• 제목/요약/키워드: etching solution.

검색결과 531건 처리시간 0.027초

Epigallocatechin-3-gallate prior to composite resin in abfraction lesions: a split-mouth randomized clinical trial

  • Luisa Valente Gotardo Lara Alves;Lisiane Martins Fracasso;Thiago Vinicius Cortez;Aline Evangelista Souza-Gabriel;Silmara Aparecida Milori Corona
    • Restorative Dentistry and Endodontics
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    • 제48권2호
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    • pp.13.1-13.11
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    • 2023
  • Objectives: Natural extracts have been investigated as a biomimetic strategy to mechanically strengthen the collagen network and control the biodegradation of extracellular matrix. This study evaluated the effect of epigallocatechin-3-gallate (EGCG) on abfraction lesions prior to the composite resin. Materials and Methods: The sample consisted of 30 patients (aged between 28 and 60 years) with abfraction lesions located in 2 homologous premolars. The teeth were randomly assigned according to dentin treatment: 0.02% EGCG solution or distilled water (control). After enamel acid etching, the solutions were applied immediately for 1 minute. The teeth were restored with Universal Adhesive (3M) and Filtek Z350 XT (3M). Analyzes were done by 2 independent examiners using modified USPHS (retention, secondary caries, marginal adaptation, and postoperative sensitivity) and photographic (color, marginal pigmentation, and anatomical form) criteria at baseline (7 days) and final (18 months). The data analysis used Friedman and Wilcoxon signed-rank tests (α = 0.05). Results: At baseline, all restorations were evaluated as alpha for all criteria. After 18 months, restorations were evaluated as alpha for secondary caries, color, and marginal pigmentation. There was significant difference between baseline and 18 months (p = 0.009) for marginal adaptation and postoperative sensitivity (p = 0.029), but no significant difference were verified between treatments (p = 0.433). The EGCG group had a restoration retention rate of 93.3%, while the control group had 96.7%. Conclusions: The application of EGCG solution on abfraction lesions did not significantly influence the survival of the restorations based on clinical and photographic criteria.

Shear Bond Strength and Microleakage of a New Self-etch Sealant Containing S-PRG filler (S-PRG 필러를 포함하는 치면열구전색제의 전단결합강도 및 미세누출)

  • An, Jinseon;Lee, Juhyun;Seo, Hyunwoo;Park, Howon
    • Journal of the korean academy of Pediatric Dentistry
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    • 제43권4호
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    • pp.347-353
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    • 2016
  • The purpose of this study was to evaluate shear bond strength and microleakage of a new self-etch fissure sealant containing S-PRG filler (BeautiSealant). Fourty-five premolars were randomly divided into three groups: SEPBS group (Self-etching primer + BeautiSealant), AEBS group (Phosphoric acid etching + BeautiSealant), AECP group (Phosphoric acid etching + $Clinpro^{TM}$ sealant). For the shear bond strength test, microcylinders of fissure sealant were bonded to prepared buccal surfaces of teeth and shear bond strengths were measured by a universal testing machine. For the microleakage test, sealants were applicated on each occlusal fissure of teeth. All teeth surface were coated with finger nail varnish, with the exception of a 1.0 mm window around the sealant margins. The teeth were immersed in 2% methylene blue solution for 24 hours and then rinsed in water. The teeth were then embedded in resin and cut buccolingually along the tooth axis and observed with a stereomicroscope to determine the degree of microleakage. SEPBS group demonstrated lower bond strength in comparison with that of AEBS and AECP groups (p < 0.05). However, no significant differences were observed between AEBS and AECP groups. There was no statistically significant difference in degree of microleakage among three groups.

Dependence of the Diamond Coating Adhesion on the Microstructure of WC-Co Substrates (WC-Co계 미세조직에 따른 CVD 다이아몬드 코팅막의 접착력 변화)

  • Lee, Dong-Beum;Chae, Ki-Woong
    • Journal of the Korean Ceramic Society
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    • 제41권10호
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    • pp.728-734
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    • 2004
  • The effect of microstructure of WC-Co substrates which have different WC grain sizes from submicron to 5 $\mu$m on the diamond-substrate adhesion strength was investigated. The substrates were pre-treated by two methods : chemical etching with Murakami's solution and subsequently with $H_2SO_4$, and thermal heat-treatment. The adhesion strength was estimated by degree of peeling after Rockwell indentation. Diamond films of 20 $\mu$m thickness deposited on the heat-treated substrates showed an excellent adhesion strength at the load of 100 kg, which ascribed to the large and elongated WC grains. However, the cutting edge of insert was deformed after heat treatment and the surface morphology of heat treated substrate strongly affected on the surface roughness of the deposited diamond films. On the contrary, the diamond film of 10 $\mu$m in thickness on the chemically etched substrates of average WC grain size over 2 $\mu$m showed good adhesion strength enough not to peel-off under a load of 60 kg. Especially, the substrate of average WC grain size over 5 $\mu$m exhibited much improved reliability of adhesion comparing with the substrate of average grain size under 2 $\mu$m. No substrate deformation was observed in this case after the chemical etching, which is more advantageous and more practical in terms of precious machining than the heat treatment case.

