bearing Spindle System for High Speed Internal Grinding (고속 내면 연삭기 주축용 원추형 자기베어링 설계 연구)

  • 노승국;경진호;박종권;최언돈;양승준;이재응;김남용;이동주
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.79-83
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    • 2001
  • A cone-shaped active magnetic bearing spindle system for high speed internal grinding is designed and tested. The cone-shaped AMB system consists of only 4 couples of magnet, it can be smaller and lighter than conventional radial-axial-type AMB system. In this paper, the cone-shaped electromagnets are designed by magnetic circuit theory, and de-coupled direct feedback PID controller is applied to control the coupled magnetic bearings. The designed cone-shaped AMB spindle system is built and constructed with a digital control system, and tested its stbility and dynamic performances. As the results of the tests, this spindle runs up to 40,000 rpm with about 5 ${\mu}{\textrm}{m}$ of runout, and the AMB system provides high damping ratio eliminating overshoot and resonance speed.

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Adaptive Runout Control of Magnetically Suspended High Speed Grinder Spindle (자기베어링지지 연삭기 추축계의 고속 회전시 런아웃 적응제어)

  • 노승국;경진호;박종권;최언돈
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.52-55
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    • 1997
  • In this paper, the case study of reducing rotational errors is done for a grinding spindle with an active magnetic bearing system. The rotational errors acting on the magnetic bearing spindle are due to mass unbalance of rotor, runout, grinding excitation and unmodeled nonlinear dynamics of electromagnets. For the most case, the electrical runout of sensor target is big even in well-finished surface; this runout can cause a rotation error amplified by feedback control system. The adaptive feedforward method based on LMS algorithm is discussed to compensate this kind of runout effects, and investigated its effectiveness by numerical simulation and experimental analysis. The rotor orbit size in both bearings is reduced about to 5 pin due to lX rejection by feedforward control up to 50, 000 rpm.

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Development of Magneto-Electrolytic-Abrasive Polishing System for Piston Pin (피스톤 핀의 자기전해 경면연마 시스템 개발)

  • 김정두
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.03a
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    • pp.59-64
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    • 1998
  • We need to achieve th mass product through methods of higher efficient, higher precise manufacturing process than those of existing precision abrasive machining. Thus, this study is to develop mirror-like surface machining technique of outer diameter of the piston pin by the compound magneto-electrolytic abrasive polishing system. The procedure of machining is followed as first, fulfill the pre-processing by cylindrical grinder, second, complete mirror-like surface by the method of magneto-electrolytic abrasive polishing used CBN non-woven abrasive pads. In this study, it was found that the best suitable conditions of mirror-like surface polishing were that the electrode density was 0.1A/$\textrm{cm}^2$, the applied pressure 1.5kgf/$\textrm{cm}^2$, the feed rate 0.5mm/rev, and the rotoation velocity of workpiece 80rpm, and that the surface roughness was reduced in this conditions.

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