• Environmental Engineering Research
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• v.19 no.1
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• pp.67-73
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• 2014

In India, disposal of vegetable market waste along with municipal solid waste in landfills or dumpsites is creating much nuisance in terms of odor nuisance, leachate production, and greenhouse gas emission into the atmosphere. Therefore, vegetable waste with high biodegradable and nutrient content is composted in a 550-L batch scale rotary drum composter to study the degradation process and its compost properties for its potential reuse as high quality compost. A total 150 kg of working volume was fixed for composting studies with two different ratios, trial A (6:3:1) of C/N 24 and trial B (8:1:1) of C/N 30, respectively. A maximum of $63.5^{\circ}C$ and $61.2^{\circ}C$ was observed in trials A and B; an average of $55^{\circ}C$ for more than 5 days, which helped in the degradation of organic matter and reduction of total and fecal coliform. The temperature dropped suddenly after the thermophilic stage in trial B, and leachate was observed due to insufficient amount of bulking agent. Mesophilic bacteria dominated during the initial stages of composting, and reduced considerably during the thermophilic stage. During the thermophilic stage, the rise in spore-forming organisms, including spore-forming bacteria, fungi, actinomycetes and streptomycetes, increased and these were predominant until the end of the composting process. By examination, it was observed that moisture and leachate production had adverse effects on the compost parameters with higher loss of micronutrients and heavy metals.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.853-855
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• 1998

The electrical resistivity and mechanical properties of the hot-pressed and annealed ${\beta}$-SiC+39vol.%$ZrB_2$ electroconductive ceramic composites were investigated as a function of the liquid forming additives of $Al_{2}O_{3}+Y_{2}O_{3}$(6:4wt%). In this microstructures. no reactions were observed between $\beta$-SiC and $ZrB_2$, and the relative density is over 97.6% of the theoretical density. Phase analysis of composites by XRD revealed mostly of a $\alpha$-SiC(6H, 4H), $ZrB_2$ and weakly $\beta$-SiC(15R) phase. The fracture toughness decreased with increased $Al_{2}O_{3}+Y_{2}O_{3}$ contents and showed the highest for composite added with 4wt% $Al_{2}O_{3}+Y_{2}O_{3}$ additives. The electrical resistivity increased with increased $Al_{2}O_{3}+Y_{2}O_{3}$ contents because of the increasing tendency of pore formation according to amount of liquid forming additives $Al_{2}O_{3}+Y_{2}O_{3}$. The electrical resistivity of composites is all positive temperature coefficient resistance(PTCR) against temperature up to $700^{\circ}C$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.91-94
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• 2004

Preform design techniques have been investigated in efforts to reduce die wear and forming load and to improve material flow, filing ratio, etc. In hot forging processes, a thin deformed part of a workpiece, known as a flash, is formed in the narrow gap between the upper and lower tools. Although designers make tools that generate a flash intentionally in order to improve flow properties, excessive flash increases die wear and forming load. Therefore, it is necessary to make a preform shape that can reduce the excessive flash without changing flow properties. In this paper, a new preform design technique is proposed to reduce the excessive flash in a metal forging process. After a finite element simulation of the process is carried out with an initial billet, the flow of material in the flash region is traced from the final shape to the initial billet. The region belonging to the flash is then easily found in the initial billet. The finite element simulation is then carried out again with the modified billet from which the selected region has been removed. In several iterations of this technique, the optimal preform shape that minimizes the amount of flash without changing the forgeability can be obtained.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.48-54
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• 2000

In this study the characteristics of chip formation of the cold drawn Bi-S free machining steels were assessed. And for comparison those of the cold drawn Pb-S free machining steel the hot rolled low carbon steel which has MnS as free machining inclusions and the conventional steels were also investigated. During chip formation the cold drawn free machining steels show relatively little change in thickness and width of chip compare to those of the conventional carbon steels. And a single parameter which indicates the degree of deformation during chip formation chip cross-section area ratio is introduced. The chip cross-section area ratio is defined as chip cross-section area is divided by undeformed chip cross-section area. The variational patters of the chip cross-section area ratio of the materials cut are similar to those of the shear strain values. The shear stress however seems to be dependent on the carbon content of the materials. The cold drawn Bi-S and Pb-S steels show nearly the same chip forming behaviors and the energy consumed during chip formation is almost same. A low carbon steel without free machining aids shows poor chip breakability due to its high ductility. By introducing a small amount of free machining inclusions such as MnS Bi, Pb or merely increasing carbon content the chip breakability improves significantly.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.351-356
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• 1999