MICROLEAKAGE AND MARGINAL HYBRID LAYER OF DENTIN ADHESIVES (상아질 접착제의 미세누출과 변연부 혼화층)

  • Cho, Young-Gon;Kim, Young-Kwan;Ahn, Jong-Mo
    • Restorative Dentistry and Endodontics
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    • 제27권1호
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    • pp.34-43
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    • 2002
  • The purpose of this study was to compare microleakage and marginal hybrid layer in class V restorations using two one-bottle adhesives and one self-etching adhesive. Class V cavity preparations with occlusal margins in enamel and gingival margins in dentin were pre-pared on buccal and lingual surfaces of 30 extracted human molar teeth. Prepared teeth were randomly divided into three treatment groups (n=30) and restored with three adhesives and composites: Single Bond/Filtek Z-250 (Group 1), Prime&BondNT/Esthet.X (Group 2), UniFil Bond/UniFil F (Group 3). For microleakage, samples were stored in room temperature water for 24 hours, thermocycled stained with 2% methylene blue dye, sectioned into halves, scored and analysed using Mann-whitney test and Wilcoxon signed rank sum test. For marginal hybrid layer, samples were sectioned into halves, treated with 10% phosphoric acid for 5 seconds, stored in 5% NaOCL solution for 24 hours, dried and gold coated. Occlusal and gingival margins of each sample were inspected under SEM. The results of this study were as follows ; 1. Microleakage at the occlusal margins was not evident in group 1 and group 2, but it showed in group 3 (p<0.05). 2. Microleakage in group 1 and group 3 was significantly lower than in group 2 at gingival margins (p<0.05). 3. Microleakage at gingival margins was greater than at occlusal margins in group 1 and group 2, but microleakage at occlusal margins was greater than at gingival margins in group 3 (p<0.05). 4. In group 1 and group 2, no gaps at occlusal margins showed. But gaps showed in group 3. Occlusal margins were free from a hybrid layer in all groups 5. The thickness of the marginal hybrid layers was 2.5~5 $\mu\textrm{m}$ thick in group 5 $\mu\textrm{m}$ thick in group 2 and 1.5 $\mu\textrm{m}$ thick in group 3. 6 There was no corelation between microleakage and thickness of marginal hybrid layer. In coclusion, the effect of dentin adhesives on microleakge in class V composite restorations was excellent when one-bottle adhesives were applied on enamel margin, and it was good when a self-etching adhesive was applied on dentinal margin. There was no corelation between microleakage and thickness of marginal hybrid layer.

Wet-etching Properties of GaAs Using $NH_4OH-H_2O_2-H_2O$ Mixed Solution and Its Application to Fabrication Method for Released GaAs Microstructures with Rectangular Cross Section ($NH_4OH-H_2O_2-H_2O$ 혼합액을 이용한 GaAS의 습식식각 특성 연구 및 이를 이용한 부유된 사각형 단면을 가지는 GaAs 미세구조물의 제작 방법)

  • Kim, Jong-Pal;Park, Sang-Jun;Paik, Seung-Joon;Kim, Se-Tae;Koo, Chi-Wan;Lee, Seung-Ki;Cho, dong-Il
    • Journal of Sensor Science and Technology
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    • 제10권5호
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    • pp.304-313
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    • 2001
  • In this research, we investigate wet-etching properties of GaAs in $NH_4OH-H_2O_2-H_2O$, and develop the fabrication method of GaAs microstructures with rectangular cross section using (001) GaAs substrate. For obtaining wet-etching properties with respect to crystallographic orientation, the etch rates and cross-section etch profiles of (001) GaAs with 16 different compositions and the undercut rates with 5 different compositions are measured using $NH_4OH-H_2O_2-H_2O$ mixed solutions. From these experimental data, a new GaAs micromachining method in bulk (001) GaAs is proposed, and used to fabricate a released microbridges with a rectangular cross section. The developed GaAs micromachining method can be very useful for low-loss, highly-tunable capacitors for RF components and for integration with GaAs optical components.

