• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.189-190
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5))O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour. Structural properties of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around 650 $^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTiO3 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / BaTiO3multilayered thick films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집
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• pp.57-59
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5})O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour. Structural properties of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around $650^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTi03 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / BaTiO3 multilayered thick films.

• Transactions on Electrical and Electronic Materials
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• 제8권4호
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• pp.149-152
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• 2007

[ $(Ba_{0.6}Sr_{0.3}Ca_{0.1})TiO_3$ ](BSCT) thick films doped with 0.1 mol% $MnCO_3\;and\;Yb_2O_3(0.1{\sim}0.7mol%)$ were fabricated by the screen printing method on the alumina substrates. And the structural and electrical properties as a function of $Yb_2O_3$ amount were investigated. The exothermic peak was observed at around $680^{\circ}C$ due to the formation of the poly crystalline perovskite phase. The lattice constants of the BSCT thick film doped with 0.7 mol% is 0.3994 nm. The specimen doped with 0.7 mol% $Yb_2O_3$ showed dense and uniform grains with diameters of about $4.2{\mu}m$. The average thickness of all BSCT thick films was approximately $70{\mu}m$. Relative dielectric constant and dielectric loss of the specimen doped with 0.7 mol% $Yb_2O_3$ were 2823 and 3.4%, respectively. The Curie temperature of the BSCT thick films doped with 0.1 mol% $Yb_2O_3$ was $46^{\circ}C$.

• Bulletin of the Korean Chemical Society
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• 제29권9호
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• pp.1737-1741
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• 2008

The electrochemical and thermal stability of $LiNi_{0.8}Co_{0.16}Al_{0.04}O_2$ were studied before and after $Co_3(PO_4)_2$ coating. Different to conventional coating material such as $ZrO_2$ or AlPO4, the coating layer was not detected clearly by TEM analysis, indicating that the $Co_3(PO_4)_2$ nanoparticles effectively reacted with surface impurities such as $Li_2CO_3$. The coated sample showed similar capacity at a low C rate condition. However, the rate capability was significantly improved by the coating effect. It is associated with a decrease of impedance after coating because impedance can act as a major barrier for overall cell performances in high C rate cycling. In the DSC profile of the charged sample, exothermic peaks were shifted to high temperatures and heat generation was reduced after coating, indicating the thermal reaction between electrode and electrolyte was sucessfully suppressed by $Co_3(PO_4)_2$ nanoparticle coating.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.1960-1961
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5})O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5, Ti0.5)O3/BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour, Structural properties of Pb(Zr0.5,Ti0.5)O3/BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around $650^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTiO3 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / EaTiO3 multilayered thick films.

• 폴리머
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• 제24권2호
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• pp.201-210
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• 2000

에폭시 수지의 삼차원 망목상 구조 형성에 관한 근본적이고 화학구조에 바탕을 둔 미세구조 및 물성 발현에 대한 연구의 일환으로, 말단 관능기가 같은 아민 경화제의 주쇄에 포함된 질소 및 탄소원자의 개수가 반응특성, 열적 특성, 그리고 기계적 특성에 미치는 영향을 조사하였다. 열적 특성을 측정하기 위하여 DSC, TGA, TMA 분석을, 기계적 특성 및 파단특성 분석을 위하여 인장 시험, 삼점 굴곡시험, 광학현미경 분석을 행하였다. 그 결과, 주쇄의 사슬길이가 짧을수록 반응열이 크고 최대 발열온도와 열안정성이 낮아졌다. 또한 최대 반응전환율은 주쇄의 사슬길이가 길어질수록 증가하였다. 경화물의 경우 밀도는 주쇄의 사슬길이와는 큰 관계가 없으나, 인장탄성율은 주쇄의 사슬길이가 짧을수록 크고, 인장강도는 그와 반대의 경향을 보인다. 그 외의 shrinkage, 유리전이온도, 굴곡탄성율, 굴곡강도는 주쇄의 사슬길이와는 일견 무관한 불규칙한 형태를 보였다. 이는 최대 반응전환율의 차이가 이러한 특성에 큰 영향을 미치는 것을 나타낸다. 굴곡 파단특성은 최대 반응전환율과 밀접한 관계를 나타내었다.

• Korean Chemical Engineering Research
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• 제47권2호
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• pp.243-247
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• 2009

본 연구는 수소제조를 위한 에틸렌글리콜 수증기 개질반응에 대한 열역학적 특성 분석을 목적으로 한다. 이를 위하여 온도(300~1,600 K), 반응물 조성비(Steam/Carbon ratio=0.5~4.5), 압력(1~30 기압) 등의 다양한 반응조건을 변화시키면서 열역학적 평형조성 및 효율 등을 조사하였다. 주어진 조건하에서 흡열반응인 개질반응과 발열반응인 수성가스 전환반응 및 메탄화반응간 경쟁특성을 확인하였으며, 반응온도 400 K를 지나면서 수소발생이 관찰되어 500 K를 지나면서 급격한 발생량의 증가를 확인하였다. 반응물 가운데 수증기의 비율을 양론비(S/C=1.0) 이상으로 증가시킬 경우 수성가스 전환반응이 촉진되어 일산화탄소 저감 및 수소발생 증가 거동을 나타내었다. 결과적으로 열역학적 효율감소를 최소화 하면서 수소발생량을 극대화할 수 있는 조건은 반응온도 900 K 이상 및 수증기 대 탄소간 비율이 3.0 이내의 범위에 해당하는 것으로 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Composites Research
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• 제18권4호
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• pp.14-20
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• 2005

방향족아민 경화제의 벤젠링 사이의 관능기 변화가 반응특성, 기계적특성 및 열적특성에 미치는 영향을 고찰하기 위하여 범용 에폭시수지인 DGEBF와 방향족아민 경화제 DDM, DDS 각각을 1:1의 당량비로 혼합하여 동일한 조건으로 경화하였다. 그 결과 에폭시수지 경화물의 특성은 경화제의 벤젠링 사이의 관능기 구조에 따라 매우 큰 영향을 받았다. 즉, 벤젠링 사이에 길이가 길고 bulky한 술폰기를 포함한 DDS는 반응성, 열안정성, 밀도, shrinkage($\%$), 선팽창계수, 인장탄성율. 인장강도, 굴곡탄성율, 굴곡강도의 값이 벤젠링 사이에 메틸기를 가지는 DDM 경화물계 보다 높게 나타났지만, epoxide기의 전환율, 유리전이온도의 값은 낮게 나타냈다. 이것은 술폰기의 강한 전기음성도와 메틸기의 전기 양성적인 repulsive한 성질의 차이에 의한 영향인 것으로 판단된다. 굴곡 파단면의 관찰 결과는 DDS 경화물계의 각개 grain이 불규칙적으로 분포되어 있음을 확연하게 보여준다.