• Journal of the Korean Geotechnical Society
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• v.31 no.8
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• pp.5-15
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• 2015

One-dimensional rainfall laboratory tests using gneissic weathered soil were conducted to investigate effect of antecedent rainfall on infiltration characteristics. Experimental results using samples from Chuncheon and Chungju sites showed that rainfall onto the ground surface decreased initial negative pore water pressure of unsaturated soils, which recovered gradually after the end of rainfall. Rainfall intensity increases water infiltration rate, and infiltration rate during main rainfall is faster than that of the preceding rainfall. It is considered that higher water saturation after antecedent rainfall increases water infiltration rate during main rainfall. In particular, Chungju sample with higher clay content had slower recovery of negative pore water pressure and infiltration rate. Numerical results using finite element slope stability analysis showed that reduction of initial negative pore pressure due to rainfall infiltration deteriorates slope stability, and diffusion of pore water pressure after the end of rainfall further reduces FS of the slope in the short term. Main rainfall after prior rainfall further reduced factor of safety of the unsaturated slope. Pattern of antecedent rainfall has a significant impact on the magnitude and distribution of initial pore water pressure in unsaturated soils which are controlling factor to assess factor of safety of unsaturated slope during rainfall.

• Journal of the Korea Concrete Institute
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• v.15 no.6
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• pp.769-777
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• 2003

The strengthening of concrete structures in situ with externally bonded carbon fiber is increasingly being used for repair and rehabilitation of existing structures. Because carbon fiber is attractive for this application due to its good tensile strength, resistances to corrosion, and low weight. Generally bond strength and behavior between concrete and carbon fiber mesh(CFM) is very important, because of enhancing bond of CFM. Therefore if bond strength is sufficient, it will be expect to enhance reinforcement effect. Unless sufficient, expect not to enhance reinforcement effect, because of occuring bond failure between concrete and CFM. In this study, the bond strength and load-displacement response of CFM to the concrete by the direct pull-out test(the tensile-shear test method) were investigated using the experiment and the finite element method analysis with ABAQUS. The key variables of the experiment are the location of clip, number of clips and thickness of cover mortar. The general results indicate that the clip anchorage technique for increasing bond strength with CFM appear to be effective to maintain the good post-failure behavior.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.6
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• pp.78-86
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• 2014

In this paper, a novel intensity-based fiber optic vibration sensor using a mass-spring structure, which consists of four serpentine flexure springs and a rectangular aperture within a proof mass, is proposed and its feasibility test is given by the simulation and experiment. An optical collimator is used to broaden the beam which is modulated by the displacement of the rectangular aperture within the proof mass. The proposed fiber optic vibration sensor has been analyzed and designed in terms of the optical and mechanical parts. A mechanical structure has been designed using theoretical analysis, mathematical modeling, and 3D FEM (Finite Element Method) simulation. The relative aperture displacement according to the base vibration is given using FEM simulation, while the output beam power according to the relative displacement is measured by experiment. The simulated sensor sensitivity of $15.731{\mu}W/G$ and detection range of ${\pm}6.087G$ are given. By using reference signal, the output signal with 0.75% relative error shows a good stability. The proposed vibration sensor structure has the advantages of a simple structure, low cost, and multi-point sensing characteristic. It also has the potential to be made by MEMS (Micro-Electro-Mechanical System) technology.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.37-45
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• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.2
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• pp.127-134
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• 2020

High supersonic aircraft are exposed to high temperature environments by aerodynamic heating during supersonic flight. Thermal protection system structures such as double-panel structures are used on the skin of the fuselage and wings to prevent the transfer of high heat into the interior of an aircraft. The thin-walled double-panel skin can be exposed to acoustic loads by supersonic aircraft's high power engine noise and jet flow noise, which can cause sonic fatigue damage. Therefore, it is necessary to examine the behavior of supersonic aircraft skin structure under thermal-acoustic load and to predict fatigue life. In this paper, we designed and fabricated thermal-acoustic test equipment to simulate thermal-acoustic load. Thermal-acoustic testing of the titanium specimen under thermal-acoustic load was performed. The analytical model was verified by comparing the thermal-acoustic test results with the finite element analysis results.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.88-91
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• 2002