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Formation of lotus surface structure for high efficiency silicon solar cell (고효율 실리콘 태양전지를 위한 lotus surface 구조의 형성)

  • Jung, Hyun-Chul;Paek, Yeong-Kyeun;Kim, Hyo-Han;Eum, Jung-Hyun;Choi, Kyoon;Kim, Hyung-Tae;Chang, Hyo-Sik
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • 제20권1호
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    • pp.7-11
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    • 2010
  • The reduction of optical losses in mono-crystalline silicon solar cell by surface texturing is a critical step to improve the overall cell efficiency. In this study, we have changed the sub-micrometer structure on the micrometer pyramidal structure by 2-step texturing. The Ag particles were coated on the micrometer pyramid surface in $AgNO_3$ solution, and then the etching with hydrogen fluoride and hydrogen peroxide created even smaller nano-pyramids in these pyramids. As a result, we observed that the changes of size and thickness of nano structure on pyramidal surface were determined by $AgNO_3$ concentration and etching time. Using 2-step texturing, the surface of wafers is etched to resemble the rough surface of a lotus leaf. Lotus surface can reduce average reflectance from 10% to below 3%. This reflectance is less than conventional textured wafer including anti-reflection coating.

THE EFFECT OF VARIOUS SURFACE TREATMENT METHODS ON THE OSSEOINTEGRATION (임플랜트의 표면처리 방법이 골유착에 미치는 영향에 관한 연구)

  • Choi Jeong-Won;Kim Kwang-Nam;Heo Seong-Joo;Chang Ik-Tae;Han Chong-Hyun;Baek Hong-Gu;Choi Yong-Chang;Wennerberg Ann
    • The Journal of Korean Academy of Prosthodontics
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    • 제39권1호
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    • pp.71-83
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    • 2001
  • The purpose of this study was to compare the effects of various surface treatments by measuring removal torque on bone healing around titanium implants. 40 Screw-shaped cp titanium implants with length of 4mm, outer diameter of 3.75mm, and pitch-height of 0.5mm were used Group 1 was left as machined(control), Group 2 was blasted with $50{\mu}m\;Al_2O_3$, group 3 was blasted and etched in etching solution($NH_4OH : H_2O_2:H_2O= 1 : 1 : 5$) at $90^{\circ}C$ for 1 minute group 4 was blasted and oxidated under pure oxygen at $800^{\circ}C$. The implant surface roughness was analyzed with SEM and CLSM(Confocal Laser Scanning Microscope) and implants were placed in proximal tibial metaphysis of 10 New Zealand White rabbits. After 3 months of healing period, removal torque of each implant was measured to compare bone healing around implant. The results obtained were as follows 1. In SEM view, blasting increased the roughness of the surface, but etching of that rough surface decreased the roughness due to the removal of the tip of the peak. Oxidation also decreased the roughness due to formation of needle-like oxide grains on the implant surface. 2. The Sa value from CLSM was least in the machined group($0.47{\mu}m$), greatest in blasted group($1.25{\mu}m$), and the value decreased after etching($0.91{\mu}m$) and oxidation($0.94{\mu}m$). 3. The removal torque of etched group(24.5Ncm) was greater than that of machined group(16.7Ncm) (P<0.05), and was greatest in the oxidated group(40.3Ncm) and the blasted group(34.7Ncm).

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EFFECT OF MICROLEAKAGE OF A SELF-ETCHING PRIMER ADHESIVE ACCORDING TO TYPES OF CUTTING INSTRUMENTS (삭제기구가 자가 산부식 접착제의 미세누출에 미치는 영향)

  • Kim, Yong-Hee;Park, Jae-Gu;Cho, Young-Gon
    • Restorative Dentistry and Endodontics
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    • 제32권4호
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    • pp.327-334
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    • 2007
  • The purpose of this study was to evaluate the effect of burs on microleakage of Class V resin restorations when a self-etching primer adhesive was used. Forty Class V cavities were prepared with four different cutting burs on extracted third molars, and divided into one of four equal groups (n = 10); Group 1-plain cut carbide bur (no. 245), Group 2-cross cut carbide bur (no. 557), Group 3-fine diamond bur (TF-21F), Group 4-standard diamond bur (EX-41). The occlusal and gingival margin of cavities was located in enamel and dentin, respectively. Cavities were treated with Clearfil SE Bond and restored with Clearfil AP-X. Specimens were thermocycled, immersed in a 2% methylene blue solution for 24 hours, and bisected longitudinally. They were observed leakages at enamel and dentinal margins. Data were analyzed using Mann-Whitney and Wilcoxon signed ranked test. The results of this study were as follows; 1. At enamel margin, microleakage of group 4 was statistically higher than those of group 1, 2 and 3 (p < 0.01). 2. At dentinal margin, microleakage of group 4 was statistically higher than group 3 (p < 0.01), but group 1 and 2 were not statistically different with group 3 and 4. 3. Enamel microleakage was statistically higher than dentinal microleakage in group 1, 2 and 3 (p < 0.05), but statistical difference between the microleakage of enamel and dentinal margin was not in Group 4. In conclusion, the use of coarse diamond bur showed high microleakage at both enamel and dentinal margin when Clearfil SE Bond was used in class V cavity.

