• 한국화재소방학회:학술대회논문집
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• 한국화재소방학회 1997년도 International Symposium on Fire Science and Technology
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• pp.598-605
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• 1997

In recent years, the number of vehicle fires, as well as the number of motor vehicles, has been increasing rapidly. Therefore, several types of automatic fire suppression systems for the engine compartment of automobiles have been developed to extinguish automobile fires, and most of these systems use halon 1301 as a fire extinguishing agent. Due to environmental concerns, the phase-out of halons has been announced, so now there is a need to replace halon 1301. For this, a 1,1,1,2,3,3,3-heptaflouropropane (HFC-227ea, FM-$200^{TM}$) gas-filled Aqueous Film- Forming foam (known as AFFF) extinguisher was devised even though air foam extinguishers could be used. This is because the air in the foam bubbles is a source of oxygen required for the combustion reaction. It can be surmised that it is possible to increase the fire extinguishing efficiency of AFFF by filling in foam bubbles with a gaseous extinguishing agent. The best choice is the FM-$200^{TM}$ gas-filled AFFF, Which has the maximum expansion ratio of 62:1. This makes it possible for the expanded foam to rapidly fill the engine compartment.

• 한국화재소방학회논문지
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• 제23권3호
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• pp.61-66
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• 2009

본 연구에서는 미분무수 노즐을 이용하여 설치높이 변화에 따른 3종의 포 소화 약제를 각각 혼합하여 소화성능 실험을 수행하였다. 소화성능 실험 결과 순수한 물과 기존의 3%형 수성막포를 사용한 경우보다는 2%형 미분무수 전용 수성막포와 1%형 합성계면활성제포가 더욱 빠른 소화시간을 나타내었다. 또한, 순수한 물만을 사용한 경우에는 3.5m, 포 소화 약제를 사용하였을 때에는 4m의 설치높이에서 가장 좋은 소화효과 나타내었다.

• Corrosion Science and Technology
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• 제10권1호
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• pp.24-29
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• 2011

The greatest purpose of chromate treatment is to improve anti-corrosion by stabilizing a metal surface. Because metal surface forms a compound by absorbing oxygen or water in the air by being generally unstable, it is necessary to improve anti-corrosion of the metal by forming the metal surface with a stable film. When considering the economical efficiency and requirements together because the film of the metal surface treated with chromate has good anti-corrosion and the stability also in the air by being compact and strong, Chromate treatment has been used most up to the electronics industry from the auto industry. However, these days, because hexavalent chromium is both a toxic agent to be able to cause cancers and deadly poisonous environmental pollutant, the strong legal controls on its use is being imposed all over the world. Because of this reason, a new anti-corrosion method is being required. Also, by users' various demands, the passivations that have recently been developed require various characteristics such as conductivity, chemical resistance, alkali cleaning resistance as well as anti-corrosion. We could confirm the results such as excellent anti-corrosion compared to chromate, conductivity, chemical resistance and detergent resistance as the result of analysis of various characteristics of the galvannealed sheet steels coated with Cr-Free solution developed in this research.

• Applied Biological Chemistry
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• 제29권3호
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• pp.241-247
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• 1986

쌀밥 품질의 영향 요인을 규명하기 위하여 밥 짓기 과정중 밥과 밥물의 상호 관계를 분석하고, 저급의 장립종 밀양 23호의 밥맛 증진의 수단으로 새로운 밥짓기 방법을 제시하였다. 밥짓기 과정중 밥과 밥물의 높이 변화를 측정하였다. 끊는점 부근에서 밥물이 급격히 감소하고, 이어서 농축된 밥물이 밥알 표면에 엷은 피막층을 형성함을 관찰할 수 있었다. 피막 보강 물질로 찹쌀분 1,2%(W/W)를 첨가 한 후 밥짓기를 향한 결과, 피막이 크게 보강되었으며 이렇게 제조된 밥은 윤기와 외관이 향상되고 수분 함량이 증가하였으며 밥짓기중 가용성 쌀 고용분 함량의 용출을 감소시킬 수 있었다. 밥알 피막의 형성은 밥짓기의 최종단계에서 밥알의 진동과 밥물의 고형분 농도와 유관함을 보였고, 밥의 음질 결정의 중요 요소로 작용할 수 있음을 제안하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

• Mycobiology
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• 제29권2호
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• pp.110-112
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• 2001

A black scab was observed on strawberry(Fragaria ananassa) in plastic film houses around Jinju area during the winter of 2000. The disease started from leaves then moved to calyx and runner. At the beginning, the infected area started with small dark brown spots then gradually expanded. The pathogenic fungus was purely isolated from the diseased leaves, calyx and runner. The fungus was inoculated to test Koch's postulates and proved to be the causal agent of the disease. The isolated fungus grew readily on potato dextrose agar, forming dark green to dark gray colonies. The optimum temperature for mycelial growth was about $25^{\circ}C$. The diameter of growing hyphae was $3.8{\sim}5.6{\mu}m$. Conidia were ellipsoidal, ovoid or subspherical, mostly one-celled but occasionally septate. The size of conidia were $4.1{\sim}11.7{\times}3.8{\sim}5.3$ 1-cell, $9.3{\sim}18.8{\times}4.0{\sim}7.4{\mu}m$ 2-cell and formed in long branched chains on the erected conidiophores which were dark brown and variable in length between $28.8{\sim}236.2{\times}3.0{\sim}6.2{\mu}m$ in size. The fungus was identified as Cladosporium herbarum on the basis of its morphological characteristics. The black scab disease of strawberry caused by C. herbarum has not been reported in Korea previously.