In this study, the characteristics of chip formation of the cold drawn Bi-S free machining steels were assessed. And for comparison, those of the cold drawn Pb-S free machining steel, the hot rolled low carbon steel which has MnS as free machining inclusions and the conventional steels were also investigated. During chip formation, the cold drawn free machining steels show relatively little change in thickness and width of chip compare to those of the conventional carbon steels. And a single parameter which indicates the degree of deformation during chip formation, 'chip cross-section area ratio' is introduced. The chip cross-section area. The variational patterns of cross-section area is divided by undeformed chip cross-section area. The variational patterns of the chip cross-section area ratio of the materials cut are similar to those of the shear strain values. The shear stress, however, seems to be dependent on the carbon content of the materials. The cold drawn BiS and Pb-S steels show nearly the same chip forming behaviors and the energy consumed during chip formation is almost same. A low carbon steel without free machining aids shows poor chip breakability due to its high ductility. By introducing a small amount of non-metallic inclusions such as MnS, Bi, Pb or merely increasing carbon content the chip breakability improves significantly.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.5
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• pp.351-355
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• 2001

Via for achieving reliable fabrication of MCM(Multichip Module) substrate was formed on photosensitive BCB layer. The MCM substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in the photosensitive BCB layer, the process of forming the BCB layer and its via forming plasma etch using C$_2$F$\_$6//O$_2$ gas were evaluated. The thickness of the BCB layer after hard bake was shrunk down to 40% of the original. The resolution of vias formed on the BCB was 15㎛ and the slope after develop was 85 degree. AES analysis was done on two vias, one is etched in C$_2$F$\_$6/O$_2$ gas and the other isnot etched. On the via etched in C$_2$F$\_$6//O$_2$, native C was detected and the amount of native C was reduced after Ar sputter. On the via not etched in C$_2$F$\_$6//O$_2$, organic C was detected. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable vias.

• Journal of Hydrospace Technology
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• v.2 no.1
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• pp.41-54
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• 1996

Sculptured surface structures such as ship hulls are traditionally formed up to the required double curved shape by line heating method. The nature of the line heating process is a transient thermal process, followed by a thermo-elastic-plastic stress field. The permanant shape is dependent on many factors involved in the process, Among them are torch speed and path, supplied heat type and amount , and plate size. Thus, the work is essentially leaded by experts with lots of experiences. However, in order to effectively improve productivity through automation, each factor should be clearly examined how much it affects the final shape. This can not be done only by experiments, but can be achieved by a mechanics-based approach. In this paper, we propose a conceptual configuration for plate forming system, and then present simulations of the line heating process with numerical data in practices and suggest a computerized process of the line heating for practical applications. The modeling of heating torch, water cooling, and the plate to be formed is proposed for the finite element analysis after the mechanics of line heating is studied. Parametric studies are given and discussed for the effects of plate thickness, torch speed and initial curvature in forming a saddle typed surface.

• Transactions of Materials Processing
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• v.15 no.2 s.83
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• pp.118-125
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• 2006

API steel is used for line-pipe to transport the oil and natural gas. As the recent trends in the development of API steel are towards the use of larger diameter and thicker plate, many researches have been studied to achieve higher strength, higher toughness and lower yield ratio in API steel. However, the strength of API steel after pipe forming is changed depending on the competition of the Bauschinger effect and work hardening which are affected by the strain history during pipe forming process. So, the purpose of this study is to investigate the influence of microstructure on the Bauschinger effect for API steel. To change the microstructure of API steel we have changed the hot rolling condition and the amounts of V and Cu addition. The compression-tensile test and the microstructure observation by OM and TEM were conducted to investigate the yield strength drop and the correlation between the Bauschinger effect and microstructure of API steel. The experimental results show that the increase of polygonal ferrites volume fraction increases the Baushcinger effect due to the back stress which comes from the increase of mobile dislocation density at polygonal ferrite interior during the compressive deformation. The hot rolling condition was more effective on the Bauschinger effect in API steel than the small amount of V and Cu addition.

• Journal of The Korean Astronomical Society
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• v.29 no.2
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• pp.107-117
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• 1996

We have studied the star forming activities and dust properties of Lynds 1251, a dark cloud located at relatively high galactic latitude. Eleven IRAS point sources identified toward Lynds 1251 are discussed. Estimate of stellar masses, and far-infrared lumnosities of the young stars associated with two prominent IRAS point sources imply that these are T-Tauri stars with masses smaller than $0.3 M_\bigodot$. The low dust temperature of 27 K and low ratio of FIR emission to hydrogen column density are probably due to the lack of internal heating sources. Presumably two low mass young stars do not have enough energy to heat up the dust and gas associated. The dust heating is dominated by the interstellar heating source, and the weaker interstellar radiation field can explain the exceptionally low dust temperatures found in Lynds 1251. The estimated dust mass of Lynds 1251 is just $\~1M_\bigodot$, or about 1/1000 of gas mass, which implies that there must be a substantial amount of colder dust. The infrared flux at $100{\mu}m$ is matching well with $^{13}CO$ peak temperature, while the $^{12}CO$ integrated intensity is matching with the boundary of dust emission. Overall, the dust properties of Lynds 1251 is similar to those of normal dark clouds even though it does have star forming activities.