• 한국레이저가공학회지
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• 제17권1호
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• pp.7-12
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• 2014

The dissimilar welding between magnesium alloy and steel sheet was required in automobile industry to increase the strength of the dissimilar joints. Laser brazing is one of the good joining processes for Mg- steel dissimilar joint. In this study, AZ31 magnesium alloy and Zn coated steel dissimilar joint was brazed using diode direct laser with Mg600 filler wire and Superior #21 flux. The wetting of Mg filler wire on Zn coating was very good because of the formation of eutectic phase with low melting temperature. The strength of the brazed joint between AZ31 magnesium alloy and Zn coated steel was 131.3N/mm. The fracture occurred at brazement.

• 한국표면공학회지
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• 제35권1호
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• 한국세라믹학회지
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• 제37권4호
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• pp.332-337
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• 2000

Forming mechanism of fibrous TiC during self-propagating high temperature synthetic reaction was analyzed and suggested. It was revealed that critical temperature for the stable fiber formation was not the melting point of TiC, but the eutectic reaction temperature of TiC and C. Minimum amount of TiC diluent addition required to form fibers was calculated to be 25.6%, which was consistent with the experimental result. Synthesized fibers were found hollow tube-like. The morphology was explained by the diffusion rates of C and Ti in TiC, and by the molar volume chnage of C during the reaction. Expanding shell model was suggested for the hollow fiber formation mechanism.

• 한국기계연구소 소보
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• 통권20호
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• pp.57-63
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• 1990

The morphologies of MC carbides (M stands for metal) and creep-rupture properties in directionally solidified Rene 80 having standard and Hf-modified chemistries were studied. It was found that Hf depressed the melting point, $\gamma$- $\gamma$’ eutectic temperature and $\gamma$’ solvus of nickel-base superalloy Rene 80, but did not depress MC carbide forming temperature. The morphologies of MC carbides depended upon solidification sequence, which led to blocky type in the early stage and script type in the late stage of solidification. Creep failure occurs through the crack initiation at the transverse components of longitudinal grain boundaries or interdendritic carbides in directionally solidified superalloys. It could be concluded MC carbide morphologies played an important role in creep properties of DS superalloys, that is, Hf additions increased the creep ductilities and lives of Rene 80.

• Nuclear Engineering and Technology
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• 제56권1호
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• pp.42-47
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• 2024

The electrochemical extraction of uranium in ternary low melting LiCl-KCl-CsCl eutectic on inert and reactive electrodes via different electrochemical techniques was investigated. It was established that the electrochemical reduction process of U(III) ions on the inert W electrode was irreversible and proceeded in one stage. On reactive liquid Ga and liquid Cd electrodes the reduction of uranium ions took place with the considerable depolarization with the formation of UGa₂, UGa₃ and UCd₁₁ intermetallic compounds. Thermodynamic characteristics of uranium compounds and alloys were calculated. The conditions for the extraction of uranium from the electrolyte in the form of alloys on both liquid reactive electrodes via potentiostatic electrolysis were found.

• 한국산학기술학회논문지
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• 제16권12호
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• pp.8679-8683
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• 2015

세라믹은 고온에서 뛰어난 내마모성, 내부식성을 가지기 때문에 산업적 응용에 있어서 널리 사용된다. 세라믹은 금속과 비교해서 고온에서 더 큰 강도를 가지고 있고, 더 낮은 열전도도 및 열팽창 계수를 가진다. 그러나, 세라믹이 가진 취성의 성질은 전기전자산업과 고온에서의 구조적 적용에의 넓은 적용을 제한한다. Ti 활성금속과 STS304를 IBAD 기술을 이용해서 동시에 증착시켜 STS304 스테인레스강에 $Al_2O_3$(알루미나)의 브레이징 접합강도에 어떤 영향을 미치는지 알아보았으며, 시험편들은 Ti 타겟과 Ti+ STS304 타겟 두 종류를 이용하여 두께를 변화시켜가며 증착하였다. 브레이징 접합을 위한 삽입금속으로는 일반적으로 사용되는 Ag-Cu 공정조성의 합금이 사용되었다. 브레이징 접합품의 강도는 Ag-Cu 삽입금속과 알루미나 사이의 반응층의 두께와 반응 생성물 조직에 의해 결정되며, 본 실험에서는 계면 반응의 메커니즘을 보다 구체화하고 계면 반응에 의한 경사기능성의 접합계면을 더욱 향상시키는 결과를 얻고자 한다.

