• Journal of the Korean Wood Science and Technology
• /
• 제26권4호
• /
• pp.92-97
• /
• 1998

Four urea-formaldehyde (UF) resins were synthesized as a particleboard (PB) binder with the four different initial formaldehyde/urea mole ratio and the final mole ratio of 1.15. The UF resins were characterized according to the standard method of resin adhesive analysis. PBs were manufactured using liquid UF resins at 5 minutes press time and 6% resin solids levels on an ovendry particle weight basis. A total of 20 PBs was fabricated for 5 panel replication per UF resin types. The panels were tested for physical strength properties per the procedure ASTM D 1037. The formaldehyde emission levels from the PBs bonded with the UF resins were tested according to 2-hour desiccator test method ASTM D 5582. There were no significant differences among UF resin types for internal bond strength of PBs. But there were significant differences among UF resin types for formaldehyde emission level of PBs. The results showed that the formaldehyde emission level was influenced by the UF resin types without reducing the adhesive performance.

• Journal of the Korean Wood Science and Technology
• /
• 제34권5호
• /
• pp.29-41
• /
• 2006

This study was to investigate the effect of adding additive as tannin, rice husk and charcoal, for reducing the formaldehyde emission level, on the adhesion properties of urea-formaldehyde (UF) resin for particleboard. We controlled the hot-pressing time, temperature and pressure to determine the bonding strength and formaldehyde emission. Blends of various UF resin/additives (tannin, rice husk and charcoal) compositions were prepared. To determine and compare the effect of additives (tannin, rice husk and charcoal) content, 0, 5, 10 and 15%, by weight of UF resin, were used. $NH_4Cl$ as hardener added. To determine the level of formaldehyde emission, we used the desiccator, perforator and 20 L-small chamber method. The formaldehyde emission level decreased with increased additions of additive (except rice husk). Also, increased hot-pressing time decreased formaldehyde emission level. At a charcoal replacement ratio of only 15%, the formaldehyde emission level is under F ✩ ✩ ✩ ✩ grade (emit < $0.3mg/{\ell}$). Curing of the high tannin additive content in this adhesive system indicated that the bonding strength increased. But, in the case of rice husk and charcoal, the bonding strength was much lower due to the inorganic substance. Furthermore, rice husk was poor in bonding strength as well as formaldehyde emission than tannin and charcoal.

• 한국주거학회:학술대회논문집
• /
• 한국주거학회 2009년 춘계학술발표대회 논문집
• /
• pp.204-207
• /
• 2009

The purpose of this study was to evaluation of impact factors, which are temperature and relative humidity on formaldehyde emission from MDF(Medium Density Fiberboard). The test was carried out at 4 specimens that were different of temperature and humidity by using small chamber system. Formaldehyde was sampled and analyzed by HPLC. The results of this study were as follows; 1) When the temperature increased from 25 to $35^{\circ}C$ at 50%, the emission rate of formaldehyde increased 1.0-1.6 times. 2) When the RH increased from 50% to 80% at $25^{\circ}C$, the emission rate of formaldehyde decreased 0.6 times. 3) The enhancement effect of temperature on Formaldehyde under RH of 50% was more significant than under RH of 80%.

• 한국응용과학기술학회지
• /
• 제26권1호
• /
• pp.18-23
• /
• 2009

Curing behavior and structural property of an inorganic compound added urea-formaldehyde(UF) and urea-melamine-formaldehyde(UMF) were studied. In addition, tensile strength and formaldehyde emission of plywoods made of those resin binders were studied. Curing temperature and structure were not changed, but tensile strengths of plywoods manufactured both with a UF resin and a UMF resin were decreased slightly as increased amount of inorganic compound. Formaldehyde emissions from plywoods were reduced as increased amount of inorganic compound. Wheat flour as an extender was helped to reduce of formaldehyde emission. From the result of this study it might be estimated that using appropriate amount of inorganic compound and proper resin system can be strengthened bond strength and reduced formaldehyde emission.