The two dimensional size effect of specimen gauge section (length x width) was investigated on the compressive behavior of a T300/924 [45/-45/0/90]3s, carbon fiber-epoxy laminate. A modified ICSTM compression test fixture was used together with an anti-buckling device to test 3mm thick specimens with a 30$\times$30, 50$\times$50, 70$\times$70, and 90mm$\times$90mm gauge length by width section. In all cases failure was sudden and occurred mainly within the gauge length. Post failure examination suggests that $0^{\circ}$ fiber microbuckling is the critical damage mechanism that causes final failure. This is the matrix dominated failure mode and its triggering depends very much on initial fiber waviness. It is suggested that manufacturing process and quality may play a significant role in determining the compressive strength. When the anti-buckling device was used on specimens, it was showed that the compressive strength with the device was slightly greater than that without the device due to surface friction between the specimen and the device by pretoque in bolts of the device. In the analysis result on influence of the anti-buckling device using the finite element method, it was found that the compressive strength with the anti-buckling device by loaded bolts was about 7% higher than actual compressive strength. Additionally, compressive tests on specimen with an open hole were performed. The local stress concentration arising from the hole dominates the strength of the laminate rather than the stresses in the bulk of the material. It is observed that the remote failure stress decreases with increasing hole size and specimen width but is generally well above the value one might predict from the elastic stress concentration factor. This suggests that the material is not ideally brittle and some stress relief occurs around the hole. X-ray radiography reveals that damage in the form of fiber microbuckling and delamination initiates at the edge of the hole at approximately 80% of the failure load and extends stably under increasing load before becoming unstable at a critical length of 2-3mm (depends on specimen geometry). This damage growth and failure are analysed by a linear cohesive zone model. Using the independently measured laminate parameters of unnotched compressive strength and in-plane fracture toughness the model predicts successfully the notched strength as a function of hole size and width.

• Composites Research
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• v.29 no.2
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• pp.45-52
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• 2016

An understanding of the failure mechanisms of the adhesive layer is decisive in interpreting the performance of a particular adhesive joint because the delamination is one of the most common failure modes of the laminated composites such as the fiber metal laminates. The interface between different materials, which is the case between the metal and the composite layers in this study, can be loaded through a combination of fracture modes. All loads can be decomposed into peel stresses, perpendicular to the interface, and two in-plane shear stresses, leading to three basic fracture mode I, II and III. To determine the load causing the delamination growth, the energy release rate should be identified in corresponding criterion involving the critical energy release rate ($G_C$) of the material. The critical energy release rate based on these three modes will be $G_{IC}$, $G_{IIC}$ and $G_{IIIC}$. In this study, to evaluate the fracture behaviors in the fracture mode I and II of the adhesive layer in fiber metal laminates, the double cantilever beam and the end-notched flexure tests were performed using the reference adhesive joints. Furthermore, it is confirmed that the experimental results of the adhesive fracture toughness can be applied by the comparison with the finite element analysis using cohesive zone model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.12
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• pp.2703-2714
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• 2002

In this work, energy absorption characteristics and optimal welding space of spot-welded square hat type tube are investigated via quasi-static crush experiments and finite element (FE) analyses. A FE model reflecting the crush characteristics is established based on the experimentally observed crush mechanisms of specimens with welding spaces (20, 30 & 45 mm) and (25,40 & 55 mm) respectively for two specimen widths (60, 75 mm). The established FE model is then applied to other crush models of widths (50, 60 & 75 mm) with various welding spaces (20, 25, 30, 40, 45, 55, 75, 150, 300 mm) respectively. We examine the energy absorption characteristics with respect to the welding space for each specimen width. The outcome suggests an optimal spot welding space of square hat type thin-walled tube. Energy absorption is also presented in terms of yield strength of base metal, specimen thickness, width, and mean crushing force of spot-welded square hat type thin-walled tube.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.153-160
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• 2010

A magnetocardiogram (MCG) is a recording of the biomagnetic signals generated by cardiac electrical activity. Biomagnetic instruments are based on superconducting quantum interference devices (SQUIDs). A liquid cryogenic Dewar flask was used to maintain the superconductors in a superconducting state at a very low temperature (4 K). In this study, the temperature distribution characteristics of the liquid helium in the Dewar flask was investigated. The Dewar flask used in this study has a 30 L liquid helium capacity with a hold time of 5 d. The Dewar flask has two thermal shields rated at 150 and 40 K. The temperatures measured at the end of the thermal shield and calculated from the computer model were compared. This study attempted to minimize the heat transfer rate of the cryogenic Dewar flask using an optimization method about the geometric variable to find the characteristics for the design geometric variables in terms of the stress distribution of the Dewar flask. For thermal and optimization analysis of the structure, the finite element method code ANSYS 10 was used. The computer model used for the cryogenic Dewar flask was useful to predict the temperature distribution for the area less affected by the thermal radiation.