• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Journal of the Korean Society of Visualization
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• v.7 no.2
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• pp.17-21
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• 2010

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.343-351
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• 2008

In this paper, a spiral shaped common mode filter(CMF) embedded in a flexible printed circuit board(FPCB) is proposed for a multi-function cable. The CMF embedded in a FPC cable presents a new concept as a multi-function cable by the common mode rejection characteristics without a surface mounted device(SMD) CMF. The embedded CMF has a wideband common mode rejection bandwidth and an enhanced differential mode characteristics compared to conventional CMFs that use a magnetic material such as a ferrite of high loss. The proposed CMF of 3 turn inductors has a common mode rejection bandwidth from 0.4 GHz to 3.12 GHz and has 1.95 dB at 3 GHz, 6.97 dB at 8 GHz improvements of a differential mode insertion loss compared to the commercial LTCC(Low Temperature Co-fire Ceramics) CMFs.

• Journal of Sensor Science and Technology
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• v.26 no.4
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• pp.245-250
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• 2017

A novel method to implement a birdcage-type receiving coil sensor for use in a magnetic resonance imaging(MRI) system has been demonstrated employing a flexible printed circuit board (FPCB) fabrication technique. Unlike the conventional methods, the two-dimensional shape of the coil sensor is first implemented as a FPCB and then it is attached to the surface of a cylindrical supporting structure to implement the three-dimensional birdcage-type coil sensor. The proposed method is very effective to implement object-specific MRI coil sensors especially for small animal measurements in research and preclinical applications since the existing well-developed FPCB-based techniques can easily meet the requirements on accuracies and costs during coil implement process. The performances of the coil sensor verified through $^1H$ 1.5T MRI measurements for small animals and it showed excellent characteristics by providing a high spatial precision and a high signal-to-noise ratio.

• ETRI Journal
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• v.35 no.1
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• pp.1-6
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• 2013

In this paper, we present an implemented serial 40-Gb/s receiver optical subassembly (ROSA) module by employing a proposed TO-CAN package and flexible printed circuit board (FPCB). The TO-CAN package employs an L-shaped metal support to provide a straight line signal path between the TO-CAN package and the FPCB. In addition, the FPCB incorporates a signal line with an open stub to alleviate signal distortion owing to an impedance mismatch generated from the soldering pad attached to the main circuit board. The receiver sensitivity of the ROSA module measures below -9 dBm for 40 Gb/s at an extinction ratio of 7 dB and a bit error rate of $10^{-12}$.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.63-67
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• 2014

As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.

• Journal of the Korean Society of Visualization
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• v.14 no.2
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• pp.52-60
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• 2016

The Passive Auxiliary Feedwater System(PAFS) is one of the advanced safety concepts adopted in the Advanced Power Reactor Plus(APR+). To validate the operational performance of the PAFS, detailed understanding of a boiling heat transfer on horizontal tube outside is of great importance. Especially, in the mechanistic boiling heat transfer model, it is important to visualize the phenomena but there are some limitations with conventional experimental approaches. In the present study, we devised a heater based on the Flexible Printed Circuit Board (FPCB) for a more comprehensive visualization and subsequently, a digital image processing technique for the bubble motion measurement was established. Using the measurement technique, important parameters of the nucleate boiling are analyzed.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.