All Solution processed BiVO4/WO3/SnO2 Heterojunction Photoanode for Enhanced Photoelectrochemical Water Splitting

  • Baek, Ji Hyun;Lee, Dong Geon;Jin, Young Un;Han, Man Hyung;Kim, Won Bin;Cho, In Sun;Jung, Hyun Suk
    • Proceedings of the Korean Vacuum Society Conference
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.417-417
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    • 2016
  • Global environmental deterioration has become more serious year by year and thus scientific interests in the renewable energy as environmental technology and replacement of fossil fuels have grown exponentially. Photoelectrochemical (PEC) cell consisting of semiconductor photoelectrodes that can harvest light and use this energy directly to split water, also known as photoelectrolysis or solar water splitting, is a promising renewable energy technology to produce hydrogen for uses in the future hydrogen economy. A major advantage of PEC systems is that they involve relatively simple processes steps as compared to many other H2 production systems. Until now, a number of materials including TiO2, WO3, Fe2O3, and BiVO4 were exploited as the photoelectrode. However, the PEC performance of these single absorber materials is limited due to their large charge recombinations in bulk, interface and surface, leading low charge separation/transport efficiencies. Recently, coupling of two materials, e.g., BiVO4/WO3, Fe2O3/WO3 and CuWO4/WO3, to form a type II heterojunction has been demonstrated to be a viable means to improve the PEC performance by enhancing the charge separation and transport efficiencies. In this study, we have prepared a triple-layer heterojunction BiVO4/WO3/SnO2 photoelectrode that shows a comparable PEC performance with previously reported best-performing nanostructured BiVO4/WO3 heterojunction photoelectrode via a facile solution method. Interestingly, we found that the incorporation of SnO2 nanoparticles layer in between WO3 and FTO largely promotes electron transport and thus minimizes interfacial recombination. The impact of the SnO2 interfacial layer was investigated in detail by TEM, hall measurement and electrochemical impedance spectroscopy (EIS) techniques. In addition, our planar-structured triple-layer photoelectrode shows a relatively high transmittance due to its low thickness (~300 nm), which benefits to couple with a solar cell to form a tandem PEC device. The overall PEC performance, especially the photocurrent onset potential (Vonset), were further improved by a reactive-ion etching (RIE) surface etching and electrocatalyst (CoOx) deposition.

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A New HF/$NH_4F$/Glycerine Aqueous Solution for Protection of Al Layers During Sacrificial Etching of PSG Films (PSG 희생층 식각시 Al층을 보호하기 위한 새로운 HF/$NH_4F$/Glycerine 혼합 식각액)

  • Kim, Sung-Un;Paik, Seung-Joon;Kim, Im-Jung;Lee, Seung-Ki;Cho, Dong-Il
    • Journal of Sensor Science and Technology
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    • 제8권5호
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    • pp.414-420
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    • 1999
  • The oxide sacrificial layer technology is one of the key technologies in surface micromachining. However, the commonly used aqueous HF solutions, including the $NH_4F$ buffered HF solutions (BHF), are known to attack the Al metal layers during the oxide sacrificial etch. A mixed $NH_4F$/HF/glycerine aqueous solution of 4:1:2 ratio is known to have the best etch selectivity between oxide and AI, but even this sacrificial etchant has a significant etch rate for AI. This paper reports an extensive experimental study on various concentration ratios for HF, $NH_4F$ and glycerine, and develops the optimal mixture ratio for sacrificial etching. At the $NH_4F$/HF/glycerine ratio of 2:1:4, the etch selectivity between PSG and Al improves by approximately 6 times over the previously known best selectivity, to a value of 7,700. At this condition, the measured etch rate of PSG film is approximately $2.1\;{\mu}m/min$, which is sufficiently fast. The developed sacrificial etchant allows the addition of a Al metal layer in surface micromachining, without the worry of Al layer erosion during sacrificial etch.

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