• Nuclear Engineering and Technology
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• 제35권4호
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• pp.356-368
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• 2003

Material properties such as coolant specific heat, film heat transfer coefficient, cladding thermal conductivity, surface diffusion coefficient of the multi-bubble are improved in MACSIS-Mod1. The axial power and flux profile module was also incorporated with irradiation history. The performance and feasibility of the updated driver fuel pin have been analyzed for nominal parameters based on the conceptual design for the KALIMER breakeven core by MACSIS-MOD1 code. The fuel slug centerline temperature takes the maximum at 700mm from the bottom of the slug in spite of the nearly symmetric axial power distribution. The cladding mid-wall and coolant temperatures take the maximum at the top of the pin. Temperature of the fuel slug surface over the entire irradiation life is much lower than the fuel-clad eutectic reaction temperature. The fission gas release of the driver fuel pin at the end of life is predicted to be $68.61\%$ and plenum pressure is too low to cause cladding yielding. The probability that the fuel pin would fail is estimated to be much less than that allowed in the design criteria. The maximum radial deformation of the fuel pin is $1.93\%$, satisfying the preliminary design criterion ($3\%$) for fuel pin deformation. Therefore the conceptual design parameters of the driver fuel pin for the KALIMER breakeven core are expected to satisfy the preliminary criteria on temperature, fluence limit, deformation limit etc.

• 대한화장품학회지
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• 제48권1호
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• pp.55-64
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• 2022

Cleansing foam이라 불리는 지방산 칼륨 cream soap은 crystal gel 구조로 이루어져 있어 유화계와는 달리 전단응력에 약하며 고온의 보관조건에서 쉽게 분리되는 특성을 보여준다. Crystal gel 구조는 지방산의 종류 및 비율, 중화도, polyol의 종류와 사용량에 따라 크게 영향을 받는다. Crystal gel 구조에 미치는 이들의 영향을 조사하기 위해 water/potassium hydroxide (KOH)/fatty acid ternary system에서 실험을 실시하였다. Differential scanning calorimeter (DSC) 측정 결과 myristic acid (MA) : stearic acid (SA) = 3 : 1 비율에서 공융점(eutectic point)를 갖고 이 혼합비가 가장 안전한 삼성분계(ternary system)를 만든다는 것을 발견했다. 점도 측정과 편광현미경 (POM) 관찰 결과 중화도는 75% 부근이 최적이라고 판단된다. 삼성분계의 melting point (T_m)이 보관온도보다 높을 때, 그리고 crystal phase가 lamellar gel phase로 상 전이가 일어날 때 안정하나 지방산 함량의 증가는 안정성에 거의 영향을 미치지 않는다. 삼성분계에 polyol의 첨가는 T_m을 변화시키고 상전이를 일으키는데 중요한 역할을 한다. 클렌징폼의 구조는 저온 주사전자현미경 (Cryo-SEM), 소각 및 광각 X-선 산란 (SAXS, WAXS) 분석으로 규명하였다. Butylene glycol (BG), propylene glycol (PG), dipropylene glycol (DPG)은 T_m을 낮추어주며 lamellar gel phase 형성을 어렵게 하는 반면 glycerin, PEG-400, sorbitol은 T_m을 상승시키고 lamellar gel phase 형성을 용이하게 하며 안정한 삼성분계를 만든다.

• Journal of Welding and Joining
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• 제18권2호
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• pp.213-213
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• 2000

This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7NO1 spot-welded by pulse Nd: YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed: center line crack($C_{C}$), diagonal crack($C_{D}$), and U shape crack($C_{U}$). Also, HAZ crack($C_{H}$), was observed in the HAZ region, furthermore, mixing crack($C_{M}$), consisting of diagonal crack and HAZ crack was observed.White film was formed at the hot crack region in the fractured surface after it was immersed to 10%NaOH water. In the case of A5083 alloy, white films in C crack and $C_D crack region were composed of low melting phases, Fe₂Si$Al_8$ and eutectic phases, Mg₂Al₃ and Mg₂Si. Such films observed near HAZ crack were also consist of eutectic Mg₂Al₃. In the case of A7N01 alloy, eutectic phases of CuAl₂, $Mg_{32}$ (Al,Zn) ₃, MgZn₂, Al₂CuMg and Mg₂Si were observed in the whitely etched films near $C_{C}$ crack and $C_{D}$ crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Si in the case of A7N01 aooly, respectively.The $C_{D}$ and $C_{C}$ cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of $C_{M}$ crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The $C_{U}$ crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification. (Received October 7, 1999)

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.