• The Plant Pathology Journal
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• 제15권6호
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• pp.345-347
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• 1999

A scab disease on eggplant (Solanum melongena L. cv. Chukyang) in plastic film houses around Kimhae area in Korea during the winter season of 0998-1999. The disease started on leaves with small dark brown spots which were gradually expanded to 1 to 3 mm diameter lesions. Later, the central parts of the lesions became collapsed and detached to make holes. Dark brown mold was grown out of the lesions on the lower side of leaf. Numerous conidia were produced on the lower side of leaf. Numerous conidia were produced on the diseased leaves and appeared to be readily dispersed in the air. A fungus was isolated from the diseased leaves, and tested for Koch's postulates to prove the causal agent of the desease. The isolated fungus grew on potato dextrose agar, forming greenish black to pale brown colonies. Conidia were ellipsoidal, fusiform or subspherical, mostly one-celled but occasionally septated, and formed in long branched chains on the erected conidiophores which were pale olevaceous brown and variable in length between 12.4 and $393.4\mu\textrm{g}$. The fungus was identified as Cladosporium cucumerinum Ellis Arthur based on the above morphological characteristics examined. The optimum temperature for mycelial growth and conidial formation was about 20 to $25^{\circ}$. In addition to cucumber, the fungus was also pathogenic to watermelon, pumpkin and oriental melon. This is the first report on the scab disease of eggplant in Korea.

• 펄프종이기술
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• 제45권4호
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• pp.21-26
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• 2013

The effect of esterified starch as surface sizing agent for inkjet printing paper has been evaluated and compared with oxidized starch. Also the influence of various additives including cationic poly-DADMAC, stearic acrylic copolymer, calcium chloride, and GCC was examined. Results showed that starch ester gave higher ink density than oxidized starch. Addition of poly-DADMAC improved water fastness. In general, low molecular weight poly-DADMAC performed better than high molecular weight one, and it was attributed to the fact that it gave more uniform film forming characteristics in surface sizing. Use of styrene acrylic acid copolymer increased hydrophobicity of the paper surface, but it did not increase the ink density. Use of GCC and calcium chloride had only marginal effect on printing quality.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.382-385
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• 2003

Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide($H_2O_2$) as oxidizer of Cu CMP slurry has been investigated. $H_2O_2$ is known as the most common oxidizer in Cu CMP slurry. Copper slowly dissolves in $H_2O_2$ solutions and the interaction of $H_2O_2$ with copper surface had been studied in the literature. Because hydrogen peroxide is a weak acid in aqueous solutions, a passivation-type slurry chemistry could be achieved only with pH buffered solution.[1] Moreover, $H_2O_2$ is so unstable that its stabilization is needed using as oxidizer. As adding KOH as pH buffering agent, stability of $H_2O_2$ decreased. However, stability went up with putting in small amount of BTA as film forming agent. There was no difference of $H_2O_2$ stability between KOH and TMAH at same pH. On the other hand, $H_2O_2$ dispersion of TMAH is lower than that of KOH. Furthermore, adding $H_2O_2$ in slurry in advance of bead milling lead to better stability than adding after bead milling. Generally, various solutions of phosphoric acids result in a higher stability. Using Alumina C as abrasive was good at stabilizing for $H_2O_2$; moreover, better stability was gotten by adding $H_3PO_4$.

• 폴리머
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• 제36권4호
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• pp.413-419
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• 2012

폴리페닐렌에테르[PPE, poly(phenylene ether)] 수지의 경화성분으로서 다관능 우레탄 아크릴레이트 단량체를 합성하고, 이후 PPE와 혼합하여 유전체 기판을 제작하고 그 특성을 평가하였다. 단량체 합성 후 FTIR, NMR 분석을 통하여 우레탄 결합이 형성되었는지 확인하였다. 복합물 쉬트를 필름 코터로 성형한 후, 진공가 압적층하여 테스트 기판을 제작하고, 단량체의 종류 및 함량에 따른 유전율, 유전손실, peel 강도를 평가하였다. 2종의 하이드록시 아크릴레이트 중 페닐기를 가진 2-hydroxy-3-phenoxypropyl acrylate를 이용하여 합성된 단량체를 경화성분으로 사용한 경우 유전손실이 더 작았으며, 단량체의 함량이 줄어들면서 유전율과 손실이 감소하는 경향을 나타내었다. Peel 강도는 단량체의 종류에 따라서 특별한 경향성을 보이지 않았다. 실험결과 동박 접합 강도가 약 10 N이고, 1 GHz에서 유전율이 약 2.54, 유전손실이 0.0027로 작은 고주파 대역용 고분자 기판소재를 얻었다.