• 동력기계공학회지
• /
• 제3권2호
• /
• pp.20-25
• /
• 1999

Experiments were carried out to investigate the characteristics of formaldehyde emission from the small gasoline engine and its reduction technologies. Catalytic converters used are Pt/Rh, Pd/Rh, Pd/Pt, $62cell/cm^2$ monolith type. The measurement of formaldehyde was conducted by using the method of DNPH-GC. From the experimental results, formaldehyde emission increased in a lean mixture due to incomplete combustion of the hydrocarbons. The order of catalytic activity of formaldehyde oxidation was Pt/Rh > Pd/Rh > Pd/Pt. As the distance from the exhaust manifold to the inlet of the catalyst became far, in spite of lower catalyst temperature, formaldehyde concentration decreased because of the adsorption of formaldehyde.

• Journal of the Korean Wood Science and Technology
• /
• 제33권2호통권130호
• /
• pp.29-39
• /
• 2005

Formaldehyde emissions from wood-based panels bonded with pine and wattle tannin-based adhesives, urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), and co-polycondensed resin of urea-melamine-formaldehyde (UMF) were measured by the Japanese standard method using a desiccator (JIS A 1460) and the EN 120 (European Committee For Standardization, 1991) method using the perforator value. In formaldehyde emission, all particleboards made using the wattle tannin-based adhesive with three different hardeners, paraformaldehyde, hexamethylenetetramine, and tris(hydroxyl)nitromethan (TN), satisfied the requirements of grade $E_1$. But only those made using the pine tannin-based adhesive with the hexamine as hardener met the grade $E_1$ requirements. Hexamine was effective in reducing formaldehyde emission in tannin-based adhesives when used as the hardener. While the UF resin showed a desiccator value of $7.1mg/{\ell}$ and a perforator value of 12.1 mg/100 g, the MF resin exhibited a desiccator value of $0.6mg/{\ell}$ and a perforator value of 2.9 mg/100 g. According to the Japanese Industrial Standard and the European Standard, the formaldehyde emission level of the MDF panels made with UF resin in this study came under grade $E_2$. The formaldehyde emission level was dramatically reduced by the addition of MF resin. The desiccator and perforator methods produced proportionally equivalent results. Gas chromatography, a more sensitive and advanced method, was also used. The samples for gas chromatography were gathered during the experiment involving the perforator method. The formaldehyde contents measured by gas chromatography were directly proportional to the perforator values.

• Journal of the Korean Wood Science and Technology
• /
• 제30권2호
• /
• pp.165-171
• /
• 2002

본 연구는 마루판의 천연무늬단판 접착에 이용되고 있는 요소-멜라민 접착제의 수지조성에 따른 접착성능 및 포름알데히드 방출량의 변화를 알아보고자 하였다. 요소에 멜라민에 대한 포름알데히드의 몰비 1.0, 1.1, 1.2, 1.4를 기준으로 제조된 접착제로 마루판용 합판과 섬유판에 천연무늬단판을 접착한 목질마루판에 의해 시험을 실시하였다. 그 결과는 화학양론적으로 멜라민-요소와 포름알데히드간의 비율이 적정한 조건에서 반응이 충분히 일어난 경우에 상태접착력, 준내수접착력, 포름알데히드 방출량 등이 가장 양호하게 나타났다. 복합마루판의 평면인장강도는 각 몰비에서 14 kgf/cm²를 상회하였으며, 포름알데히드 방출량은 1.0몰비에서 9.53 mg/L로 가장 낮게 나타났다. 합판마루판의 평면인장 접착력 시험에서는 1.4몰비에서 14.02 kgf/cm²로 가장 높은 값을 보였다. 합판마루판의 포름알데히드 방출량 조사에서도 1.0목비에서 0.26 mg/L로 가장 낮게 나타났다.

