• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.3 s.36
• /
• pp.253-258
• /
• 2005

Characteristics of electroplated Ni films such as grain size, resistivity, solder wetting angle, and growth rate of intermetallic compound were evaluated as a function of electroplating current density. With increasing the electroplating current density from $5\;mA/cm^2 $ to $40\;mA/cm^2 $, the nodule size on the Ni film surface decreased, grain refinement occurred, and resistivity increased from $7.37\mu\Omega-cm$ to $9.13\mu\Omega-cm$. Compared with Ni film processed at $40\;mA/cm^2 $, Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ exhibited low resistivity, dense microstructure, and slow growth rate of intermetallic compound. Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ are more suitable for Ni UBM application than that fabricated at $40\;mA/cm^2 $.

• Korean Journal of Materials Research
• /
• v.9 no.2
• /
• pp.188-194
• /
• 1999

To investigate the effect of niobium and tin on the mechanical properties of zirconium alloys, the tensile test and the microstructural analysis were performed on the Zr-based binary(Zr-xNb, Zr-xSn) and ternary(Zr-0.8Sn-xNb, Zr-0.4Nb-xSn) alloys. As the content of Nb or Sn element increased, the strengths of the Zr-based alloys tended to gradually increase. The increase of mechanical strength was remarkable strength was remarkable in the range more than the solubility of Nb and Sn. The strengthening effects were discussed on the basis of the solid solution hardening, the precipitate hardening, the grain size effect, and the texture effect. The mechanical strength is mainly controlled by the solid solution hardening and additionally by the precipitate hardening in the content more than solubility limit of Nb and Sn. The grain refinement also has a slight effect on the strength of the zirconium alloys with the addition of Nb and Sn. However, the texture effect can be excluded due to the same Kearns number regardless of the content of alloying elements.

• Journal of Biomedical Engineering Research
• /
• v.24 no.3
• /
• pp.203-208
• /
• 2003

The effect of indium on the microstructure and hardness of a Au-Pt-Cu ternary alloy was investigated using optical microscopy, differential scanning calorimeter, scanning electron microscopy x-ray diffractometry, electron probe microanalizer and vickers hardness tester. A hardness of the solution floated Au-Pt-Cu-0.5In quarternary alloy with 0.5 wt.% was reached a maximum value (162 Hv) in 30 min at 550$^{\circ}C$ in the range of 150 to 950$^{\circ}C$ but that of the alloy was rapidly increased until 30 min with increasing aging time at 550$^{\circ}C$ and after that was remained almost constant value. Also, the microhardness of the matrix Au-Pt-Cu ternary alloy aged at 550$^{\circ}C$ for 30 min was continuously increased with indium contents and the grain size of Au-Pt-Cu ternary alloy decreased as increased indium contents. Analyses of EPMA and XRD revealed that the matrix Au-Pt-Cu-In quarternary alloy is composed of fcc structure and intermetallic InPt$_3$ precipitate with Ll$_2$ structure. Based on this investigation, it can be concluded that an increase in microhardness of Au-Pt-Cu-In quarternary alloy is due to precipitation hardening InPt$_3$ and grain size refinement.

• Journal of the Korean Magnetics Society
• /
• v.7 no.5
• /
• pp.243-248
• /
• 1997

The effect of $O_2$ partial pressure on microstructure and soft magnetic properties of as-deposited Fe-Hf-O thin film alloys, which are produced by rf magnetron sputtering method in $Ar+O_2$ mixed gas atmosphere, are investigated. Saturation magnetization ($4{\pi}M_s$) of Fe-Hf-O film were decreased with increasing $O_2$ partial pressure, the best soft magnetic properties exhibit at $O_2$ partial pressure of 10%. With further increase of $O_2$ partial pressure, soft magnetic properties decreased continuously. The $Fe_{82}Hf_{3.4}O_{14.6}$ film with $P_{O2}=10%$ exhibits good soft magnetic properties with $4{\pi}M_s=17.7kG$, $H_c=0.7Oe$ and ${\mu}_ {eff}$ (1~100 MHz)=2,500, respectively. The addition of O is effective in grain refinement. In case of $P_{O2}=15%$, it is observed that $Fe_3O_4$ compound is formed and high frequency soft magnetic properties are decrease. The electrical resistvity($\rho$) of Fe-Hf-O film is increased with increasing $O_2$ partial pressure. Electrical resistivity of $Fe_{82}Hf_{3.4}O_{14.6}$ film was 5 times higher than that of the film without oxygen. Thus, it is considered that the good magnetic properties of $Fe_{82}Hf_{3.4}O_{14.6}$ film results from decreasing the $\alpha$-Fe grain size by precipitates (Hf and O), high electrical resistivity.

• Korean Journal of Materials Research
• /
• v.4 no.6
• /
• pp.651-661
• /
• 1994

Utilizing Mechanical Alloy Process, that were obt,ained the results from investigated formation process of AC4A/$SiC_p$. composite material powders and mechanical properties of their extrusion materials. The obtained results are as follow conclusions. AC4A-lOwt.% $SiC_p$ powders which were mechanically alloyed at 150rpm for 420min have been obtained finely and uniformly rounded powder particals that were reached the steady state which was saturated micro hardness about tlv 230 in the range size of 1 0 ~ 2 0$\mu \textrm{m}$. EDAX analysis tests have been resulted in a little amount of I'e conrents increasing with MA times, the artifical aging of AC4A/S$SiC_p$ composite materials was obtained the hardness with solution treated at $525^{\circ}C$ for lOhrs the maximum value of Hv 230 with aging at. $170^{\circ}C$ for 1000min. The Intensity and width of X-ray diffraction pattern were decreasing and widening because of grain boundary refinement and heterogeneous strain during mechanical alloying. Tensile tests at room temperature were carried out the maximum value of 37 Kgf/$\mu \textrm{mm}^2$ with ext,rused materials, 27 Kgf/$\mu \textrm{mm}^2$ with heat treated them at $500^{\circ}C$.