• Proceedings of the IEEK Conference
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• 2001.06a
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• pp.421-424
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• 2001

In this paper, We have designed and fabricated VCO in two way, the common source and common gate circuit for I local oscillator of 60 GHz wireless LAN system. The VCO employed a GaAs MESFET for negative resistance and a varactor diode for frequency tuning. The common gate VCO was measured the phase noise -112 dBc/Hz at the 1 MHz frequency offset. The output power and the second harmonic frequency suppression were 7.81 dBm and -29.3 dBc when tuning voltage was 3V, respectively. The total size of VCO was 28.6$\times$12.14 $\textrm{mm}^2$.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.31 no.9
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• pp.74-81
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• 1982

One of the stable thin film transistor fabricated by cadmium suifide with the anodized aluminium oxide as gate material. The principle of the operation for the device is based on the control mechanism of injected majority carricrs to the wide band gap semiconductor, that is cadmium sulfide, by means of the function of the gate control. The fabricated device constructed by evaporating CdS layer in the form of microcrystalline on the oxided thin film characterized by ea, 80 as voltage amplification factor, 1/100 mho as transconductance, 8 kohm as dynamic output resistance, furthermore gain band width products is about 15 MHz.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.10
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• pp.489-493
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• 2001

The on-current of offset and LDD structured devices in slightly decreased while the off-current are remarkably reduced and almost constant independent of gate and drain voltage because offset and LDD regions behave as a series resistance and reduce the lateral electric field in the drain depletion. Degradation of these devices is dependent upon the offset and LDD length rather than doping concentration in these regions. Also, degradation mechanism has been related to the interface generation rather than the hot carrier injection into gate oxide.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.274-280
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• 2001

This paper presents transconductance (g$\_$m/( characteristics of GaAs MESFET's at high temperatures ranging from room temperature to 350$\^{C}$. GaAs MESFET of 0.3x750[㎛] gate dimension has been used to obtain the experimental data. Gate to source voltage(V$\_$GS/) has been controlled to obtain the temperature dependent characteristics for maximum transconductance g$\_$mmax/ of the device. Furthermore g$\_$mmax/ and expected g$\_$m/ have been traced with temperatures ranging from room temperature to 350$\^{C}$ also by compensating for C$\_$GS/ to maintain the optimum operation of the device. From the results, V$\_$GS/decreases as the operating temperature increases for optimum operation of the transconductance. Finally V$\_$GS/ has been optimized to trace g$\_$mmax/ and enhances the decreased g$\_$m/ with different temperatures.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.1
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• pp.74-80
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• 1990

The transconductance of short channel LDD MOSFETs in the saturation region (high Vd)has shown different characteristics from that of conventional device. The transconductance in saturation regime of short channel LDD MOSFETs is reduced from maximum value at higher gate voltage. This decline is analyzed as the velocity saturation effects of carrier at LDD region but accurate analytical expressions for the drain current Idsat and the transconductance Gmsat in the saturation regime are still not in existence. Recently the drain current dependence of parasitic source resistance Rs has been modeled from the velocity saturation of carriers in LDD region. In this study, we approximate that Rmsat that Rs is linearly dependent on the applied gate voltage. Analytical expressions for Idsat and Gmsat obtained from this approximation show the same general behavior as experimental results of short channel LDD NMOSFETs.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.110.2-110.2
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• 2012

We reported on antireflective ZnSnO (ZTO)/Ag bilayer and ZTO/Ag/ZTO trilayer source/drain (S/D) electrodes for all-transparent ZTO channel based thin film transistors (TFTs). The ZTO/Ag bilayer is more transparent (83.71%) and effective source/drain (S/D) electrodes for the ZTO channel/Al2O3 gate dielectric/ITO gate electrode/glass structure than ZTO/Ag/ZTO trilayer because the bottom ZTO layer in the trilayer increasea contact resistance between S/D electrodes and ZTO channel layer and reduce the antireflection effect. The ZTO based all-transparent TFTs with ZTO/Ag bilayer S/D electrode showed a saturation mobility of 4.54cm2/Vs and switching property (1.31V/decade) comparable to TTFT with Ag S/D electrodes.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.96-106
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• 1996

One of the major problems for poly-Si TFTs is the large off state leakage current. LDD (lightly doped drain) and offset gated structures have been employed in order to reduce the leakage current. However, these structures also redcue the oN current significantly due to the extra series resistance caussed by the LDD or offset region. It is desirable to have a device which would have the properties of the offset gated structure in the OFF state, while behaving like a fully gated device in the oN state. Therefore, we propose a new thin film transistor with pnp junction gate which reduce the leakage curretn during the OFF state without sacrificing the ON current during the ON state.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1193-1196
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• 2009

Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.

• Proceedings of the KIEE Conference
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• 1998.11b
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• pp.603-605
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• 1998

In recent years, chip delay estimation has had an increasingly important impact on overall design technology. The analysis of the timing behavior of an ASIC should be based not only on the delay characteristics of gates and interconnect circuits but also on the interactions between them. This model plays an important role in our CAD system to analyze the ASIC timing characteristics accurately, together with two-dimensional gate delay table model, AWE algorithm and effective capacitance concept. In this paper, we present an efficient algorithm which accounts for series resistance by computing a reduced-order approximation for the driving-point admittance of an RC-tree and an effective capacitance equation that captures the complete waveform response accurately.

• Transactions on Electrical and Electronic Materials
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• v.10 no.6
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• pp.189-192
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• 2009

The leakage current in a CMOS image sensor (CIS) can have various origins. Leakage current investigations have focused on such things as cobalt-salicide, source and drain scheme, and shallow trench isolation (STI) profile. However, there have been few papers examining the effects on leakage current of nitride stringers that are formed by gate sidewall etching. So this study reports the results of a series of experiments on the effects of a nitride stringer on real display images. Different step heights were fabricated during a STI chemical mechanical polishing process to form different nitride stringer sizes, arsenic and boron were implanted in each fabricated photodiode, and the doping density profiles were analyzed. Electrons that moved onto the silicon surface caused the dark leakage current, which in turn brought up the speckle defect on the display image in the CIS.