• Journal of the Korean Wood Science and Technology
• /
• 제34권3호
• /
• pp.30-37
• /
• 2006

본 연구는 각종 실내디자인에 이용되는 목질보드의 포름알데히드(HCOH) 방산 특성과 몇 가지 VOC 저감 방법에 대한 포름알데히드의 방산량 변화를 측정하였다. 포름알데히드 방산량은 온도가 증가함에 따라 뚜렷이 증가하는 경향을 보였고, 측정 전 처리조건에 따라 포름알데히드 방산량의 현저한 변화가 나타났다. bake-out 처리후의 목질보드의 포름알데히드 방산량은 대조구와 비교하여 감소함을 나타냈다. 시편에 urethane, cashew, water stain, oil stain coating을 했을 때 각 마감재료에 따라 포름알데히드 방산량의 차이가 확인되었으며, edge sealing 처리 후 두드러진 감소경향이 나타났다. $TiO_2$ coating은 일반광보다는 자외선 램프의 포름알데히드 저감효율이 좋았고, 자외선 램프의 조사시간이 길어지면 포름알데히드의 감소량도 증가하였다.

• Journal of the Korean Wood Science and Technology
• /
• 제35권5호
• /
• pp.24-37
• /
• 2007

The Korean Ministry of Environment started controlling indoor air quality (IAQ) in 2004 through the introduction of a law regulating the use of pollutant emitting building materials. The use of materials with formaldehyde emission levels above $1.25 mg/m^2{\cdot}h$ (JIS A 1901, small chamber method) has been prohibited. This level is equivalent to the $E_2$ grade ($>5.0mg/{\ell}$) of the desiccator method (JIS A 1460). However, the $20{\ell}$ small chamber method requires a 7-day test time to obtain the formaldehyde and volatile organic compound (VOC) emission results from solid building interior materials. As a approach to significantly reduce the test time, the field and laboratory emission cell (FLEC) has been proposed in Europe with a total test time less than one hour. This paper assesses the reproducibility of testing formaldehyde and TVOC emissions from wood-based composites such as medium density fiberboard (MDF), laminate flooring, and engineered flooring using three methods: desiccator, perforator and FLEC. According to the desiccator and perforator standards, the formaldehyde emission level of each flooring was ${\le}E_1$ grade. The formaldehyde emission of MDF was $3.48 mg/{\ell}$ by the desiccator method and 8.57 g/100 g by the perforator method. To determine the formaldehyde emission, the peak areas of each wood-based composite were calculated from aldehyde chromatograms obtained using the FLEC method. Formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde and benzaldehyde were detected as aldehyde compounds. The experimental results indicated that MDF emitted chloroform, benzene, trichloroethylene, toluene, ethylbenzene, m,p-xy-lene, styrene, and o-xylene. MDF emitted significantly greater amounts of VOCs than the floorings did.

• 한국가구학회지
• /
• 제11권1호
• /
• pp.53-59
• /
• 2000

This study was to measure formaldehyde emission and bonding strength of plywoods manufactured with urea-melamine formaldehyde adhesives, which were made from three different mixing ratios of urea and melamine, and with four different formaldehyde/urea-melamine molar ratios of 1.0,1.1,1.2 and 1.4. The results were as follows 1. Amount of formaldehyde emission was the lowest at the first method of molar ratio(F/(M+U)) 1.0. Amounts of formaldehyde emission of experimental manufactured adhesives were lower than that of commercial adhesive. 2. Bonding strength of dry specimen was the highest at the first method of molar ratio(F/(M+U)) 1.4. Dry bonding strength of molar ratio(F/(M+U)) 1.4 was similar to commercial adhesive. 3. Bonding strength of wet specimen was the highest at the second method of molar ratio(F/(M+U)) 1.4. Bonding strength of wet specimen used by the third method of molar ratio(F/(M+U)) 1.4 was almost equal to commercial adhesive.