• Journal of the korean academy of Pediatric Dentistry
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• v.23 no.2
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• pp.357-364
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• 1996

The purpose of this study was to asses the shear bond strengths of 3 types of light-curing Glass Ionomer cement to dental amalgam with or without an intermediary agent. 60 amalgam adherent specimens were prepared and aged in water at $37^{\circ}C$ for 3 days. Before bonding, the amalgam surfaces were finished flat on 600-grit silicon carbide paper. 30 specimens among 60 were used for bonding in this condition, and the other 30 were covered with a thin layer of light-curing intermediary agent. Shear bond strengths were measured with universal testing machine (Instron, Model 4301) and statistically processed by ANOVA and t-test. On completion of bond test, the fracture surfaces were examined under light microscope so that the mode of bond failure could be assessed The results were as follows : 1. Bond strength of Fuji II LC group showed the hightest value and was followed by Vitremer, Vitrebond groups (p<0.05). 2. The bond strengths achieved without an intermediary agent were higher than those obtained with intermediary agent (p<0.05). 3. For the specimens bonded with intermediary agent, bond failures occured mostly at the agent-amalgam interface. So, the use of intermediary bonding agent was thought not recommendable at glass ionomer-amalgam interface.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.57-64
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• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.13-20
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• 2008

This paper describes the methods of spacer-fabrication for wafer-level CIS(CMOS Image Sensor) assembly. We propose three methods using SU-8, PDMS and Si-interposer for the spacer-fabrication. For SU-8 spacer, novel wafer rotating system is developed and for PDMS(poly-dimethyl siloxane) spacer, new fabrication-method is used to bond with alignment of glass/PDMS/glass structure. And for Si-interposer, DFR(Dry Film Resist) is used as adhesive layer. The spacer using Si-interposer has the strongest bonding strength and the strength is 32.3MPa with shear.

• Structural Engineering and Mechanics
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• v.6 no.5
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• pp.485-496
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• 1998

Standard finite element wave propagation codes are useful for determining stresses caused by the impact of one body with another; however, their applicability to a laminated system such as architectural laminated glass is limited because the important interlayer delamination process caused by impact loading is difficult to model. This paper presents a method that allows traditional wave propagation codes to model the interlayer debonding of laminated architectural glass subject to low velocity, small missile impact such as that which occurs in severe windstorms. The method can be extended to any multilayered medium with adhesive bonding between the layers. Computational results of concern to architectural glazing designers are presented.

• Journal of the Korean Ceramic Society
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• v.30 no.6
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• pp.469-477
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• 1993

Residual stresses is one of the major factors to degrade the magnetic properties of VCR magnetic heads. Vicker's indentation technique was adapted to estimate the residual stresses Residual stresses and distribution in the glass and ferrite were obtained after bonding ferrite with glass, varing the cooling rate. The compressive and tensile stresses were developed in the interface and gradually decreased with increasing distance from the interface. The stresses were decreased with a cooling rate. The mean values of residual stress in ferrite were 10MN/㎡, 8MN/㎡, 5MN/㎡ with cooling rate 10℃/min, 5℃/min, 1℃/min respectively. When the bonded sample was annealed above the glass transition temperature followed by cooling at 5℃/min cooling rate, the residual stress was reduced to 6MN/㎡.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1097-1102
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• 2003

In this paper, we used only PR as etching mask, while it used usually Cr/AU as etching mask, and in order to fabricate a photosensor has the increased sensitivity, we investigated on the sensitivity of general type and p-i-n type diode. we designed microchannel size width max 10um, min 5um depth max 10um, reservoir size max 100um, min 2mm. Fabrication of microfluidic devices in glass substrate by glass wet etching methods and glass to glass fusion bonding. The p-i-n diode has higher sensitivity than photodiode, Considering these results, we fabricated p-i-n diodes on the high resistive(4㏀$.$cm) wafer into rectangle and finger pattern and compared internal resistance of each pattern. The internal resistance of pin diode can be decreased by the application of finger pattern has parallel resistance structure from 571Ω to 393Ω.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.111-111
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• 2000

In order to form a uniform oxidation layer and spinel crystalline phase that has been help strong bonding in Kovar(Fe-29Ni-17Co)-to-glass sealing, the humidified nitrogen and nirtogen/hydrogen mixture was used as an oxidation atmosphere. Kovar oxidation was diffusion-controlled reaction and the activation energy was 25~32 kcal/mol at $600~900^{\circ}C.$ After oxidation at $600^{\circ}C, $ the oxidation layer was under 1 $\mu\textrm{m}$ thickness and crystalline phase was spinel which was found to be suitable for the Kovar-to-glass sealing. The Kovar-to-glass seal was carried out at $1010^{\circ}C$ and humidified nitrogen/hydrogen mixture atmosphere. Sealing properties were tested by Leak tester and SEM.

• Proceedings of the KSR Conference
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• 2008.06a
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• pp.274-280
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• 2008

To investigate the flexural behavior of real size RC beams strengthened with glass fiber sheets, 9 strengthened beams of real size are experimented and the results are compared with those of existing experimental studies. Experiments are considered glass fiber sheets, the number of fiber sheets, and the existence of U-wrap. By the results of experiments, the failure behavior and crack types of real size RC beams are almost equal to those of the small size RC beams, and the debonding and not the concrete cover delamination are occurred. It can be found from the load-deflection curves that as the number of fiber sheets is increased, the ductility of real size RC beam is more decreased than that of the small size RC beam. For the strengthening method with glass fiber sheets of the real size RC beams, it can be confirmed that the finding a solution to the bonding problem is required

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.9-12
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• 2004

Presented is a preliminary design concept of the carbon-glass hybrid composite rebars for the application in the construction field. A glass fiber rod with indentation is used for the core of the rebar. Carbon fibers are placed over the glass core by pultrusion. To increase the mechanical locking force and bonding surface, carbon filament windings are added in the hoop direction over the carbon face. Finite element analysis and test were conducted to evaluate the effective stiffness and strength of the rods. The results show that the effective axial stiffness of the rebar with indentation are about $50\%$ of the straight rebar.

• Journal of the Korean Ceramic Society
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• v.20 no.1
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• pp.3-12
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• 1983

In the present study an attempt was made to synthesize the $Al_2O_3$.$2SiO_2$ glass in which atomic ratio is Al:Si=1:1 by sol-gel process. And at such a low temperature as 55$0^{\circ}C$ clear amorphous gel derived glass with Si-O-Al bonding was obtained. $Si(OC_2H_5)_4$ and $Al(NO_3)_3$.$9H_2O$ were used as the precursor and among the mutual solvents only n-butanol gave good results for the synthesis of the gel derived glass. Partial hydrolysis of TEOS with one-fold mol of $H_2O$ prior to the reaction with aluminum nitrate gave the better results., Total oxide content to the total reactants by weight was affective to the results.